On July 9, 2025, a compelling session at DACtv by Vishal Moondrha of Perfroce addressed a critical challenge in the semiconductor industry: building trust in AI-generated code. The speaker highlighted the unique hurdles of integrating generative AI into semiconductor design, emphasizing issues like data provenance, quality,… Read More





CEO Interview with Andrew Skafel of Edgewater Wireless
As the demand for high-capacity, low-latency wireless networks explodes across residential, enterprise, and industrial environments, a Canadian innovator is quietly reshaping the way Wi-Fi works—from the silicon up. Edgewater Wireless (TSXV:YFI/OTC:KPIFF), headquartered in Ottawa, is pioneering a transformative… Read More
Microsoft Discovery Platform: Revolutionizing Chip Design and Scientific Research
At a recent conference session on July 9, 2025, Prashant Varshney, head of the Silicon and Physics Industry Vertical for Microsoft’s Discovery and Quantum Division, unveiled the transformative potential of the Microsoft Discovery Platform. This innovative platform, announced at Microsoft’s Build event, aims to redefine… Read More
CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.
While there are both software and hardware… Read More
Architecting Your Next SoC: Join the Live Discussion on Tradeoffs, IP, and Ecosystem Realities
Designing a system-on-chip (SoC) has never been more complex—or more critical. With accelerating demands across AI, automotive, and high-performance compute applications, today’s SoC architects face a series of high-stakes tradeoffs from the very beginning. Decisions made during the earliest phases of design—regarding… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
How Channel Operating Margin (COM) Came to be and Why It Endures
According to a recent whitepaper by Samtec, Channel Operating Margin (COM) didn’t start as an algorithm; it started as a truce. In the late 2000s and early 2010s, interconnect designers and SerDes architects were speaking past each other. The former optimized insertion loss, return loss, and crosstalk against frequency-domain… Read More
Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.
Dan explores… Read More
Prompt Engineering for Security: Innovation in Verification
We have a shortage of reference designs to test detection of security vulnerabilities. An LLM-based method demonstrates how to fix that problem with structured prompt engineering. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More
Calibre Vision AI at #62DAC
Calibre is a well-known EDA tool from Siemens that is used for physical verification, but I didn’t really know how AI technology was being used, so I attended a Tuesday session at #62DAC to get up to speed. Priyank Jain, Calibre Product Management presented slides and finished up with a Q&A session.
In the semiconductor world… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet