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AI-Powered Waveform Debugging: Revolutionizing Semiconductor Verification

AI-Powered Waveform Debugging: Revolutionizing Semiconductor Verification
by Admin on 08-01-2025 at 9:00 am

DAC 62 Systems on Chips

On July 9, 2025, a DACtv session with Zackary Glazewski of ChipAgents AI introduced Waveform Agents, an AI-driven solution by Chip Agents designed to tackle the complex challenge of waveform debugging in semiconductor design. The speaker highlighted the difficulties of traditional waveform debugging and demonstrated how… Read More


AI-Driven Verification: Transforming Semiconductor Design

AI-Driven Verification: Transforming Semiconductor Design
by Admin on 08-01-2025 at 8:00 am

DAC 62 Systems on Chips

In a DACtv session on July 9, 2025, Abhi Kolpekwar, Vice-President & General Manager at Siemens EDA, illuminated the transformative role of artificial intelligence (AI) in addressing the escalating challenges of semiconductor design verification. The presentation underscored the limitations of traditional methods… Read More


Building Trust in AI-Generated Code for Semiconductor Design

Building Trust in AI-Generated Code for Semiconductor Design
by Admin on 08-01-2025 at 7:00 am

On July 9, 2025, a compelling session at DACtv by Vishal Moondrha of Perfroce addressed a critical challenge in the semiconductor industry: building trust in AI-generated code. The speaker highlighted the unique hurdles of integrating generative AI into semiconductor design, emphasizing issues like data provenance, quality,… Read More


CEO Interview with Andrew Skafel of Edgewater Wireless

CEO Interview with Andrew Skafel of Edgewater Wireless
by Daniel Nenni on 08-01-2025 at 6:00 am

Skafel pic

As the demand for high-capacity, low-latency wireless networks explodes across residential, enterprise, and industrial environments, a Canadian innovator is quietly reshaping the way Wi-Fi works—from the silicon up. Edgewater Wireless (TSXV:YFI/OTC:KPIFF), headquartered in Ottawa, is pioneering a transformative… Read More


Microsoft Discovery Platform: Revolutionizing Chip Design and Scientific Research

Microsoft Discovery Platform: Revolutionizing Chip Design and Scientific Research
by Admin on 08-01-2025 at 6:00 am

DAC 62 Systems on Chips

At a recent conference session on July 9, 2025, Prashant Varshney, head of the Silicon and Physics Industry Vertical for Microsoft’s Discovery and Quantum Division, unveiled the transformative potential of the Microsoft Discovery Platform. This innovative platform, announced at Microsoft’s Build event, aims to redefine… Read More


CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
by Mike Gianfagna on 07-31-2025 at 10:00 am

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.

While there are both software and hardware… Read More


Architecting Your Next SoC: Join the Live Discussion on Tradeoffs, IP, and Ecosystem Realities

Architecting Your Next SoC: Join the Live Discussion on Tradeoffs, IP, and Ecosystem Realities
by Daniel Nenni on 07-31-2025 at 8:00 am

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Designing a system-on-chip (SoC) has never been more complex—or more critical. With accelerating demands across AI, automotive, and high-performance compute applications, today’s SoC architects face a series of high-stakes tradeoffs from the very beginning. Decisions made during the earliest phases of design—regarding… Read More


cHBM for AI: Capabilities, Challenges, and Opportunities

cHBM for AI: Capabilities, Challenges, and Opportunities
by Kalar Rajendiran on 07-31-2025 at 6:00 am

cHBM Panelists at Synopsys Executive Forum

AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More


How Channel Operating Margin (COM) Came to be and Why It Endures

How Channel Operating Margin (COM) Came to be and Why It Endures
by Admin on 07-30-2025 at 10:00 am

Samtec Eye Diagram

According to a recent whitepaper by Samtec, Channel Operating Margin (COM) didn’t start as an algorithm; it started as a truce. In the late 2000s and early 2010s, interconnect designers and SerDes architects were speaking past each other. The former optimized insertion loss, return loss, and crosstalk against frequency-domain… Read More


Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani

Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
by Daniel Nenni on 07-30-2025 at 10:00 am

Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.

Dan explores… Read More