About Bio-IT World Conference & Expo Bio-IT World Conference & Expo is the premier global event showcasing technologies and analytic approaches that solve problems, accelerate science, and drive the future of precision medicine. By uniting a community of experts in life sciences, pharmaceuticals, clinical research, healthcare, informatics, and technology, the event pushes the boundaries of …
Learn about the revolutionary AI-driven electromagnetic-aware methodology of Ansys that automates the optimization of the floor plan of analog and RF physical layouts. DATE / TIME: April 2, 2025 9 AM EDT / 3 PM CEST Overview Analog/RF IC design has been traditionally considered an art – sometimes even a “black art” – because, contrary …
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About the Event The 5th ICA Summit 2025 is a premier international conference and exhibition in Autonomous and Connected Mobility. With a successful track record in Munich and Frankfurt, our event has grown significantly since 2021, and we are thrilled to announce our 5th edition in Frankfurt. Join industry experts to hear the frontline industry conversations – Innovative, Connected, and …
Today’s AI designs stress verification teams to an unprecedented extent. The compound complexity from software, hardware, interfaces, and architecture options leads to the challenge of running quadrillions of verification cycles across IP, sub-systems, SoCs, and Multi-die designs. Learn how leaders from AMD, Arm, Nvidia, and others address these challenges with Synopsys’ latest family of Hardware-Assisted …
Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
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Join us to get the latest on: TSMC's industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low …
