Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities

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For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications.

This technology presents unique challenges and new promises for next-generation IC packaging, leading to a significant increase in patent filings. Intel is expanding its patent portfolio, and new players are entering the field, with more semiconductor companies showing interest in glass integration for advanced semiconductor packaging.

Which companies are driving the adoption of glass materials in advanced packaging?  This webinar will provide insights into patenting trends for glass interposers and glass core substrates, emphasizing the IP leadership of major players and reviewing recent patented technologies.

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Pauline Calka

Patent analyst

KnowMade

Pauline works at KnowMade as a patent analyst in the fields of semiconductor manufacturing and advanced packaging. She holds a PhD in Memory from the University of Grenoble Alpes, France, in partnership with the CEA-Leti. After an Alexander von Humboldt Postdoc Fellowship position at the Technical University of Berlin, Germany, and the Leibniz Institute for High Performance Microelectronics focusing on ReRAM development, Pauline spent five years at ASM International, Belgium, as Senior Process Engineer on thin film development for logic, memory and MEMS. Following this, she worked for two years at CEA-Leti, France, as Integration Engineer, specializing in imaging CMOS sensors.

Contact: pauline.calka@knowmade.fr

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