Seminar: Overview of Semiconductor Manufacturing
February 2, 2027 - February 3, 2027
Course Overview
The purpose of this course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.
What the Course Covers
Basic Electronics and Microelectronics
- Definition of basic electronic terms and concepts
- Overview of microelectronics and the role of integrated circuits
- Process nodes and their relation to device performance and cost
Device Physics and Transistor Technologies
- Device physics and transistor operation
- Understanding physical principles behind device operation
- FDSOI, FinFets, Gate All Around (GAA) Transistors
- Advanced transistor technologies and their impact on performance
Crystal Growth and Wafer Preparation
- Overview of crystal growth techniques
- Wafer preparation techniques and materials
- Silicon substrate specifications and quality
Circuit Design and Layout
- Circuit design and layout techniques
- Tools used in semiconductor manufacturing
- Mask making techniques and materials used in lithography
Wafer Processing and Clean Rooms
- Clean room environments and their importance
- Contamination control and safety protocols
- Wafer handling and processing procedures
Lithographic Techniques
- DUV (Deep Ultraviolet) lithography
- Immersion lithography
- EUV (Extreme Ultraviolet) lithography
- Pattern transfer and resolution enhancement
Etching and Processing
- Plasma and wet etch processes
- Cleaning processes and contamination removal
- Ion implantation techniques and device fabrication
- Diffusion techniques
Deposition and Advanced Processes
- RTP (Rapid Thermal Processing)
- CVD (Chemical Vapor Deposition)
- ALD (Atomic Layer Deposition)
- ALE (Atomic Layer Etching) techniques
- Electroplating and sputtering
Testing, Assembly, and Packaging
- Testing methodologies and quality control
- Wire bonding techniques
- Packaging techniques: stacking die, flip chip, chiplets
- WLP (Wafer Level Packaging)
- Metrology tools and applications
Industry Ecosystem
- Major players in the semiconductor ecosystem
- Supply chain and market dynamics
- Industry trends and future outlook
Who Should Attend
Anyone wanting an understanding of semiconductor manufacturing, including new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.
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