CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis

A “PCB thermal analysis” design activity has traditionally involved the PCB designer transferring a finished design to a dedicated thermal analysis tool. While this has indeed successfully contributed to numerous PCB thermal signoffs in the past, there are inefficiencies that can be mitigated with the use of Cadence’s Allegro X Design Platform for PCBs and Celsius Studio Platform thermal AI analysis integrated flow for package and PCB design.

This webinar will discuss several important issues that PCB designers face and the ways in which the Cadence Allegro/Celsius workflow can help streamline the design process. This workflow enables designers to provide better designs across the design cycle to the thermal engineers, who can, in turn, spend more time focusing on thermal solutions rather than running many time-consuming simulations.

It is essential to have valid thermal results before a PCB design is complete. These early-stage thermal results involve continuous data transfer and communication between design, thermal, and possibly also signal integrity/power integrity (SI/PI) teams. A delay at any stage of this process could mean issues for the design cycle.

With a complete/semi-complete design, each thermal analysis tool takes engineers through their own uniquely laborious approach to convert the PCB design to a “thermal model.” This requires considerable user effort, resulting in a significant time investment when multiple designs must be analyzed.

With Cadence’s true first-to-market thermal in-design analysis (IDA) workflow inside their PCB design platform, engineers have a significant opportunity to run their designs through floor planning and design changes without having to wait for feedback from across the board, leading to more efficient design cycles and more effective designs.

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