Pragmatic at the 2024 Design Automation Conference

Pragmatic is pioneering a fundamental shift in semiconductor technology, delivering lower-cost, lower-carbon intelligence to power the Internet of Everything. Its FlexIC – flexible integrated circuit – technology delivers connect, sense and compute capabilities at a fraction of the cost and carbon footprint of silicon chips.

The FlexIC Foundry® enables rapid, high-volume fabrication with a high level of customisation, taking designs from tape-out to delivery in just weeks. The unique, low-temperature processes consume less energy and water, with fewer harmful chemicals, making Pragmatic one of the most sustainable semiconductor manufacturers in the world.

This year, Pragmatic Semiconductor will be setting up stall at the Design Automation Conference (DAC) for the first time.

Visit stand 1534 to discover their new, industry-standard 300mm wafers, as well as demos including:

• PlasticARM
  The groundbreaking ultra-minimalist Cortex-M0-based SoC boasting 128 bytes of RAM and 456 bytes of ROM – 12x more complex than previous state-of-the-art flexible electronics
• Electronic nose
  The world’s first machine-learning-based flexible mixed-signal chip, integrated with a flexible electronic nose sensor array.
• Temperature sensors
  A selection of Flex-IC based sensors in a thin, flexible form factor:
  • Standalone temperature sensor
    A discrete linear PTC temperature sensor, supporting a wide operating window
  • I2C temperature sensor
    Integrated analogue front-end and digital I2C temperature readout, enabling wide-array sense capability
  • Temperature sensor with heating element and control logic
    Fully integrated heater FlexIC with on-chip sensor, control logic and heating elements
• NFC products
  For applications including consumer engagement, authentication and tamper detection

About Pragmatic

Pragmatic has developed an integrated circuit (electronic ‘chip’) platform that doesn’t rely on silicon. Our revolutionary technology uses thin-film semiconductors to create flexible integrated circuits that are thinner than a human hair and are significantly cheaper and faster to produce than silicon chips. This provides a compelling alternative for many mainstream electronics applications, as well as enabling new applications not possible with silicon.

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