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CEO Interview: Yogish Kode of Glide Systems

CEO Interview: Yogish Kode of Glide Systems
by Daniel Nenni on 08-09-2024 at 6:00 am

Yogish Kode is a senior solutions architect with substantial experience in product lifecycle management for over 20 years. His focus has been on semiconductor PLM and IP management. Prior to founding Glide Systems, he was a global solutions architect at Dassault Systèmes, an IT lead at Xilinx, and a senior programmer/analyst at SDRC (now part of Siemens).

Yogish Kode Glide Systems
Yogish Kode

Yogish has a passion for product lifecycle management and the impact that an optimized solution can have on the enterprise.

He holds a Professional Certificate in architecture and systems engineering from MIT xPRO and a Master’s Degree in industrial engineering with a minor in computer science from the University of Minnesota.

Tell us about your company

Glide Systems specializes in advanced lifecycle management solutions, optimizing product development from inception to disposal with our cloud-native platform, Glide SysLM. Our adaptive data modeling capabilities and seamless integration of hardware, electrical, electronics, and software domains ensure robust traceability and efficient data flow throughout the product lifecycle.

The key features of Glide SysLM include a comprehensive, cloud-native solution integrating all phases of the product lifecycle. Thanks to our unified platform for hardware, electrical, electronics, and software domains we can deliver a seamless data flow. Our adaptive data modeling capabilities facilitate dynamic alignment with business needs and industry standards.

The bottom line is we reduce implementation costs by 30% to 50%, accelerate time-to-market, and enhance operational efficiencies, delivering substantial cost savings and faster product launches for our customers.

What problems are you solving?

Global manufacturing companies struggle to adopt digital solutions because of siloed enterprise applications and a lack of industry-specific solutions for product design data management. This usually results in extensive customization of generic products.

During my years of implementing PLM solutions, I observed many acute performance and usability issues. The lack of industry specific data platforms required companies to purchase off-the-shelf solutions and customize, resulting in huge consulting, services, and upgrade costs. The effort involved to develop an effective, integrated solution was far too time-consuming and costly.

I felt there was a better way, and that led me to try a new approach with a major semiconductor company. The new approach was successful with enhanced productivity, so I formed Glide Systems to productize the strategies I had uncovered and make the technology broadly available.

What application areas are your strongest?

Our initial focus is the semiconductor industry. The current product is optimized for the unique challenges of semiconductor design – things like IP lifecycle management, operations BOM management and implementation of a digital thread.

Our semiconductor IP management solution addresses IP catalog, managing hierarchical IP bill of material, versioning, hierarchical defect management, and impact analysis. Our performant hierarchical defect management and rollups features are crucial for effectively dispositioning defects against a system-on-chip before tapeout, providing engineers with rapid, comprehensive information and an intuitive UI that enhances both performance and usability, streamlining the debugging process and accelerating time-to-market.

Our operations bill of material solution enables seamless management of the entire process from raw wafer to the finished chip, ensuring compliance with the supplier network and supplier qualifications.

Different teams often use disparate tools, leading to siloed data and fragmented workflows. For example, requirements might be managed in Jama, user stories in Jira, test cases in Verisium, source code control in GitHub, GitLab, or Subversion, and issue management in Jira. Despite these tools being semantically connected, their isolated nature can complicate traceability and integration. Our platform addresses this challenge by seamlessly integrating any application with REST APIs within 2-3 weeks, rather than several months. This integration provides comprehensive traceability across all applications, ensuring cohesive and efficient project management.  

The core technology can be applied to many markets and processes. Going forward, we will diversify into markets such as medical devices, automotive, and aerospace.

What keeps your customers up at night?

In a word, visibility. Disparate enterprise applications lead to fragmented data, inefficiencies, and increased operational costs due to the lack of integration and seamless data flow across departments. The lack of enterprise-wide visibility for complex product development projects can cause substantial time delays, cost overruns and even result in ineffective products.

There is also a growing list of standards that products must adhere to. ISO26262 in the automotive industry is just one example. Tracking and documenting compliance with these standards becomes another major challenge.

Let me cite just two examples from 2022 Functional Verification Study, published by Wilson Research Group and Siemens EDA:

  • 66 percent of ASIC projects are behind schedule, with 27% behind by 30% or more.
  • 76% of ASICs require two or more respins.

What does the competitive landscape look like and how do you differentiate?

Large public companies offer broad, generic and costly solutions that do not integrate well with the complex electronic system flow. In this context, one size does not fit all. Smaller companies focus more on the problem at hand. These organizations offer solutions for semiconductor design, but they tend to be very limited in scope.

So, the options are either invest time and consulting money to attempt to integrate broad-based solutions into the electronic system flow or purchase multiple products from more narrowly focused companies and again attempt to integrate the collection of tools into the electronic system flow.

Glide SysLM offers an out-of-the-box solution that integrates with all phases of the electronic system flow, so all requirements are covered. And thanks to our no-code technology, fine-tuning the application to the specific needs of each customer can be done quickly and easily.

What new features/technology are you working on?

We have plans to enhance the current release across three major axes:

  • Unified Product Data Ecosystem: Seamlessly integrate with a growing list of industrial IoT devices, systems, and enterprise applications.
  • Sustainability: Track carbon footprint, resource usage, material compliance. Manage recycling, reusability, and end-of-life strategies.
  • Advanced Analytics and AI: Leverage advanced analytics, machine learning, and AI to derive actionable insights from vast amounts of lifecycle data.

How do customers normally engage with your company?

You can reach us at sales@glidesystemsinc.com. You can also contact us and request a demo through our website at https://www.glidesystemsinc.com/#contact-us.

Also Read:

CEO Interview: Orr Danon of Hailo

CEO Interview: David Heard of Infinera

CEO Interview: Dr. Matthew Putman of Nanotronics

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