Design IP revenues had achieved $7.04B in 2023, with disparity between license, growing by 14% and royalty decreasing by 6%, and main categories. Processor (CPU, DSP, GPU & ISP) slightly growing by 3.4% when Physical (SRAM Memory Compiler, Flash Memory Compiler, Library and I/O, AMS, Wireless Interface) slightly decreasing… Read More
Silicon Catalyst partners with Arm to launch the Arm Flexible Access for Startups Contest!
Winner and Runner-up to receive the contest’s largest ever technology credit for production tape-outs.
This is an example of why I enjoy working with Silicon Catalyst. They collaborate with our partners and do some really impressive things, all for the greater good of the semiconductor industry, absolutely. If you are not currently… Read More
ASML moving to U.S.- Nvidia to change name to AISi & acquire PSI Quantum
- Nvidia changing name to AISi (AI silicon) reflecting business focus
- Nvidia to buy PSI Quantum to combine AI & quantum efforts
- ASML to move to U.S. to reduce China & employee restrictions
- New Japanese consortia firms join Rapidus & IBM fab team
Nvidia renaming to reflect AI reality
Nvidia which is now clearly seen as … Read More
2024 Outlook with Srinivasa Kakumanu of MosChip
MosChip is a publicly traded company founded in the year 1999, they offer semiconductor design services, turnkey ASIC, software services, and end-to-end product engineering solutions. The company headquartered in Hyderabad, India, with five design centers and over 1300 engineers located in Silicon Valley (USA), Hyderabad,… Read More
Semiconductor CapEx Down in 2024
U.S. President Biden announced on Wednesday an agreement to provide Intel with $8.5 billion in direct funding and $11 billion in loans under the CHIPS and Science Act. Intel will use the funding for wafer fabs in Arizona, Ohio, New Mexico, and Oregon. As reported in our December 2023 newsletter, the CHIPS Act provides a total of $52.7… Read More
Simulating the Whole Car with Multi-Domain Simulation
Next significant automotive blog in a string I will be posting (see here for the previous blog).
In the semiconductor world, mixed simulation means mixing logic sim, circuit sim, virtual sim (for software running on the hardware we are designing) along with emulation and FPGA prototyping. While that span may seem all-encompassing,… Read More
Can Correlation Between Simulation and Measurement be Achieved for Advanced Designs?
“What you simulate is what you get.” This is the holy grail of many forms of system design. Achieving a high level of accuracy between predicted and actual performance can cut design time way down, resulting in better cost margins, time to market and overall success rates. Achieving a high degree of confidence in predicted performance… Read More
CEO Interview: Patrick T. Bowen of Neurophos
Patrick is an entrepreneur with a background in physics and metamaterials. Patrick sets the vision for the future of the Neurophos architecture and directs his team in research and development, particularly in metamaterials design. He has a Master’s degree in Micro-Nano systems from ETH Zurich and PhD in Electrical Engineering… Read More
No! TSMC does not Make 90% of Advanced Silicon
Throughout the debate on fab incentives and the Chips Act I keep seeing comments like; TSMC makes >90% of all advanced silicon, or sometimes Taiwan make >90% of all advanced silicon. This kind of ill-defined and grossly inaccurate statement drives me crazy. I just saw someone make that same claim in the SemiWiki forums and… Read More
How Sarcina Technology Makes Advanced Semiconductor Package Design Easier
For a long time, package engineering was part of the cleanup crew for chip design. The glory was all around the design of advance monolithic chips on the latest technology node. Once the design was done, the package/test team would take the design over the finish line, adding the required I/O specs, lead frame, load board and test … Read More


The Risk of Not Optimizing Clock Power