BannerforSemiWiki 800x100 (2)
WP_Term Object
(
    [term_id] => 386
    [name] => Semiconductor Services
    [slug] => semiconductor-services
    [term_group] => 0
    [term_taxonomy_id] => 386
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1152
    [filter] => raw
    [cat_ID] => 386
    [category_count] => 1152
    [category_description] => 
    [cat_name] => Semiconductor Services
    [category_nicename] => semiconductor-services
    [category_parent] => 0
    [is_post] => 
)

ASML moving to U.S.- Nvidia to change name to AISi & acquire PSI Quantum

ASML moving to U.S.- Nvidia to change name to AISi & acquire PSI Quantum
by Robert Maire on 04-01-2024 at 10:00 am

Moving to the US
  • Nvidia changing name to AISi (AI silicon) reflecting business focus
  • Nvidia to buy PSI Quantum to combine AI & quantum efforts
  • ASML to move to U.S. to reduce China & employee restrictions
  • New Japanese consortia firms join Rapidus & IBM fab team

Nvidia renaming to reflect AI reality

Nvidia which is now clearly seen as … Read More


2024 Outlook with Srinivasa Kakumanu of MosChip

2024 Outlook with Srinivasa Kakumanu of MosChip
by Daniel Nenni on 03-27-2024 at 10:00 am

KS MD&CEO MosChip 2024

MosChip is a publicly traded company founded in the year 1999, they offer semiconductor design services, turnkey ASIC, software services, and end-to-end product engineering solutions. The company headquartered in Hyderabad, India, with five design centers and over 1300 engineers located in Silicon Valley (USA), Hyderabad,… Read More


Semiconductor CapEx Down in 2024

Semiconductor CapEx Down in 2024
by Bill Jewell on 03-21-2024 at 2:00 pm

Delayed Wafer Projects

U.S. President Biden announced on Wednesday an agreement to provide Intel with $8.5 billion in direct funding and $11 billion in loans under the CHIPS and Science Act. Intel will use the funding for wafer fabs in Arizona, Ohio, New Mexico, and Oregon. As reported in our December 2023 newsletter, the CHIPS Act provides a total of $52.7… Read More


Simulating the Whole Car with Multi-Domain Simulation

Simulating the Whole Car with Multi-Domain Simulation
by Bernard Murphy on 03-21-2024 at 6:00 am

Simulating the Whole Car with Multi-Domain Simulation

Next significant automotive blog in a string I will be posting (see here for the previous blog).

In the semiconductor world, mixed simulation means mixing logic sim, circuit sim, virtual sim (for software running on the hardware we are designing) along with emulation and FPGA prototyping. While that span may seem all-encompassing,… Read More


Can Correlation Between Simulation and Measurement be Achieved for Advanced Designs?

Can Correlation Between Simulation and Measurement be Achieved for Advanced Designs?
by Mike Gianfagna on 03-18-2024 at 6:00 am

Can Correlation Between Simulation and Measurement be Achieved for Advanced Designs?

“What you simulate is what you get.” This is the holy grail of many forms of system design. Achieving a high level of accuracy between predicted and actual performance can cut design time way down, resulting in better cost margins, time to market and overall success rates. Achieving a high degree of confidence in predicted performance… Read More


CEO Interview: Patrick T. Bowen of Neurophos

CEO Interview: Patrick T. Bowen of Neurophos
by Daniel Nenni on 03-15-2024 at 6:00 am

Patrick T. Bowen

Patrick is an entrepreneur with a background in physics and metamaterials. Patrick sets the vision for the future of the Neurophos architecture and directs his team in research and development, particularly in metamaterials design. He has a Master’s degree in Micro-Nano systems from ETH Zurich and PhD in Electrical Engineering… Read More


No! TSMC does not Make 90% of Advanced Silicon

No! TSMC does not Make 90% of Advanced Silicon
by Scotten Jones on 03-11-2024 at 2:00 pm

Slide1

Throughout the debate on fab incentives and the Chips Act I keep seeing comments like; TSMC makes >90% of all advanced silicon, or sometimes Taiwan make >90% of all advanced silicon. This kind of ill-defined and grossly inaccurate statement drives me crazy. I just saw someone make that same claim in the SemiWiki forums and… Read More


How Sarcina Technology Makes Advanced Semiconductor Package Design Easier

How Sarcina Technology Makes Advanced Semiconductor Package Design Easier
by Mike Gianfagna on 03-11-2024 at 6:00 am

How Sarcina Technology Makes Advanced Semiconductor Package Design Easier

For a long time, package engineering was part of the cleanup crew for chip design. The glory was all around the design of advance monolithic chips on the latest technology node. Once the design was done, the package/test team would take the design over the finish line, adding the required I/O specs, lead frame, load board and test … Read More


SPIE Let there be Light! High NA Kickoff! Samsung Slows? “Rapid” Decline?

SPIE Let there be Light! High NA Kickoff! Samsung Slows? “Rapid” Decline?
by Robert Maire on 03-03-2024 at 6:00 am

High NA EUV 2024

– High NA EUV’s coming out party – “Dawn” of the Angstrom Era
– Well attended, positive vibes, not much new but good progress
– Concerns about Samsung slowing spend while Intel accelerates
– KLA reticle inspection quandary – Risky business in China

SPIE was a High-NA
Read More

CEO Interview: Larry Zu of Sarcina Technology

CEO Interview: Larry Zu of Sarcina Technology
by Daniel Nenni on 03-01-2024 at 6:00 am

Larry Zu Photo 091516

Larry has grown Sarcina from designing semiconductor packages for a few small companies, to doing package designs for top semiconductor companies around the world. From 2014 to 2018, Larry led the expansion of Sarcina beyond package design into final test and wafer sort hardware and software development.

Larry is a semiconductor… Read More