Events EDA2025 esig 2024 800X100
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Analog Bits Builds a Road to the Future at TSMC OIP

Analog Bits Builds a Road to the Future at TSMC OIP
by Mike Gianfagna on 10-21-2024 at 6:00 am

Analog Bits Builds a Road to the Future at TSMC OIP

The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More


The Perils of Aging, From a Semiconductor Device Perspective

The Perils of Aging, From a Semiconductor Device Perspective
by Mike Gianfagna on 10-17-2024 at 6:00 am

The Perils of Aging, From a Semiconductor Device Perspective

We‘re all aware of the challenges aging brings. I find the older I get, the more in touch I feel with those challenges.  I still find it to be true that aging beats the alternative. I think most would agree. Human factors aside, I’d like to discuss the aging process as applied to the realm of semiconductor device physics. Here, as with… Read More


EVs, Silicon Carbide & Soitec’s SmartSiC™: The High-Tech Spark Driving the Future (with a Twist!)

EVs, Silicon Carbide & Soitec’s SmartSiC™: The High-Tech Spark Driving the Future (with a Twist!)
by soitec_admin on 10-09-2024 at 6:00 am

Tesla

Silicon Carbide (SiC) is the superhero EV converters need, boosting efficiency, shrinking component sizes, and letting your car charge faster while handling heat like a pro. Even Tesla’s like, “Yep, we’re using it,” because who doesn’t want more range and less sweating under the hood?

By Jerome Fohet

Get ready for… Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


TSMC 16th OIP Ecosystem Forum First Thoughts

TSMC 16th OIP Ecosystem Forum First Thoughts
by Daniel Nenni on 09-26-2024 at 6:00 am

TSMC Advanced Technology Roadmap 2024

Even though this is the 16th OIP event please remember that TSMC has been working closely with EDA and IP companies for 20+ years with reference flows and other design enablement and silicon verification activities. The father of OIP officially is Dr. Morris Chang who named it the Grand Alliance. However, Dr. Cliff Hou is the one … Read More


TSMC OIP Ecosystem Forum Preview 2024

TSMC OIP Ecosystem Forum Preview 2024
by Daniel Nenni on 09-19-2024 at 10:00 am

TSMC OIP 2024

The 2024 live conferences have been well attended thus far and there are many more to come. The next big event in Silicon Valley is the TSMC Global OIP Ecosystem Forum on September 25th at the Santa Clara Convention Center. I expect a big crowd filled with both customers and partners.

This is the 16th year of OIP and it has been an honor… Read More


Intel and Cadence Collaborate to Advance the All-Important UCIe Standard

Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
by Mike Gianfagna on 09-02-2024 at 10:00 am

Intel and Cadence Collaborate to Advance the All Important UCIe Standard

The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More


The Chip 4: A Semiconductor Elite

The Chip 4: A Semiconductor Elite
by KADEN CHUANG on 08-29-2024 at 6:00 am

Semiconductor Value Chain Market Share II
Can a 4-member alliance reshape the semiconductor industry?
Photo by Harrison Mitchell on Unsplash

Semiconductors are ubiquitous in electronics and computing devices, making them essential to developments in AI, advanced military, and the world economy. As such, it is unquestionable that nations attain considerable … Read More


The State of The Foundry Market Insights from the Q2-24 Results

The State of The Foundry Market Insights from the Q2-24 Results
by Claus Aasholm on 08-20-2024 at 10:00 am

TSMC Leads but Challengers Follow 2024

If you work in the Semiconductor or related industry, you know that industry cycles can profoundly impact your business. It is crucial for strategic development to invest at the appropriate time and to rope the sails when necessary.

As a semiconductor investor, you’re accustomed to the ebb and flow of industry cycles. It’s… Read More