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The Technical Problem Is Often Not the Business Problem

The Technical Problem Is Often Not the Business Problem
by Admin on 09-20-2026 at 10:00 am

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By Prof. Dr. S. Filo Ambrosini

On a semiconductor line, a rising defect rate can trigger a familiar debate. Do we need a new inspection system? More sensors? An additional engineer?

Those may all be valid responses. But before making the decision, someone needs to establish when the change began, where it first appears, and whether… Read More


Broadcom’s AI Engine Shifts Into Overdrive

Broadcom’s AI Engine Shifts Into Overdrive
by Daniel Nenni on 09-20-2026 at 8:00 am

The XPU Effect Broadcom AI

Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More


TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
by Daniel Nenni on 09-18-2026 at 8:00 am

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More


ASML Has High-NA and Chipmakers Can’t Say No

ASML Has High-NA and Chipmakers Can’t Say No
by Daniel Nenni on 09-17-2026 at 6:00 am

ASML Has High NA and Some Chipmakers Can’t Say No

ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More


Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI

Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
by Lauro Rizzatti on 09-16-2026 at 6:00 am

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Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.

There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More


Nvidia Sees AGI While OpenAI Sees Danger

Nvidia Sees AGI While OpenAI Sees Danger
by Daniel Nenni on 09-13-2026 at 10:00 am

Nvidia Sees AGI While OpenAI Sees Danger

Jensen Huang’s declaration that “AGI has arrived” is less a scientific verdict than a compressed statement about infrastructure, economics and momentum. His evidence is OpenAI’s GPT-6 Astra, reportedly trained on more than 100,000 Nvidia Grace Blackwell NVL72 systems, followed by a promise that another 400,000 GPUs are coming… Read More


Samsung Might Be the Most Unusual Company on Earth

Samsung Might Be the Most Unusual Company on Earth
by Daniel Nenni on 09-13-2026 at 8:00 am

Samsung Might Be The Most Unusual Company 2026

Samsung might be the most unusual company on earth because it is difficult to decide what kind of company it actually is. To most consumers, Samsung means smartphones, televisions, refrigerators. Yet the name also appears on apartment towers, cargo ships, hospital equipment, insurance policies, construction projects, and… Read More


TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips

TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips
by Daniel Nenni on 09-11-2026 at 6:00 am

TSMC OIP 2026

It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.

Mike and… Read More


Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference

Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI Inference
by Daniel Nenni on 09-09-2026 at 2:00 pm

Jalapeño Hot Chip

OpenAI’s Jalapeño is a custom accelerator designed specifically for AI inference, particularly the low-latency, multi-chip workloads behind interactive and agentic systems. Its central idea is that useful performance cannot be reduced to peak floating-point operations or memory bandwidth. What matters is how quickly … Read More


HBM’s Second Act: When Memory Starts Thinking

HBM’s Second Act: When Memory Starts Thinking
by Admin on 09-08-2026 at 2:00 pm

HBM Base Die Revolution

Samsung’s Hot Chips 2026 presentation, “HBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,” argues that the base die beneath a High Bandwidth Memory stack is about to become far more than a communications layer. Traditionally, an HBM base die mainly connects stacked DRAM dies to a GPU, TPU, or other processor and … Read More