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How Fast Can a Performance Model Actually Be Built?

How Fast Can a Performance Model Actually Be Built?
by Admin on 07-26-2026 at 4:00 pm

SimplEx MicroCircuitSutra Performance Model 2026 07 20 Fig

By Thang Tran, CEO of Simplex Micro and Umesh Sisodia, CEO of CircuitSutra

Performance models have a reputation problem. They’re often treated as a long-lead, high-effort undertaking — something a design team commits to early and then waits on for months before it’s useful. The development of SimplEx Micro’s… Read More


Five Myths about the Current Memory Boom

Five Myths about the Current Memory Boom
by Daniel Nenni on 07-26-2026 at 2:00 pm

Five Myths about the Current Memory Boom

The current semiconductor memory boom is mainly an AI-driven capacity-allocation problem, not simply a lack of factories.

AI accelerators require enormous quantities of high-bandwidth memory, or HBM. HBM is used alongside GPUs and custom AI chips because it can move data much faster than ordinary server memory. As companies… Read More


TSMC CoPoS Versus Intel EMIB Semiconductor Packaging

TSMC CoPoS Versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-24-2026 at 10:00 am

TSMC CoPos Versus Intel EMIB 2026

TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More


The Silicon Shield Has Never Been Stronger!

The Silicon Shield Has Never Been Stronger!
by Daniel Nenni on 07-24-2026 at 6:00 am

The Taiwan Silicon Shield

The “Silicon Shield” describes the idea that Taiwan’s central role in advanced semiconductor manufacturing raises the economic and strategic cost of military action against the island. The shield is not a literal defense system. It is a form of structural deterrence created by technological concentration: governments and… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More


TSMC’s Raises the Bar on CAPEX!

TSMC’s Raises the Bar on CAPEX!
by Daniel Nenni on 07-17-2026 at 6:00 am

TSMC CAPEX 2026 SemiWiki

On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More


DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm

Dac Banner

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More


TSMC A16 Backside Power at VLSI 2026

TSMC A16 Backside Power at VLSI 2026
by Daniel Nenni on 07-10-2026 at 6:00 am

TSMC A16 Backside Power at VLSI 2026

TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More


Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters

Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters
by Daniel Nenni on 07-03-2026 at 10:00 am

Driving the Future through the “Talent Empowering Program” Why TSMC Charity Foundation’s Youth Career Initiative Matters

The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners,… Read More


Foundation IP for Intel 18A: Technical Overview and Why It Matters

Foundation IP for Intel 18A: Technical Overview and Why It Matters
by Daniel Nenni on 07-03-2026 at 6:00 am

Intel 18A Foundation IP Synopsys

Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More