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TSMC’s Overseas Fabs Are Paying Off

TSMC’s Overseas Fabs Are Paying Off
by Daniel Nenni on 08-28-2026 at 6:00 am

TSMC's Overseas Fabs Are Paying Off

TSMC’s overseas fabrication strategy is beginning to deliver its intended return: not immediate cost parity with Taiwan, but manufacturable geographic redundancy, closer integration with major customers and access to subsidized capacity in strategically important markets. Arizona and Kumamoto are already producing … Read More


Crescent Island: Turning Memory Capacity into Agentic AI Throughput

Crescent Island: Turning Memory Capacity into Agentic AI Throughput
by Admin on 08-27-2026 at 2:00 pm

Intel Crecesent Island Hot Chips 2026

Intel’s Crescent Island is a discrete data-center GPU designed for agentic AI inference, where performance is constrained by more than matrix arithmetic. Multi-step agents impose latency through repeated model calls and tool interactions, consume large memory capacity for weights and long-context key-value caches, and… Read More


AI-designed Chip Points Toward a Faster Future for Custom Silicon

AI-designed Chip Points Toward a Faster Future for Custom Silicon
by Daniel Nenni on 08-27-2026 at 10:00 am

AI Designed Chip Why Redwood Matters

Architect Labs says it has created Redwood, an AI accelerator designed and verified almost entirely by artificial intelligence in less than two weeks. If independently validated and successfully translated from a programmable prototype into manufactured silicon, the project could represent a major change in how computer… Read More


Huawei Can’t Shrink Its Chips, So It’s Folding Them

Huawei Can’t Shrink Its Chips, So It’s Folding Them
by Daniel Nenni on 08-27-2026 at 8:00 am

Huawei Can’t Shrink Its Chips, So It’s Folding Them

On May 25, Huawei semiconductor chief He Tingbo unveiled LogicFolding, an architecture intended to advance chip performance without relying on ever-smaller transistors. Presented alongside Huawei’s “Tau Scaling Law,” the approach prioritizes signal speed over transistor dimensions. It is a genuine engineering response… Read More


Intel Diamond Rapids: Building Xeon Up, Out, and Through Silicon

Intel Diamond Rapids: Building Xeon Up, Out, and Through Silicon
by Admin on 08-26-2026 at 2:00 pm

Intel Diamond Rapids Hot Chips 2026

Akhilesh Kumar & Krishnakanth Sistla, Intel

Diamond Rapids is Intel’s next-generation Xeon processor, designed around the proposition that hyperscale performance increasingly depends on moving, processing, and protecting data as efficiently as executing instructions. The architecture replaces the conventional… Read More


Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance

Intel Wildcat Lake: Right-Sizing Silicon Without Sinking Performance
by Admin on 08-25-2026 at 2:00 pm

Intel Wildcat Hot Chips 2026

Lance Hacking, Intel

Intel Core Series 3, code-named Wildcat Lake, is a mainstream client system-on-chip derived from the Panther Lake-based Core Ultra Series 3 architecture. Its design objective is not maximum feature density, but broad deployment of current-generation CPU, graphics, AI, memory, security, and connectivity… Read More


Hot Chips: Evolving Memory Architectures for Artificial Intelligence

Hot Chips: Evolving Memory Architectures for Artificial Intelligence
by Admin on 08-24-2026 at 10:00 am

Evolving Memory Architectures for AI Hot CHips 2026

Artificial intelligence performance is increasingly constrained by memory rather than arithmetic throughput. Scaling laws show that model quality improves when parameter count, training data, and compute grow together, but this balance fails when processors cannot obtain operands quickly enough. Contemporary accelerators… Read More


Podcast EP362: An atomic layer in compute. A discussion of what can be built as graphene photonics scales with Cedric Huyghebaert

Podcast EP362: An atomic layer in compute. A discussion of what can be built as graphene photonics scales with Cedric Huyghebaert
by Daniel Nenni on 08-21-2026 at 2:00 pm

Daniel is joined by Dr. Cedric Huyghebaert, CTO of Black Semiconductor. Cedric is one of the world’s leading experts in the development and integration of 2D materials, particularly graphene, into industrial semiconductor manufacturing. With a PhD in Physics from KU Leuven and over 25 years at imec, Cedric built and led… Read More


How TSMC Is Wiring the AI Era With Light

How TSMC Is Wiring the AI Era With Light
by Daniel Nenni on 08-21-2026 at 10:00 am

How TSMC Is Wiring the AI Era With Light

TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More


Intel Eyes a Memory Comeback as AI Rewrites Chip Economics

Intel Eyes a Memory Comeback as AI Rewrites Chip Economics
by Daniel Nenni on 08-21-2026 at 6:00 am

Intel Eyes Memory Comeback

Intel is considering a return to memory technology decades after abandoning mainstream DRAM and, more recently, selling its NAND business. Chief executive Lip-Bu Tan has argued that memory should no longer be viewed simply as a low-margin commodity. Artificial intelligence is turning bandwidth, latency and data movement … Read More