Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
Alchip’s Technology and Global Talent Strategy Deliver Record Growth
Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More
Intel Foundry is a Low Risk Aternative to TSMC
As I have said before, there is a foundry market segment that I call the “NOT TSMC” market, companies who want an alternative to TSMC. My guess, this would be a $5B+ market which is what Samsung Foundry has tried to leverage for the past 20 years. Unfortunately, working with Samsung proved to be a much higher risk than expected… Read More
Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy
The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There… Read More
Intel’s Foundry Transformation: Technology, Culture, and Collaboration
Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More
Intel’s Path to Technological Leadership: Transforming Foundry Services and Embracing AI
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
Intel Foundry Delivers!
Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More
TSMC Describes Technology Innovation Beyond A14
The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More
TSMC Brings Packaging Center Stage with Silicon
The worldwide TSMC 2025 Technology Symposium recently kicked off with the first event in Santa Clara, California. These events typically focus on TSMC’s process technology and vast ecosystem. These items were certainly a focus for this year’s event as well. But there is now an additional item that shares the spotlight – packaging… Read More
TSMC 2025 Technical Symposium Briefing
At the pre-conference briefing, Dr. Kevin Zhang gave quite a few of us media types an overview of what will be highlighted at the 2025 TSMC Technical Symposium here in Silicon Valley. Since most of the semiconductor media are not local this was a very nice thing to do. I will be at the conference and will write more tomorrow after the … Read More
Speculative Execution: Rethinking the Approach to CPU Scheduling