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Inside the Package Powering Modern AI

Inside the Package Powering Modern AI
by Daniel Nenni on 10-26-2026 at 8:00 am

TSMC CoWoS is Critical to AI Chips

TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More


From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation

From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
by Kalar Rajendiran on 10-22-2026 at 10:00 am

Gary Dickerson on the Stage

The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More


SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design

SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
by Admin on 10-22-2026 at 8:00 am

Human approval in an AI cleanroom

By Gleb Tsipursky

SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More


Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series

Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
by Daniel Nenni on 10-22-2026 at 6:00 am

Precision Testing for Edge AI Chips

Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More


Why America’s Semiconductor Manufacturing Capacity Matters

Why America’s Semiconductor Manufacturing Capacity Matters
by Daniel Nenni on 10-21-2026 at 8:00 am

Building America's chip future

America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More


The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip

The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
by Kalar Rajendiran on 10-20-2026 at 10:00 am

Partners Photo Op scaled

Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected

Artificial intelligence is changing what the semiconductor industry must deliver. … Read More


TSMC’s AI Expansion Signals a Broader Shift in Computing

TSMC’s AI Expansion Signals a Broader Shift in Computing
by Daniel Nenni on 10-16-2026 at 8:00 am

TSMC’s AI expansion

TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More


Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
by Admin on 10-16-2026 at 6:00 am

Single Roof, Connected Silicon

By Shaurya Seth

Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets 100,000 wafer… Read More


Why Semiconductor AI Starts with Data, Not Algorithms

Why Semiconductor AI Starts with Data, Not Algorithms
by Admin on 10-15-2026 at 8:00 am

Fig1 context

The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions.

By Sriram Nithin Gopal Lanka

Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to work. But ask the engineers… Read More


Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score

Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score
by Joel Jorgensen on 10-14-2026 at 8:00 am

Writing the Score SemiWiki

Score: the written music for an orchestra, with every section’s part laid out on the same page so they play together. In this article, it’s your designed workflows.

Is AI helping you hit your tape-out date, or putting it at risk? How would you know?

Every Director I talk to is being asked to use AI to deliver faster, or better,… Read More