The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
The Perils of Aging, From a Semiconductor Device Perspective
We‘re all aware of the challenges aging brings. I find the older I get, the more in touch I feel with those challenges. I still find it to be true that aging beats the alternative. I think most would agree. Human factors aside, I’d like to discuss the aging process as applied to the realm of semiconductor device physics. Here, as with… Read More
EVs, Silicon Carbide & Soitec’s SmartSiC™: The High-Tech Spark Driving the Future (with a Twist!)
Silicon Carbide (SiC) is the superhero EV converters need, boosting efficiency, shrinking component sizes, and letting your car charge faster while handling heat like a pro. Even Tesla’s like, “Yep, we’re using it,” because who doesn’t want more range and less sweating under the hood?
By Jerome Fohet
Get ready for… Read More
Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
TSMC 16th OIP Ecosystem Forum First Thoughts
Even though this is the 16th OIP event please remember that TSMC has been working closely with EDA and IP companies for 20+ years with reference flows and other design enablement and silicon verification activities. The father of OIP officially is Dr. Morris Chang who named it the Grand Alliance. However, Dr. Cliff Hou is the one … Read More
TSMC OIP Ecosystem Forum Preview 2024
The 2024 live conferences have been well attended thus far and there are many more to come. The next big event in Silicon Valley is the TSMC Global OIP Ecosystem Forum on September 25th at the Santa Clara Convention Center. I expect a big crowd filled with both customers and partners.
This is the 16th year of OIP and it has been an honor… Read More
Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More
The Chip 4: A Semiconductor Elite
Can a 4-member alliance reshape the semiconductor industry?
Semiconductors are ubiquitous in electronics and computing devices, making them essential to developments in AI, advanced military, and the world economy. As such, it is unquestionable that nations attain considerable … Read More
The State of The Foundry Market Insights from the Q2-24 Results
If you work in the Semiconductor or related industry, you know that industry cycles can profoundly impact your business. It is crucial for strategic development to invest at the appropriate time and to rope the sails when necessary.
As a semiconductor investor, you’re accustomed to the ebb and flow of industry cycles. It’s… Read More
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