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Intel has a new Billionaire CEO!

Intel has a new Billionaire CEO!
by Daniel Nenni on 03-17-2025 at 10:00 am

Lip Bu Tan was appointed chief executive officer of Intel Corpor

Great news last week as Intel fills the CEO slot for the 9th time in 56 years with industry legend Lip-Bu Tan. From what I hear, Intel employees, and the entire industry for that matter, are overjoyed. I’m sure there are one or two competing companies that are concerned but overall it is an absolute love fest.

If you look at education… Read More


How FD-SOI Powers the Future of AI in Automobiles

How FD-SOI Powers the Future of AI in Automobiles
by Mike Gianfagna on 03-17-2025 at 6:00 am

How FD SOI Powers the Future of AI in Automobiles

We are witnessing a significant revolution in automotive design. The software-defined vehicle is taking center stage as disruptive technologies are integrated into mass production. Areas such as autonomous driving, lighting, radar, and other camera-based sensors are all part of this revolution. AI is at the center of many… Read More


Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More


Soitec: Materializing Future Innovations in Semiconductors

Soitec: Materializing Future Innovations in Semiconductors
by Kalar Rajendiran on 02-20-2025 at 6:00 am

ESG in the DNA of Soitec

The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More


IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?

IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?
by Scotten Jones on 02-10-2025 at 6:00 am

Figure 1

Initial thoughts

At IEDM held in December 2024, TSMC presented: “2nm Platform Technology featuring Energy-efficient Nanosheet Transistors and Interconnects co-optimized with 3DIC for AI, HPC and Mobile SoC Applications,” the authors are:

Geoffrey Yeap, S.S. Lin, H.L. Shang, H.C. Lin, Y.C. Peng, M. Wang, PW Wang, CP Lin, KF… Read More


The Intel Common Platform Foundry Alliance

The Intel Common Platform Foundry Alliance
by Daniel Nenni on 12-27-2024 at 6:00 am

Common Platform Alliance

When I do a root cause analysis of Intel’s problem it is very simple. If Intel wants to continue to be a leading-edge semiconductor manufacturer, they need to fill their fabs, all of their fabs. Clearly several things need to happen in order to do that but the one that most interests me is on the foundry side.

I think we can all agree that… Read More


What would you do if you were the CEO of Intel?

What would you do if you were the CEO of Intel?
by Daniel Nenni on 12-24-2024 at 10:00 am

Intel BSPD Power Via

One of the most enduring threads in the SemiWiki forum is What would you do if you are the Intel CEO? There are currently 128 responses and more than 45,000 views. It was originally posted March 13th, 2015, after Brain Krzanich was given the CEO position. A different time for sure but an interesting read and the responses keep on coming.… Read More


Intel Presents the Final Frontier of Transistor Architecture at IEDM

Intel Presents the Final Frontier of Transistor Architecture at IEDM
by Mike Gianfagna on 12-23-2024 at 6:00 am

Intel Presents the Final Frontier of Transistor Architecture at IEDM

IEDM was buzzing with many presentations about the newest gate-all-around transistor. Both Intel and TSMC announced processes based on nanosheet technology. This significant process innovation allows the fabrication of silicon RibbonFET CMOS devices, which promise to open a new era of transistor scaling, keeping Moore’s… Read More


TSMC Unveils the World’s Most Advanced Logic Technology at IEDM

TSMC Unveils the World’s Most Advanced Logic Technology at IEDM
by Mike Gianfagna on 12-19-2024 at 10:00 am

TSMC Unveils the World’s Most Advanced Logic Technology at IEDM

There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More


Intel – Everyone’s Favourite Second Source?

Intel – Everyone’s Favourite Second Source?
by Peter Bennet on 12-17-2024 at 10:00 am

newsroom robert noyce bldg 2.jpg.rendition.intel.web.1280.720

A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views.

At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel.

I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… Read More