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CEO Interview Greene Tweed

CEO Interview Greene Tweed
by Daniel Nenni on 10-02-2026 at 10:00 am

Greene Tweed

Magen Buterbaugh was appointed President and CEO of Greene Tweed in January 2023. A seasoned leader, with broad industry expertise, Magen has led multiple chemicals & materials-based businesses – spanning from startups to multibillion-dollar enterprises. She led and scaled new innovative research and development platforms… Read More


TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies

TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies
by Mike Gianfagna on 10-02-2026 at 8:00 am

TSMC OIP 2026 Emerging Technologies Alley

 

The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.

And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.… Read More


Intel Foundry: AI performance now depends on the whole system

Intel Foundry: AI performance now depends on the whole system
by Daniel Nenni on 10-02-2026 at 6:00 am

AI performance now depends on the whole system

For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More


TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design

TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design
by Daniel Nenni on 10-01-2026 at 10:00 am

TSMC’s AI Design Kit Bringing Agentic AI Into Chip Design

TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More


TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems

TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems
by Mike Gianfagna on 09-30-2026 at 12:00 pm

TSMC OIP Ecosystem Forum 2026 Broadcom’s View of ASICs and Ecosystems

I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More


The Pivotal Moments That Gave Rise to Silicon Valley

The Pivotal Moments That Gave Rise to Silicon Valley
by Admin on 09-30-2026 at 10:00 am

IMAGE 1 Robert Noyce with microscope

The little-known decisions and breakthroughs—and the remarkable role of Robert Noyce—that helped shape the modern semiconductor industry

by Sunil Mehta

When people tell the story of how Silicon Valley came into being, they usually begin with a familiar sequence of events.

The transistor was invented at Bell Labs. William Shockley… Read More


Why Advanced Chip Packaging Is Becoming a Design Problem

Why Advanced Chip Packaging Is Becoming a Design Problem
by Daniel Nenni on 09-29-2026 at 2:00 pm

Why Advanced Chip Packaging Is Becoming a Design Problem

As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More


Siemens and TSMC push AI deeper into chip design

Siemens and TSMC push AI deeper into chip design
by Daniel Nenni on 09-29-2026 at 8:00 am

Siemens and TSMC push AI deeper into chip design

Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More


TSMC OIP Ecosystem Forum 2026: Opening Remarks

TSMC OIP Ecosystem Forum 2026: Opening Remarks
by Mike Gianfagna on 09-28-2026 at 12:00 pm

TSMC OIP Ecosystem Forum 2026 Opening Remarks

The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More


Designing chips for the AI era: what TSMC’s roadmap means

Designing chips for the AI era: what TSMC’s roadmap means
by Daniel Nenni on 09-25-2026 at 8:00 am

TSMC LC Lu OIP Event

About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.

AI is creating two related… Read More