The transition from FinFET to Gate-All-Around (GAA) transistor technology represents a pivotal moment in the evolution of logic devices, driven by both physical scaling limits and the rapidly growing computational demands of artificial intelligence. As semiconductor technology approaches the sub-3 nm regime, traditional… Read More
TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce
The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More
NanoIC Extends Its PDK Portfolio with First A14 Logic and eDRAM Memory PDK
NanoIC has announced a major expansion of its process design kit portfolio with the introduction of its first A14 logic and embedded eDRAM memory PDK. This milestone reflects the company’s growing role in enabling advanced semiconductor design at cutting-edge technology nodes and addresses increasing industry demand for… Read More
TSMC’s 2026 AZ Exclusive Experience Day: Bridging Careers and Semiconductor Innovation
In February of 2026, Taiwan Semiconductor Manufacturing Company (TSMC) will host the TSMC AZ Exclusive Experience Day in Phoenix, Arizona, offering selected participants a rare opportunity to engage directly with one of the most advanced semiconductor manufacturing organizations in the world. The event will serve as an immersive… Read More
The Foundry Model Is Morphing — Again
When Morris Chang left Texas Instruments in 1983 to found TSMC, he was not merely starting a new company—he was proposing a new industrial logic. Chang recognized that semiconductor manufacturing had become so capital-intensive that it could no longer survive as just one function inside a vertically integrated company.… Read More
The Chronicle of TSMC CoWoS
As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth
In a significant example of how high-tech manufacturing can embrace environmental stewardship without compromising operational excellence, Taiwan Semiconductor Manufacturing Company has launched a sustainability initiative within its advanced packaging operations that both reduces waste and generates meaningful… Read More
Manufacturing Is Strategy: Leadership Lessons from the Semiconductor Front Lines
This article is an editorial synthesis of a fireside chat between Tom Caulfield, Executive Chairman of GlobalFoundries, and John Kibarian, CEO of PDF Solutions that took place on December 3rd 2025, during the PDF Solutions Users Conference. John Kibarian led the conversation to get Tom Caulfield’s perspectives on leadership… Read More
Podcast EP325: How KIOXIA is Revolutionizing NAND FLASH Memory
Daniel is joined by Doug Wong, senior member of the technical staff at KIOXIA America, where he has contributed to the advancement of memory technologies since 1993. He began his career with KIOXIA in the company’s Memory Division (then part of Toshiba America) and has since focused on a broad range of memory solutions, including… Read More
Addressing Silent Data Corruption (SDC) with In-System Embedded Deterministic Testing
Silent Data Corruption (SDC) represents a critical challenge in modern semiconductor design, particularly in high-performance computing environments like AI data centers. As highlighted in a collaborative presentation by Broadcom Inc. and Siemens EDA at the 2025 TSMC OIP event, SDC occurs when hardware defects cause erroneous… Read More


Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems