TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
By Gleb Tsipursky
SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More
Why America’s Semiconductor Manufacturing Capacity Matters
America’s semiconductor future will be shaped by its ability to turn scientific discoveries into chips manufactured at scale. That is why the investments outlined in Intel Foundry’s recent editorial matter beyond the company’s own business. They address a fundamental question: whether the United States can sustain the research,… Read More
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More
TSMC’s AI Expansion Signals a Broader Shift in Computing
TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
By Shaurya Seth
Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets 100,000 wafer… Read More
Why Semiconductor AI Starts with Data, Not Algorithms
The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions.
By Sriram Nithin Gopal Lanka
Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to work. But ask the engineers… Read More
Delivering Silicon Systems Through AI Disruption, Part 1: Writing the Score
Score: the written music for an orchestra, with every section’s part laid out on the same page so they play together. In this article, it’s your designed workflows.
Is AI helping you hit your tape-out date, or putting it at risk? How would you know?
Every Director I talk to is being asked to use AI to deliver faster, or better,… Read More


ChipAgent Raises $134Million and Why it Matters