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TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More


TSMC’s Raises the Bar on CAPEX!

TSMC’s Raises the Bar on CAPEX!
by Daniel Nenni on 07-17-2026 at 6:00 am

TSMC CAPEX 2026 SemiWiki

On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More


DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm

Dac Banner

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More


TSMC A16 Backside Power at VLSI 2026

TSMC A16 Backside Power at VLSI 2026
by Daniel Nenni on 07-10-2026 at 6:00 am

TSMC A16 Backside Power at VLSI 2026

TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More


Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters

Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters
by Daniel Nenni on 07-03-2026 at 10:00 am

Driving the Future through the “Talent Empowering Program” Why TSMC Charity Foundation’s Youth Career Initiative Matters

The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners,… Read More


Foundation IP for Intel 18A: Technical Overview and Why It Matters

Foundation IP for Intel 18A: Technical Overview and Why It Matters
by Daniel Nenni on 07-03-2026 at 6:00 am

Intel 18A Foundation IP Synopsys

Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More


Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
by Daniel Nenni on 07-01-2026 at 10:00 am

Why Huawei Says It Will Match TSMC's Most Advanced Chips by 2031

Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
by Daniel Nenni on 06-26-2026 at 6:00 am

Inel 18A vs Intel 18A P

Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More


Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs

Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs
by Boris Shteinberg on 06-22-2026 at 2:00 pm

Screenshot 20260618 010406 Google

A deposition chamber drops out of production at 2 a.m. Forty minutes later it is back, the dashboard flips from red to green, and two people want opposite things. The operations-center operator has a step starving downstream and wants the tool dispatched now. The module’s shift group leader wants test wafers run and confirmed… Read More


The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes

The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
by Daniel Nenni on 06-19-2026 at 6:00 am

Intel and PDF Solutions Tackle Advanced Nodes

One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.

On the outside PDF Solutions is a publicly traded semiconductor… Read More