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Intel’s Tiny Bridges Could Lead to Very Big Paychecks

Intel’s Tiny Bridges Could Lead to Very Big Paychecks
by Daniel Nenni on 11-01-2026 at 12:00 pm

Tiny Chip Builders, Big Payday

Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More


High-NA’s Obituary Was Premature

High-NA’s Obituary Was Premature
by Daniel Nenni on 11-01-2026 at 10:00 am

High NA’s premature obituary

High numerical aperture EUV lithography was supposed to be the next step in semiconductor manufacturing. Then came the doubts: expensive scanners, smaller exposure fields, difficult economics and big customers finding ways to stretch existing equipment. It became tempting to confuse a delayed adoption curve with a technology… Read More


TSMC’s Patent and the Harsh Realities of 3D DRAM Competition

TSMC’s Patent and the Harsh Realities of 3D DRAM Competition
by Daniel Nenni on 10-30-2026 at 8:00 am

Layered Memory, Fierce DRAM Competition

Discussions around TSMC’s vertical DRAM patents raise an intriguing question: could the world’s leading foundry eventually challenge established memory manufacturers? The curiosity is understandable. Patent disclosures involving vertical transistors and integrated capacitors show that TSMC is exploring architectures… Read More


How AI is Reshaping Semiconductor Design and Manufacturing

How AI is Reshaping Semiconductor Design and Manufacturing
by Daniel Nenni on 10-30-2026 at 6:00 am

How AI is Reshaping Semiconductor Design and Manufacturing

While AI is transforming nearly every industry, some of its most significant advances are happening inside the semiconductor factories building the chips that power it. If you design AI systems, those manufacturing advances directly influence your performance, efficiency, and path to market.

The message from the recent Global… Read More


SEMICON West 2026: AI Made the Steps Faster. The Time Between Them Is Next.

SEMICON West 2026: AI Made the Steps Faster. The Time Between Them Is Next.
by Joel Jorgensen on 10-29-2026 at 10:00 am

SemiWiki SEMICON West Inline Time Between

The semiconductor industry crossed $1 trillion in annual revenue this year, almost four years ahead of earlier projections. SEMI President and CEO Ajit Manocha opened the CEO Summit at SEMICON West with a chart that told the story. A year ago, the forecast for 2030 was $1 trillion. Now it is $2 trillion, with $3 trillion possible … Read More


From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters

From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap Matters
by Daniel Nenni on 10-28-2026 at 10:00 am

Metrology, analytics, and autonomous manufacturing

Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More


The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up

The Wafer Is the New Battleground: Soitec CPO René Jonker on Building AI from the Substrate Up
by Lauro Rizzatti on 10-28-2026 at 8:00 am

Electric blue Soitec wafer cover

Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it.

Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More


When Nanomagnets Do the Math: France’s New Machine for Impossible Choices

When Nanomagnets Do the Math: France’s New Machine for Impossible Choices
by Admin on 10-28-2026 at 6:00 am

image002 (5)

French researchers have demonstrated a hybrid nanoelectronic “Ising machine” designed to solve difficult combinatorial optimization problems more efficiently. The experimental system combines two emerging device technologies—resistive memory and spintronics—to perform parts of an optimization algorithm through… Read More


Inside the Package Powering Modern AI

Inside the Package Powering Modern AI
by Daniel Nenni on 10-26-2026 at 8:00 am

TSMC CoWoS is Critical to AI Chips

TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More


From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation

From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
by Kalar Rajendiran on 10-22-2026 at 10:00 am

Gary Dickerson on the Stage

The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More