Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More
Intel Foundry and the DAC2026 Ecosystem
The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.
Intel Foundry also made its presence felt, reminding everyone… Read More
Executive Interview with James Huang of AlChip
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
Podcast EP358: How Custom Silicon Development Allowed Cisco to Fuel New Innovation for Its Customers
Daniel is joined by Nick Kucharewski Senior Vice President and General Manager for Cisco’s silicon development organization. In this role he is responsible for the end-to-end strategy, cross-functional execution, organization alignment, and product roadmap for Silicon One, Cisco’s uniquely scalable and programmable … Read More
The Difference Between TSMC CoWoS-S and CoWoS-R
CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More
Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage
For anyone tracking enterprise infrastructure, the storage landscape is moving at a breakneck pace. The explosive growth of generative AI, multi-million token context windows, and massive data-centric workloads have pushed traditional memory and storage architectures to their absolute limits.
This August, the industry… Read More
Five Myths about the Current Memory Boom
The current semiconductor memory boom is mainly an AI-driven capacity-allocation problem, not simply a lack of factories.
AI accelerators require enormous quantities of high-bandwidth memory, or HBM. HBM is used alongside GPUs and custom AI chips because it can move data much faster than ordinary server memory. As companies… Read More
How Fast Can a Performance Model Actually Be Built?
By Thang Tran, CEO of Simplex Micro and Umesh Sisodia, CEO of CircuitSutra
Performance models have a reputation problem. They’re often treated as a long-lead, high-effort undertaking — something a design team commits to early and then waits on for months before it’s useful. The development of SimplEx Micro’s… Read More
TSMC CoPoS Versus Intel EMIB Semiconductor Packaging
TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More
The Silicon Shield Has Never Been Stronger!
The “Silicon Shield” describes the idea that Taiwan’s central role in advanced semiconductor manufacturing raises the economic and strategic cost of military action against the island. The shield is not a literal defense system. It is a form of structural deterrence created by technological concentration: governments and… Read More


Intel and TSMC Take Different Paths to High-NA EUV