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Semiconductor Intellectual Property
Today’s power modeling solutions are trained at measuring power using the micro-events captured from detailed RTL simulation or studying the electromagnetic radiation from IR drop and side channel attacks. These solutions are fantastic for debugging and verification of the implementation. There are both open source and … Read More
Dan is joined by Calista Redmond, CEO of RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including vice president of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement… Read More
Mr. Venkata Sudhakar Simhadri is a serial entrepreneur with a proven track-record in the semiconductor industry. He was the Founder, President & CEO of Gigacom Semiconductor LLC & Founder / Director of Gigacom India (Both the Companies acquired by MosChip) and the driving force behind establishing IP licensing and … Read More
Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More
The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched. Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More
Designers have many paths for differentiating RISC-V solutions. One path launches into various RISC-V core customizations and extensions per the specification. Another focuses on selecting and assembling IP blocks in a complete system-on-chip (SoC) design around one or more RISC-V cores. A third is emerging: interconnecting… Read More
Over the last few years, transformers have been fundamentally changing the nature of deep learning models, revolutionizing the field of artificial intelligence. Transformers introduce an attention mechanism that allows models to weigh the importance of different elements in an input sequence. Unlike traditional deep learning… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet