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Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Andes Technology is Expanding RISC-V’s Horizons in High-Performance Computing Applications

Andes Technology is Expanding RISC-V’s Horizons in High-Performance Computing Applications
by Charlie Su on 09-24-2024 at 6:00 am

Andes Chip

By: Dr. Charlie Su, President and CTO, Andes Technology Corp.

At Andes Technology, we are excited to share some of our latest advancements and insights into the growing role of RISC-V in several high-performance applications. According to the SHD Group report, “IP Market RISC-V Market Report: Application Forecasts in… Read More


Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More


Linear pluggable optics target data center energy savings

Linear pluggable optics target data center energy savings
by Don Dingee on 09-19-2024 at 6:00 am

Conceptual diagram of a retimed OSFP versus a linear direct drive solution using an advanced SerDes IP solution and linear pluggable optics

Data center density continues growing, driving interconnect technology to meet new challenges. Two of the largest are signal integrity and power consumption. Optical interconnects can solve many signal integrity issues posed by copper cabling and offer support for higher frequencies and bandwidths. Still, through sheer… Read More


Gazzillion Misses – Making the Memory Wall Irrelevant

Gazzillion Misses – Making the Memory Wall Irrelevant
by Jose Maria Arnau on 09-12-2024 at 6:00 am

Gazzillion pyramid

Memory Hierarchy and the Memory Wall

Computer programs mainly move data around. In the meantime, they do some computations on the data but the bulk of execution time and energy is spent moving data around. In computer jargon we say that applications tend to be memory bound: this means that memory is the main performance limiting … Read More


Bluetooth 6.0 Channel Sounding is Here

Bluetooth 6.0 Channel Sounding is Here
by Bernard Murphy on 09-11-2024 at 6:00 am

car keyless entry

I posted a blog on this topic a year ago. Now the Bluetooth Sig has (just) ratified the standard it is timely to provide a reminder on what this new capability can offer. Channel Sounding introduced in Bluetooth Core specification version 6.0 is a method to significantly increase the accuracy of Bluetooth-based distance measurements,… Read More


TetraMem Integrates Energy-Efficient In-Memory Computing with Andes RISC-V Vector Processor

TetraMem Integrates Energy-Efficient In-Memory Computing with Andes RISC-V Vector Processor
by Wenbo Yin on 09-10-2024 at 10:00 am

MX100

The rapid proliferation of artificial intelligence (AI) across a growing number of hardware applications has driven an unprecedented demand for specialized compute acceleration not met by conventional von Neumann architectures. Among the competing alternatives, one showing the greatest promise is analog in-memory computing… Read More


Powering the Future: The Transformative Role of Semiconductor IP

Powering the Future: The Transformative Role of Semiconductor IP
by SarojChouhan on 09-05-2024 at 10:00 am

Semiconductor IP Graphic

In the rapidly changing landscape of technology, the semiconductor industry serves as a cornerstone, fueling innovation across multiple sectors. Central to this industry is the semiconductor Intellectual Property (IP)—a vital component that frequently escapes public attention and is instrumental in determining the future… Read More


Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem

Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
by Kalar Rajendiran on 08-27-2024 at 10:00 am

9.2Gbps HBM3E Subsystem

In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’sRead More


Analog Bits Momentum and a Look to the Future

Analog Bits Momentum and a Look to the Future
by Mike Gianfagna on 08-27-2024 at 6:00 am

Analog Bits Momentum and a Look to the Future

Analog Bits is aggressively moving to advanced nodes. On SemiWiki, Dan Nenni covered new IP in 3nm at DAC here. I covered the new Analog Bits 3nm IP presented at the TSMC Technology Symposium here. And now, there’s buzz about 2nm IP to be announced at the upcoming TSMC OIP event in September.  I was able to get a briefing from the master… Read More