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448G: Ready or not, here it comes!

448G: Ready or not, here it comes!
by Kalar Rajendiran on 08-19-2025 at 6:00 am

448G Host Channel Topologies Analyzed

The march toward higher-speed networking continues to be guided by the same core objectives as has always been : increase data rates, lower latency, improve reliability, reduce power consumption, and maintain or extend reach while controlling cost. For the next generation of high-speed interconnects, these requirements … Read More


S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China

S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China
by Daniel Nenni on 08-13-2025 at 10:00 am

pic 1 (1)

Shanghai, July 19, 2025 — S2C, a leader in functional verification, showcased its latest digital EDA solutions and key partnerships with BOSC, Xuantie, and Andes Technology at RISC-V Summit China 2025, highlighting its contributions to the ecosystem. The company also played a leading role in the EDA sub-forum, with VP Ying… Read More


What XiangShan Got Right—And What It Didn’t Dare Try

What XiangShan Got Right—And What It Didn’t Dare Try
by Jonah McLeod on 08-12-2025 at 6:00 am

XiangShan

An Open ISA, a Closed Mindset — Predictive Execution Charts a New Path

The RISC-V revolution was never just about open instruction sets. It was a rare opportunity to break free from the legacy assumptions embedded in every generation of CPU design. For decades, architectural decisions have been constrained by proprietary patents,… Read More


WEBINAR: What It Really Takes to Build a Future-Proof AI Architecture?

WEBINAR: What It Really Takes to Build a Future-Proof AI Architecture?
by Don Dingee on 08-07-2025 at 6:00 am

AI Inference Use Cases from Edge to Cloud

Keeping up with competitors in many computing applications today means incorporating AI capability. At the edge, where devices are smaller and consume less power, the option of using software-powered GPU architectures becomes unviable due to size, power consumption, and cooling constraints. Purpose-built AI inference … Read More


Unlocking Efficiency and Performance with Simultaneous Multi-Threading

Unlocking Efficiency and Performance with Simultaneous Multi-Threading
by Daniel Nenni on 08-05-2025 at 10:00 am

Akeana webinar on Simultaneous Multi Threading

An Akeana hosted webinar on Simultaneous Multi-Threading (SMT) provided a comprehensive deep dive into the technical, commercial, and strategic significance of SMT in the evolving compute landscape. Presented by Graham Wilson and Itai Yarom, the session was not only an informative overview of SMT architecture and use cases,… Read More


UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era

UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era
by Daniel Nenni on 08-05-2025 at 10:00 am

Chiplet SemiWiki UCIe

The Universal Chiplet Interconnect Express (UCIe) 3.0 specification marks a decisive step in the industry’s shift from monolithic SoCs to modular, multi-die systems. Released on August 5, 2025, the new standard doubles peak link speed from 32 GT/s in UCIe 2.0 to 48 and 64 GT/s while adding a suite of manageability and efficiency

Read More

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs
by Mike Gianfagna on 07-31-2025 at 10:00 am

CAST Webinar About Supercharging Your Systems with Lossless Data Compression IPs

Much of advanced technology is data-driven. From the cloud and AI accelerators to automotive processing and edge computing, data storage and transmission efficiency are of critical importance. It turns out that lossless data compression is a key ingredient to deliver these requirements.

While there are both software and hardware… Read More


cHBM for AI: Capabilities, Challenges, and Opportunities

cHBM for AI: Capabilities, Challenges, and Opportunities
by Kalar Rajendiran on 07-31-2025 at 6:00 am

cHBM Panelists at Synopsys Executive Forum

AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
by Admin on 07-22-2025 at 10:00 am

Figure 1

By Tetsu Ho

With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


Agile Analog Update at #62DAC

Agile Analog Update at #62DAC
by Daniel Payne on 07-21-2025 at 10:00 am

agile analog min

On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More