Semiconductor intellectual property (IP) plays a critical role in modern system-on-chip (SoC) designs. That’s not surprising given that modern SoCs are highly complex designs that leverage already proven building blocks such as processors, interfaces, foundational IP, on-chip bus fabrics, security IP, and others. This… Read More
Synopsys Presents AI-Fueled Innovation at SNUG 2024
SNUG is the premier event for Synopsys to showcase its technology and impact on the industry. This year’s SNUG did not disappoint. The two-day event packed many fantastic user presentations along with exciting news of innovation from Synopsys. Jensen Huang and Sassine Ghazi even held a live, interactive Q&A session. Compelling… Read More
Scaling Data Center Infrastructure for the Terabit Era
Earlier this month, SemiWiki wrote about Synopsys’s complete 1.6T Ethernet IP solution to drive AI and Hyperscale Data Center chips. A technology’s success is all about when, where and how it gets adopted within the ecosystem. In the high-speed ethernet ecosystem, the swift adoption of 1.6T Ethernet relies on key roles and coordinated… Read More
TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
NVIDIA cuLitho Accelerates Semiconductor Manufacturing’s Most Compute-Intensive Workload by 40-60x, Opens Industry to New Generative AI Algorithms.
An incredible example of semiconductor industry partnerships was revealed during the Synopsys User Group (SNUG) last month. It started with a press release but there is much… Read More
Synopsys SNUG Silicon Valley Conference 2024: Powering Innovation in the Era of Pervasive Intelligence
After the leadership transition at the top, Synopsys had just a little more than two months before the company’s flagship event, the Synopsys User Group (SNUG) conference. The Synopsys user community and entire ecosystem were waiting to hear new CEO Sassine Ghazi’s keynote to learn where the company is going and its strategic … Read More
2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
Synopsys Enhances PPA with Backside Routing
Complexity and density conspire to make power delivery very difficult for advanced SoCs. Signal integrity, power integrity, reliability and heat can seem to present unsolvable problems when it comes to efficient power management. There is just not enough room to get it all done with the routing layers available on the top side… Read More
Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips
The demand for high-bandwidth, low-latency networking solutions has never been greater. As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centers become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative.… Read More
2024 Signal & Power Integrity SIG Event Summary
It was a dark and stormy night here in Silicon Valley but we still had a full room of semiconductor professionals. I emceed the event. In addition to demos, customer and partner presentations, we did a Q&A which was really great. One thing I have to say is that Intel really showed up for both DesignCon and the Chiplet Summit. Quite… Read More
Navigating the 1.6Tbps Era: Electro-Optical Interconnects and 224G Links
In the relentless pursuit of ever-increasing data speeds, the 1.6 Terabits per second (Tbps) era looms on the horizon, promising unprecedented levels of connectivity and bandwidth within data centers. As data-intensive applications proliferate and the demand for real-time processing escalates, the need for robust and efficient… Read More