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Q2FY24TessentAI 800X100
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Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer

Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer
by Kalar Rajendiran on 03-18-2026 at 10:00 am

Rasterization Polygon to pixel based representation

As semiconductor manufacturing pushes deeper into the nanometer regime, computational lithography has evolved from a supporting step into a central pillar of advanced chip design. Mask synthesis, lithography simulation, and optical proximity correction (OPC) now demand unprecedented levels of accuracy and computational… Read More


Formal Verification Best Practices

Formal Verification Best Practices
by Daniel Payne on 03-17-2026 at 10:00 am

formal verification

How do I know when my hardware design is correct and meets all of the specifications? For many years the answer was simple, simulate as much as you can in the time allowed in the schedule and then hope for the best when silicon arrives for testing. There is a complementary method for ensuring that hardware design meets the specifications… Read More


AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent
by Daniel Nenni on 03-16-2026 at 1:30 pm

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More


Siemens Reveals Agentic Questa

Siemens Reveals Agentic Questa
by Bernard Murphy on 03-05-2026 at 6:00 am

Questa Agentic

There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More


Functional Safety Analysis of Electronic Systems

Functional Safety Analysis of Electronic Systems
by Daniel Payne on 03-04-2026 at 10:00 am

hyperlynx ams

Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More


Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
by Daniel Nenni on 02-24-2026 at 8:00 am

Siemens Acquires ASTER Technologies to Deliver Industry Leading PCB Test Engineering Solutions

Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More


Custom IC Design using Additive Learning

Custom IC Design using Additive Learning
by Daniel Payne on 02-19-2026 at 10:00 am

Additive learning engine

Custom IC design has demanding technical requirements to produce accurate simulation results for timing and power analysis in the shortest run times. EDA vendors have been rushing to use AI and ML technology to meet these analysis requirements. I attended a webinar from Siemens on accelerating iterative design cycles with Solido… Read More


Hierarchical Device Planning as an Enabler of System Technology Co-Optimization

Hierarchical Device Planning as an Enabler of System Technology Co-Optimization
by Kalar Rajendiran on 01-27-2026 at 6:00 am

Connectivity in a Hierarchical IC Package Floorplan

AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More


Siemens EDA Illuminates the Complexity of PCB Design

Siemens EDA Illuminates the Complexity of PCB Design
by Mike Gianfagna on 01-19-2026 at 6:00 am

Siemens EDA Illuminates the Complexity of PCB Design

As heterogeneous multi-die design becomes more prevalent, the focus on advanced analysis has predictably shifted in that direction. While these challenges are important to overcome, we shouldn’t lose sight of how complete systems are built. Short and long reach communication channels, system-level power management and … Read More