3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
Electronic Design Automation
ARC Processor Summit 2022 Your embedded edge starts here!
As embedded systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these embedded applications must be efficient to deliver high levels of performance within limited power… Read More
Digital Twins Simplify System Analysis
The ability to digitally replicate physical systems has been used to model hardware operations for many years, and more recently, digital twining technology has been applied to electronic systems to better simulate and troubleshoot the systems. As explained by Bryan Ramirez, Director of Industries, Solutions & Ecosystems,… Read More
Understanding Sheath Behavior Key to Plasma Etch
Readers of SemiWiki will be well aware of the challenges the industry has faced in photolithography in moving to new nodes, which drove the development of new EUV light sources as well as new masking techniques. Plasma etching is another key step in chip manufacturing that has also seen new challenges in the development of new sub-10nm… Read More
WEBINAR: Design and Verify State-of-the-Art RFICs using Synopsys / Ansys Custom Design Flow
The design and characterization of RF circuits is a complex process that requires an RF designer to overcome a variety of challenges. Not only do they face the complexities posed by advanced semiconductor processes and the need to meet the demanding requirements of modern wireless standards, designers must also account for electromagnetic… Read More
Coverage Analysis in Questa Visualizer
Coverage analysis is how you answer the question “have I tested enough?” You need some way to quantify the completeness of our testing; coverage is how you do that. Right out of the gate this is a bit deceptive. To truly cover a design our tests would need to cover every accessible state and state transition. The complexity of that task… Read More
Fast EM/IR Analysis, a new EDA Category
I’ve watched the SPICE market segment into multiple approaches, like: Classic SPICE, Parallel SPICE, FastSPICE and Analog FastSPICE. In a similar fashion the same thing just happened to EM/IR analysis, because after years of waiting we finally have a different approach to EM/IR analysis that works at the top-level of … Read More
DSP IP for High Performance Sensor Fusion on an Embedded Budget
Whether we realize it or not, everyday applications we use depend on data gathered by sensors. We can bet that pretty much every application uses at least a couple of different types of sensors, if not more. That is because different types of sensors are better suited to collect data depending on the application, the environment … Read More
A Solid Methodology is the Margin of Victory
Designing complex systems is difficult. It seems to me that the difficulty has increased at a rate that is more exponential than linear with design complexity. Some version of Moore’s law for design is at work. The challenges for advanced designs just seem to keep mounting. A new item that is top of mind for many executives is the talent… Read More
EDA in the Cloud with Siemens EDA at #59DAC
Tuesday at DAC I had the pleasure of attending the Design on Cloud Theatre where experts from Siemens EDA gave an update on what they’ve been offering to IC and systems designers. I remember attending a cloud presentation from Craig Johnson in 2021, so I was keen to note what had changed in the past 12 months.
TSMC N3 Process Technology Wiki