3D-IC design can be both exciting and frustrating. It’s exciting because it opens a new world of innovation possibilities – opportunities that aren’t constrained by the rules of monolithic chip scaling. It can be frustrating because of the large array of complex technical challenges that must be overcome to make this new paradigm… Read More
MZ Technologies Enables Multi-Die Design with GENIO
MZ Technologies is a unique company that enables multi-die design by providing critical planning and analysis tools that sit above the traditional EDA design flow. Chip and package design tools are good at what they do. Given a set of constraints, they will deliver a good result. The question is, what is the right set of constraints? … Read More
How MZ Technologies is Making Multi-Die Design a Reality
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
Outlook 2024 with Anna Fontanelli Founder & CEO MZ Technologies
I spoke with Anna again at the Chiplet Summit this week, we had previously spoken at DAC 2023. MZ is short for Monozukuri which is a Japanese term that translates to “making things” or “manufacturing.” In a broader sense, it refers to the art, science, and craftsmanship of creating products which fit chiplets… Read More
CEO Interview: Anna Fontanelli of MZ Technologies
Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies. She has pioneered the study and development of several generations of IC and package co-design environments and has held senior positions at leading semiconductor and EDA … Read More