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Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
by Mike Gianfagna on 03-19-2026 at 8:00 am

Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Enablement

The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More


Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design

Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design
by Bernard Murphy on 03-19-2026 at 6:00 am

Fuse Agentic System

Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More


Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer

Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer
by Kalar Rajendiran on 03-18-2026 at 10:00 am

Rasterization Polygon to pixel based representation

As semiconductor manufacturing pushes deeper into the nanometer regime, computational lithography has evolved from a supporting step into a central pillar of advanced chip design. Mask synthesis, lithography simulation, and optical proximity correction (OPC) now demand unprecedented levels of accuracy and computational… Read More


Formal Verification Best Practices

Formal Verification Best Practices
by Daniel Payne on 03-17-2026 at 10:00 am

formal verification

How do I know when my hardware design is correct and meets all of the specifications? For many years the answer was simple, simulate as much as you can in the time allowed in the schedule and then hope for the best when silicon arrives for testing. There is a complementary method for ensuring that hardware design meets the specifications… Read More


AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent
by Daniel Nenni on 03-16-2026 at 1:30 pm

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More


Siemens Reveals Agentic Questa

Siemens Reveals Agentic Questa
by Bernard Murphy on 03-05-2026 at 6:00 am

Questa Agentic

There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More


Functional Safety Analysis of Electronic Systems

Functional Safety Analysis of Electronic Systems
by Daniel Payne on 03-04-2026 at 10:00 am

hyperlynx ams

Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More


Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
by Daniel Nenni on 02-24-2026 at 8:00 am

Siemens Acquires ASTER Technologies to Deliver Industry Leading PCB Test Engineering Solutions

Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More


Custom IC Design using Additive Learning

Custom IC Design using Additive Learning
by Daniel Payne on 02-19-2026 at 10:00 am

Additive learning engine

Custom IC design has demanding technical requirements to produce accurate simulation results for timing and power analysis in the shortest run times. EDA vendors have been rushing to use AI and ML technology to meet these analysis requirements. I attended a webinar from Siemens on accelerating iterative design cycles with Solido… Read More