We have been working with Keysight EDA for the past two years and it has been an honor. The technical depth we have reached with them is impressive. Niels Faché, VP & GM, Keysight EDA, is responsible for Keysight’s design and simulation portfolio. Niels has been part of the Keysight-Agilent-HP family since 1994 when HP acquired… Read More
Chiplets Open Pandora’s Box
Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More
Chiplet Summit 2024 Preview
The second annual Chiplet Summit is coming up and if it is anything like the first one it will not disappoint. Chiplets are a disruptive semiconductor technology that are already being used by the top semiconductor companies like Intel, Nvidia, AMD and others. These companies design their own chiplets so they are blazing the trail… Read More
How Disruptive will Chiplets be for Intel and TSMC?
Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
2024 Outlook with Matt Burns of Samtec
Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. It has been an honor working with Matt and his team for the last 3 years and I value… Read More
2024 Big Race is TSMC N2 and Intel 18A
There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.
From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More
Will Chiplet Adoption Mimic IP Adoption?
If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to chiplet-based architecture… Read More
Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More
When Will Structured Assembly Cross the Chasm?
First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, … Read More
Prototyping Chiplets from the Desktop!
S2C has been successfully delivering rapid SoC prototyping solutions since 2003 with over 600 customers, including 6 of the world’s top 10 semiconductor companies. I personally have been involved with the prototyping market for a good part of my career and know S2C intimately.
S2C is the leading independent global supplier… Read More
TSMC N3 Process Technology Wiki