SILVACO 051525 Webinar 800x100 v2
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Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity

Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
by Kalar Rajendiran on 02-25-2025 at 6:00 am

Synopsys HAV Product Family

Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More


Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration

Harnessing Modular Vector Processing for Scalable, Power-Efficient AI Acceleration
by Jonah McLeod on 02-24-2025 at 6:00 am

shutterstock 2425981653

The dominance of GPUs in AI workloads has long been driven by their ability to handle massive parallelism, but this advantage comes at the cost of high-power consumption and architectural rigidity. A new approach, leveraging a chiplet-based RISC-V vector processor, offers an alternative that balances performance, efficiency,… Read More


Outlook 2025 with David Hwang of Alchip

Outlook 2025 with David Hwang of Alchip
by Daniel Nenni on 02-17-2025 at 10:00 am

Dave Huang

Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit.  He also serves as Senior Vice President, Business Development.  Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC.  He holds… Read More


2025 Outlook Anna Fontanelli MZ Technologies

2025 Outlook Anna Fontanelli MZ Technologies
by Daniel Nenni on 02-12-2025 at 10:00 am

ANNA

Anna Fontanelli, CEO of MZ Technologies, is a silicon executive with more than 35 years of expertise in managing complex R&D organizations/programs to give birth to innovative EDA technologies. Strong communication skills and proven ability to lead distributed, cross functional teams in international environments.… Read More


Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures

Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
by Kalar Rajendiran on 02-12-2025 at 6:00 am

Chiplets A New Abstraction Layer

The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More


Chiplets-Based Systems: Keysight’s Role in Design, Testing, and Data Management

Chiplets-Based Systems: Keysight’s Role in Design, Testing, and Data Management
by Kalar Rajendiran on 02-11-2025 at 6:00 am

Voltage Transfer Function Crrosstalk Limit

Keysight, with deep roots tracing back to Hewlett-Packard, has long been at the forefront of innovation in electronic design and testing. It manufactures electronics test and measurement equipment and software. The company also owns its own foundry and makes custom chips and packages for its instrumentation business. Many… Read More


Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


ML and Multiphysics Corral 3D and HBM

ML and Multiphysics Corral 3D and HBM
by Bernard Murphy on 01-07-2025 at 6:00 am

multidie and HBM stacks min

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More


Accelerating Automotive SoC Design with Chiplets

Accelerating Automotive SoC Design with Chiplets
by Kalar Rajendiran on 01-02-2025 at 10:00 am

System Chiplet

The automotive industry is evolving rapidly with the increasing demand for intelligent, connected, and autonomous vehicles. Central to this transformation are System-on-Chip (SoC) designs, which integrate multiple processing units into a single chip for managing everything from safety systems to in-car entertainment.… Read More


Scaling AI Data Centers: The Role of Chiplets and Connectivity

Scaling AI Data Centers: The Role of Chiplets and Connectivity
by Kalar Rajendiran on 11-26-2024 at 6:00 am

Building the Modern Data Centre AI Compute Nodes

Artificial intelligence (AI) has revolutionized data center infrastructure, requiring a reimagining of computational, memory, and connectivity technologies. Meeting the increasing demand for high performance and efficiency in AI workloads has led to the emergence of innovative solutions, including chiplets, advanced… Read More