Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More
Artificial Intelligence
Mach42 Delivers a Different Take on AI in the Design Flow at DAC 2026
I believe DAC 2026 will be remembered as the turning point for AI assisted design. There has been discussion about AI infusion in EDA for a while now. Most of it was about how AI can be added to traditional tools to make existing methodologies better. This year, that changed. There were several new companies that highlighted a fundamentally… Read More
The AI Genie Is Out of the Bottle and Won’t Go Back
This week, Meta became the fourth major AI lab in two weeks to disclose that one of its own models breached another company’s systems during a security test. The company says a misconfiguration by an outside evaluator handed its Muse Spark 1.1 model internet access it wasn’t supposed to have — an accident in the test … Read More
DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification
AI was a hot topic at DAC this year. If you attended the event, you’ve already heard about many new tools and systems that aim to improve time to market and quality for advanced semiconductors and systems. I had the pleasure of chairing an Accellera sponsored luncheon panel on Tuesday at DAC that took a different view of AI.
As AI and … Read More
CEO Interview with Joseph Krause of Radical AI
Joseph F. Krause is an American materials scientist, entrepreneur, and U.S. Army National Guard veteran. He is the cofounder and CEO of Radical AI, a New York deep-tech startup founded to accelerate the discovery of advanced materials.
Before Radical AI, Krause conducted nanomaterials research at Rice University, worked on… Read More
The Difference Between TSMC CoWoS-S and CoWoS-R
CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More
Industry’s First Certified Automotive Grade PUF for Software Defined Vehicles
Software defined vehicles (SDVs) are transforming the automotive industry. Today’s vehicles are connected computing platforms that rely on advanced processors, artificial intelligence (AI), over the air (OTA) software updates, cloud services, and vehicle to everything (V2X) communications. Every electronic … Read More
Rethinking Formal Verification in the AI Era
By Kanav Arora, ML Researcher at ChipAgents
Most hardware teams already understand why formal verification matters. It can expose corner cases that simulation may never reach and establish critical behaviors across the modeled state space.
The unresolved question is not whether formal works. It is why formal remains a specialist… Read More
From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems
Every generation of semiconductor innovation has relied on one fundamental principle: before a technology can be manufactured at scale, it must first be understood. That understanding comes through characterization.
For decades, characterization enabled process learning. It helped engineers understand transistor behavior,… Read More
Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman
Daniel is joined by David Liberman, a Los Angeles-based futurist, serial entrepreneur, investor, and former Director of Products at Snap, as well as the co-creator of the Gonka protocol. Gonka is a decentralized protocol that connects people who need computing power for AI with operators who provide GPU hardware. Its goal is … Read More


Intel and TSMC Take Different Paths to High-NA EUV