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Artificial Intelligence
Over the last year, the EDA industry has started using a new vocabulary: agents, super agents, mental models, native skills, playbooks, RAG, MCP, autonomous workflows, and AI-first design.
The language is new, but the motivation is familiar to anyone who has worked in chip design.
Design complexity keeps increasing. The number… Read More
Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More
Most crypto forty-niners died broke in a warehouse full of their computing rigs. Former Ethereum miner CoreWeave took its gold to Wall Street. On June 22, 2026, it joined the Nasdaq-100 — fifteen months after its IPO, nine years after its founders assembled their first GPU rig in a New Jersey office.
The people who built the physical… Read More
The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.
The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More
Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming.… Read More
Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More
Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More
QED (Quick Error Detection) can be a powerful complementary addition to verification but can be subject to size constraints. This month’s paper looks at a fix for that limitation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More
Based on Dylan Patel’s SEMI Industry Strategy Symposium (ISS): Tokens to Infrastructure presentation, one of the most important themes is the emergence of the AI Economic Stack, where every layer of artificial intelligence—from semiconductor manufacturing to cloud infrastructure, model providers, and applications—is… Read More
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
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The Packaging PDK Is the Missing Layer for Co-Packaged Optics