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Artificial Intelligence
Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More
On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More
Over the last year, the EDA industry has started using a new vocabulary: agents, super agents, mental models, native skills, playbooks, RAG, MCP, autonomous workflows, and AI-first design.
The language is new, but the motivation is familiar to anyone who has worked in chip design.
Design complexity keeps increasing. The number… Read More
Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More
Most crypto forty-niners died broke in a warehouse full of their computing rigs. Former Ethereum miner CoreWeave took its gold to Wall Street. On June 22, 2026, it joined the Nasdaq-100 — fifteen months after its IPO, nine years after its founders assembled their first GPU rig in a New Jersey office.
The people who built the physical… Read More
The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.
The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More
Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming.… Read More
Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More
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TSMC CoWoS versus Intel EMIB Semiconductor Packaging