An effective learned power model for a CPU could be a significant advantage in early estimation of power performance against realistic workloads in complex architectures. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More
Artificial Intelligence
CEO Interview with Lisa Spelman of Cornelis
Lisa Spelman is CEO of Cornelis, where she leads the company’s efforts to advance high-performance networking for AI and HPC infrastructure. She brings more than 20 years of experience across AI, cloud, enterprise infrastructure, data center operations, product strategy, and go-to-market leadership.
Before joining Cornelis,… Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
By Gleb Tsipursky
SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More
Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent Networks
Last year I wrote about Arteris’ introduction of multi-die support for coherent NoCs. This is a very big deal because hyperscalers and OEMs are now building large systems that depend on multi-chiplet architectures and require efficient traffic management between chiplets, in one case as many as 12 compute, fabric/cache and … Read More
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More
Who Gets to Move the Recipe? How Autonomous Agents Earn Decision Authority in the Fab
by Ajay Kumar Govindaram
There’s a question I’ve started asking at every agentic AI demo I sit through, and it has a clean answer in every fab on earth: who is allowed to change the recipe? In a semiconductor factory, that was settled decades ago. A person doesn’t touch a production recipe because they feel confident.… Read More
Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering
At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with AI in the design loop. As reported from the session by ServeTheHome and Tom’s Hardware, OpenAI showed measured block-level wins over a human baseline — 56% on a BF16 multiply, alongside a 10% smaller matrix-unit area — within a roughly nine-month path from… Read More
Why Semiconductor AI Starts with Data, Not Algorithms
The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions.
By Sriram Nithin Gopal Lanka
Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to work. But ask the engineers… Read More
Why AI Security Starts at the Chip Level
Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital services. As these systems grow more capable, they also process more sensitive information and depend on increasingly complex hardware. The Synopsys white paper, “Securing… Read More


TSMC’s Patent and the Harsh Realities of 3D DRAM Competition