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The AI Genie Is Out of the Bottle and Won’t Go Back

The AI Genie Is Out of the Bottle and Won’t Go Back
by Jonah McLeod on 08-05-2026 at 2:00 pm

Genie out of Bottle Final

December 2025. Inside an Alibaba-affiliated lab, an agent called ROME, mid-training, quietly diverts GPU capacity for itself and opens a hidden channel to the outside world. Nobody told it to.

March 2026. Amazon’s retail site goes dark for six hours. An AI agent feeds an engineer bad information. He believes it.

Also disclosedRead More


DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification

DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification
by Mike Gianfagna on 08-04-2026 at 2:00 pm

DAC 2026 Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification

AI was a hot topic at DAC this year. If you attended the event, you’ve already heard about many new tools and systems that aim to improve time to market and quality for advanced semiconductors and systems. I had the pleasure of chairing an Accellera sponsored luncheon panel on Tuesday at DAC that took a different view of AI.

As AI and … Read More


CEO Interview with Joseph Krause of Radical AI

CEO Interview with Joseph Krause of Radical AI
by Daniel Nenni on 08-02-2026 at 6:00 pm

joseph headshot1

Joseph F. Krause is an American materials scientist, entrepreneur, and U.S. Army National Guard veteran. He is the cofounder and CEO of Radical AI, a New York deep-tech startup founded to accelerate the discovery of advanced materials.

Before Radical AI, Krause conducted nanomaterials research at Rice University, worked on… Read More


The Difference Between TSMC CoWoS-S and CoWoS-R

The Difference Between TSMC CoWoS-S and CoWoS-R
by Daniel Nenni on 07-31-2026 at 6:00 am

The Difference Between CoWoS S and CoWoS R

CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More


Industry’s First Certified Automotive Grade PUF for Software Defined Vehicles

Industry’s First Certified Automotive Grade PUF for Software Defined Vehicles
by Kalar Rajendiran on 07-30-2026 at 10:00 am

Automotive PUF Premium System Level Diagram

Software defined vehicles (SDVs) are transforming the automotive industry. Today’s vehicles are connected computing platforms that rely on advanced processors, artificial intelligence (AI), over the air (OTA) software updates, cloud services, and vehicle to everything (V2X) communications. Every electronic … Read More


Rethinking Formal Verification in the AI Era

Rethinking Formal Verification in the AI Era
by Admin on 07-27-2026 at 10:00 am

AI driven formal verification

By Kanav Arora, ML Researcher at ChipAgents

Most hardware teams already understand why formal verification matters. It can expose corner cases that simulation may never reach and establish critical behaviors across the modeled state space.

The unresolved question is not whether formal works. It is why formal remains a specialist… Read More


From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems

From Process Learning to Production Control: Characterization for the Era of Heterogeneous Systems
by Kalar Rajendiran on 07-27-2026 at 6:00 am

Chiplets Have Changed the Test Paradigm

Every generation of semiconductor innovation has relied on one fundamental principle: before a technology can be manufactured at scale, it must first be understood. That understanding comes through characterization.

For decades, characterization enabled process learning. It helped engineers understand transistor behavior,… Read More


Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman

Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman
by Daniel Nenni on 07-24-2026 at 2:00 pm

Daniel is joined by David Liberman, a Los Angeles-based futurist, serial entrepreneur, investor, and former Director of Products at Snap, as well as the co-creator of the Gonka protocol. Gonka is a decentralized protocol that connects people who need computing power for AI with operators who provide GPU hardware. Its goal is … Read More


Agentrys Designs a Real Chip with its Multi-Agent Workforce

Agentrys Designs a Real Chip with its Multi-Agent Workforce
by Mike Gianfagna on 07-23-2026 at 2:00 pm

Agentrys Designs a Real Chip with its Multi Agent Workforce

The face of EDA is changing. For forty years, this industry has focused on optimizing algorithms for design, verification and implementation of chips. That work has delivered some ground-breaking innovations. Logic synthesis is a good example. There are so many more. Thanks to the innovations commonly referred to as FrontierRead More


Must-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?

Must-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?
by Mike Gianfagna on 07-23-2026 at 10:00 am

Panel

This year, DAC will be buzzing about AI from every direction. The debate of build vs. buy will also be a popular topic. And the debate of who owns the intellectual property embodied in chip designs and how to control it will also get a significant amount of airtime. These are all interesting and compelling discussion points. It turns… Read More