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The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.
And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.… Read More
For decades, chipmakers improved computing performance largely by putting more capable circuitry on a piece of silicon. That remains important, but AI is exposing its limits. Large models demand enormous amounts of data movement, sustained power and effective cooling. A fast processor cannot deliver its full benefit if memory… Read More
TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More
Wow, OpenAI and Synopsys just announced a multiyear partnership to develop GPT-Synopsys, a specialized artificial intelligence model for semiconductor design. The agreement combines OpenAI’s frontier models with Synopsys’ electronic design automation software and engineering expertise. Its ambition is to help engineers… Read More
I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More
Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More
The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More
By Piyush Bag
Intro: In this AI era, building data centers has become crucial not just for hyperscalers, but for many companies as well, as they build the infrastructure for AI. At a high level, a data center includes compute, storage, networking, and other infrastructure. This article is about the design lifecycle of network hardware.… Read More
Synopsys today announced its AgentEngineerTM solutions portfolio and AutopilotTM Platform, advancing a fundamental paradigm shift in electronic design automation (EDA): moving beyond AI copilots toward autonomous engineering agents. Following a recent technical briefing with Thomas Andersen, Vice President of AI and… Read More
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More
The Invisible Bottleneck Is Costing You Time You Can’t Get Back