webinar banner AI 2026 v2
WP_Term Object
(
    [term_id] => 6435
    [name] => AI
    [slug] => artificial-intelligence
    [term_group] => 0
    [term_taxonomy_id] => 6435
    [taxonomy] => category
    [description] => Artificial Intelligence
    [parent] => 0
    [count] => 862
    [filter] => raw
    [cat_ID] => 6435
    [category_count] => 862
    [category_description] => Artificial Intelligence
    [cat_name] => AI
    [category_nicename] => artificial-intelligence
    [category_parent] => 0
    [is_post] => 
)

WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools

WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
by Daniel Nenni on 07-02-2026 at 2:00 pm

webinar square AI 2026 v2

The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.

The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More


Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late

Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late
by Mike Gianfagna on 07-02-2026 at 10:00 am

Webinar Caspia Shows You How to Fix Security Flaws Before It’s Too Late FINAL V2

Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming.… Read More


Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test

Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test
by Mike Gianfagna on 07-02-2026 at 6:00 am

Why Real Time Intelligence is the Next Differentiator in Semiconductor Test

Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More


Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
by Daniel Nenni on 07-01-2026 at 10:00 am

Why Huawei Says It Will Match TSMC's Most Advanced Chips by 2031

Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More


Applying QED to Hardware Accelerator Verification. Innovation in Verification

Applying QED to Hardware Accelerator Verification. Innovation in Verification
by Bernard Murphy on 06-30-2026 at 6:00 am

Innovation New

QED (Quick Error Detection) can be a powerful complementary addition to verification but can be subject to size constraints. This month’s paper looks at a fix for that limitation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More


From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AI

From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AI
by Daniel Nenni on 06-29-2026 at 10:00 am

Why Compute, Memory, and Power Will Determine the Future of AI

Based on Dylan Patel’s SEMI Industry Strategy Symposium (ISS): Tokens to Infrastructure presentation, one of the most important themes is the emergence of the AI Economic Stack, where every layer of artificial intelligence—from semiconductor manufacturing to cloud infrastructure, model providers, and applications—is… Read More


How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
by Mike Gianfagna on 06-25-2026 at 10:00 am

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.

llmda.aiRead More


COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era

COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
by Daniel Nenni on 06-25-2026 at 6:00 am

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COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More


The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story

The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story
by Jonah McLeod on 06-24-2026 at 2:00 pm

Open AI Illustration

Every family has that one wedding where, halfway through the toasts, someone leans over and whispers “wait, who’s paying for all this?” This is that wedding. OpenAI and Broadcom are the happy couple. Apollo Global Management walked the bride down the aisle. Nvidia may have just stood up to offer a toast, a very… Read More


All-Embracing Multiphysics Analysis for Chiplet-Based Systems

All-Embracing Multiphysics Analysis for Chiplet-Based Systems
by Bernard Murphy on 06-24-2026 at 6:00 am

Revised multiphysics graphic

What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More