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A tower-like heterogeneous packaging architecture for the AI era

A tower-like heterogeneous packaging architecture for the AI era
by Moh Kolb on 06-16-2026 at 6:00 am

Picture1 VTEMC

For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration architectures.… Read More


Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner

Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner
by Kalar Rajendiran on 06-15-2026 at 6:00 am

ESDA Panel Session June 10, 2026 IMG 6708

Highlights from a recent panel session moderated by Ed Sperling (Semiconductor Engineering) featuring Walden Rhines (Silvaco), Vincent Wong (Verific), Dave Kelf (Breker Verification Systems), Shelly Henry (MooresLab AI), Ann Wu (Silimate), and Cindy Cui (ChipAgents). The panel session was hosted by Electronic System … Read More


WEBINAR: Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?

WEBINAR: Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?
by Mike Gianfagna on 06-11-2026 at 8:00 am

llmda homepage block (2)

Embedded systems programs rarely fail because of a lack of execution capability. They fail because critical engineering documentation drifts out of alignment over time and distance. Simply put, the team is correctly following the wrong instructions. This includes requirements, architecture, implementation, verification,… Read More


Disaggregating AI Compute to Break the Tokens Barrier

Disaggregating AI Compute to Break the Tokens Barrier
by Bernard Murphy on 06-10-2026 at 6:00 am

Before and after with token servers

Among several topics dominating news streams these days, giant datacenters are a leading theme. They point to an AI-centric future while raising real concerns about sustainability and scalability. Certainly land, power and water demand are very present concerns for most of us, witness growing pushback against building new… Read More


Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory Modules

Rambus Delivers Complete DDR5 Client Chipset for High-Speed CUDIMM and CSODIMM Memory Modules
by Daniel Nenni on 06-09-2026 at 8:00 am

Rambus DDR5 9600 Client Memory Module Chipset

The rapid emergence of AI-enabled personal computers is driving unprecedented demand for higher memory bandwidth, improved signal integrity and greater system reliability. To address these requirements, Rambus has introduced a complete client memory interface chipset for Clocked Unbuffered Dual In-Line Memory Modules… Read More


From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization

From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization
by Moh Kolb on 06-09-2026 at 6:00 am

Picture1 BGA JUne2

Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More


Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.

Broadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.
by Jonah McLeod on 06-08-2026 at 8:00 am

Black Friday

Hock Tan and his CFO Kirsten Spears logged into the June 3 earnings call with numbers that should have satisfied anyone. AI semiconductor revenue hit $10.8 billion in Q2, up 143% year over year, above Broadcom’s own forecast. Full-year AI guidance went to $56 billion. The $100 billion fiscal 2027 target was reaffirmed. By any prior… Read More


Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta

Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta
by Daniel Nenni on 06-05-2026 at 10:00 am

Daniel is joined by Nagesh Gupta, CEO of llmda.ai. Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor. He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators… Read More


An Update on IP Lifecycle Management (IPLM)

An Update on IP Lifecycle Management (IPLM)
by Bernard Murphy on 06-03-2026 at 6:00 am

IP Lifecycle Management

IPLM is not always prominent, nevertheless it is a very necessary aspect of semiconductor (and systems) design. Modern designs build on a wide range of IPs and subsystems, each evolving through multiple variants and versions, each with different PPA characteristics and recommended use-cases, many from different suppliers… Read More


Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them Consistent

Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them Consistent
by Mike Gianfagna on 06-02-2026 at 8:00 am

If You Struggle with Up To Date Documentation llmda.ai Can Help

Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency. Errors that drive… Read More