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Podcast EP363: The Impact of an AI Factory on Production Deployment with NeuReality’s Moshe Tanach

Podcast EP363: The Impact of an AI Factory on Production Deployment with NeuReality’s Moshe Tanach
by Daniel Nenni on 08-28-2026 at 10:00 am

Daniel is joined by Moshe Tanach, co-founder and CEO of NeuReality. Prior to founding the company, he held senior engineering leadership roles at Marvell and Intel, where he led complex wireless and networking products from architecture through mass production. He also served as AVP of R&D at DesignArt Networks (later acquired… Read More


Will Agentic AI Help the Open-Source EDA Market?

Will Agentic AI Help the Open-Source EDA Market?
by Daniel Nenni on 08-28-2026 at 8:00 am

Will Agentic AI Help the Open Source EDA Market

Agentic artificial intelligence is likely to give the open-source electronic design automation market a meaningful boost. Its biggest contribution will not be the immediate replacement of established commercial platforms from Cadence, Synopsys, or Siemens. Instead, agentic AI can make open-source tools easier to use, … Read More


AI-designed Chip Points Toward a Faster Future for Custom Silicon

AI-designed Chip Points Toward a Faster Future for Custom Silicon
by Daniel Nenni on 08-27-2026 at 10:00 am

AI Designed Chip Why Redwood Matters

Architect Labs says it has created Redwood, an AI accelerator designed and verified almost entirely by artificial intelligence in less than two weeks. If independently validated and successfully translated from a programmable prototype into manufactured silicon, the project could represent a major change in how computer… Read More


Bronco AI at DAC 2026, What a Difference a Year Makes

Bronco AI at DAC 2026, What a Difference a Year Makes
by Mike Gianfagna on 08-26-2026 at 6:00 am

Bronco AI at DAC 2026, What a Difference a Year Makes

During my time at DAC 2026 I felt like I was attending two events. One was the traditional DAC where approaches to designing complex chips using the best tools and methodologies were the focus. There was another focus for the conference. This one was like the traditional DAC with an important difference. Here, the discussion centered… Read More


Optimizing for Thermoelastic in Package and PCB Design from the Outset

Optimizing for Thermoelastic in Package and PCB Design from the Outset
by Bernard Murphy on 08-25-2026 at 6:00 am

Vinci image

Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More


Avestra: Agentic AI for SystemVerilog Assertion Generation

Avestra: Agentic AI for SystemVerilog Assertion Generation
by Daniel Nenni on 08-24-2026 at 2:00 pm

Avestra Studio Tuple Tech

Modern ASIC, SoC, CPU, and GPU development depends on verification processes that detect subtle functional defects before tapeout. SystemVerilog Assertions (SVA) are particularly important because they encode temporal design intent: how signals, states, and transactions must behave across clock cycles. Unlike conventional… Read More


Hot Chips: Evolving Memory Architectures for Artificial Intelligence

Hot Chips: Evolving Memory Architectures for Artificial Intelligence
by Admin on 08-24-2026 at 10:00 am

Evolving Memory Architectures for AI Hot CHips 2026

Artificial intelligence performance is increasingly constrained by memory rather than arithmetic throughput. Scaling laws show that model quality improves when parameter count, training data, and compute grow together, but this balance fails when processors cannot obtain operands quickly enough. Contemporary accelerators… Read More


How TSMC Is Wiring the AI Era With Light

How TSMC Is Wiring the AI Era With Light
by Daniel Nenni on 08-21-2026 at 10:00 am

How TSMC Is Wiring the AI Era With Light

TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More


Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes

Agentrys Shows You How to Build a Multi-Agent System in 30 Minutes
by Mike Gianfagna on 08-20-2026 at 2:00 pm

Agentrys Shows You How to Build a Multi Agent System in 30 Minutes

Agentrys believes that a purpose-built multi-agent system for chip design shouldn’t be a quarter-long project. Agentic AI systems are becoming quite popular to cut design time and increase quality for complex chip design projects. The challenge is finding the right agentic flow for a particular application. There are… Read More


PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.

PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.
by Kalar Rajendiran on 08-18-2026 at 2:00 pm

PDF Solutions Direct Connect Block

The semiconductor industry doesn’t have a shortage of data. It has a shortage of ways to turn that data into useful manufacturing insights quickly enough to matter.

That is the problem PDF Solutions’ Exensio solution has addressed for years. Built specifically for semiconductor manufacturing, Exensio brings … Read More