The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More
Perforce and Siemens Collaborate on 3DIC Design at the Chiplet Summit
The recent Chiplet Summit at the Santa Clara Convention Center was buzzing with many enabling technologies for chiplet-based design. Collaboration was also on display during many parts of the show. A presentation in the Siemens booth was a perfect example of both of those trends. In the Siemens booth, Perforce presented an excellent… Read More
Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems
The first article in this series examined how feasibility exploration enables architects to evaluate multi-die system configurations while minimizing early design risk. Once architectural decisions are validated, designers must translate conceptual connectivity requirements into physical interconnect infrastructure.… Read More
Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC
As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More
The 71st International Electron Devices Meeting (IEDM 2025)
It is hard to believe this conference is older than most all of the participants, including myself. The amount of history behind this conference is amazing. Back in 1955 the meeting began as the Electron Devices Meeting (EDM), organized by what later became the IEEE Electron Devices Society. Its core purpose was to bring together… Read More
The Chronicle of TSMC CoWoS
As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
Hierarchical Device Planning as an Enabler of System Technology Co-Optimization
AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More
Where is Quantum Error Correction Headed Next?
I have written earlier in this series that quantum error correction (QEC), a concept parallel to ECC in classical computing, is a gating factor for production quantum computing (QC). Errors in QC accumulate much faster than in classical systems, requiring QEC methods that can fix errors fast enough to permit production applications.… Read More
TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
Podcast EP324: How Dassault Systèmes is Creating the Next Generation of Semiconductor Design and Manufacturing with John Maculley
Daniel is joined by John Maculley, Global High-Tech Industry Strategy Consultant at Dassault Systèmes. John has over 20 years of experience advancing innovation across the semiconductor and electronics sectors. Based in Silicon Valley, he works with leading foundries, OSATs, design houses, and research institutes worldwide… Read More


Is Intel About to Take Flight?