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Breaking out of the ivory tower: 3D IC thermal analysis for all

Breaking out of the ivory tower: 3D IC thermal analysis for all
by Admin on 08-26-2025 at 6:00 am

figure 1

Todd Burkholder and Andras Vass-Varnai, Siemens EDA

As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More


PDF Solutions and the Value of Fearless Creativity

PDF Solutions and the Value of Fearless Creativity
by Mike Gianfagna on 08-18-2025 at 6:00 am

PDF Solutions and the Value of Fearless Creativity

PDF Solutions has been around for over 30 years. The company began with a focus on chip manufacturing and yield. Since the beginning, PDF Solutions anticipated many shifts in the semiconductor industry and has expanded its impact with enhanced data analytics and AI. Today, the company’s impact is felt from design to manufacturing,… Read More


Streamlining Functional Verification for Multi-Die and Chiplet Designs

Streamlining Functional Verification for Multi-Die and Chiplet Designs
by Daniel Nenni on 08-14-2025 at 6:00 am

Streamlining Functional Verification for Multi Die and Chiplet Designs

As multi-die and chiplet-based system designs become more prevalent in advanced electronics, much of the focus has been on physical design challenges. However, verification—particularly functional correctness and interoperability of inter-die connections—is just as critical. Interfaces such as UCIe or custom interconnects… Read More


XTCO: From Node Scaling to System Scaling

XTCO: From Node Scaling to System Scaling
by Admin on 08-10-2025 at 10:00 am

imec XTCO Image SemiWIki

imec XTCO (Cross-Technology Co-Optimization) is the natural successor to DTCO and STCO in an era where no single layer of the stack can deliver scaling alone. Instead of optimizing devices, interconnect, packaging, architecture, and software in isolation, XTCO treats them as one tightly coupled system with a shared budget … Read More


From Two Dimensional Growth to Three Dimensional DRAM

From Two Dimensional Growth to Three Dimensional DRAM
by Admin on 08-06-2025 at 10:00 am

Microsoft Word JAP25 AR 00479 art

Epitaxial stacks of silicon and silicon germanium are emerging as a key materials platform for three dimensional dynamic random access memory. Future DRAM will likely migrate from vertical channels to horizontally stacked channels that resemble the gate all around concept in logic. That shift demands a starter material made… Read More


Synopsys Webinar – Enabling Multi-Die Design with Intel

Synopsys Webinar – Enabling Multi-Die Design with Intel
by Mike Gianfagna on 08-04-2025 at 6:00 am

Synopsys Webinar – Enabling Multi Die Design with Intel

As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More


CoPoS is a Bigger Canvas for Chiplets and HBM

CoPoS is a Bigger Canvas for Chiplets and HBM
by Admin on 08-03-2025 at 10:00 am

Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round

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AI-Driven Verification: Transforming Semiconductor Design

AI-Driven Verification: Transforming Semiconductor Design
by Admin on 08-01-2025 at 8:00 am

DAC 62 Systems on Chips

In a DACtv session on July 9, 2025, Abhi Kolpekwar, Vice-President & General Manager at Siemens EDA, illuminated the transformative role of artificial intelligence (AI) in addressing the escalating challenges of semiconductor design verification. The presentation underscored the limitations of traditional methods… Read More


cHBM for AI: Capabilities, Challenges, and Opportunities

cHBM for AI: Capabilities, Challenges, and Opportunities
by Kalar Rajendiran on 07-31-2025 at 6:00 am

cHBM Panelists at Synopsys Executive Forum

AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More


Enabling the Ecosystem for True Heterogeneous 3D IC Designs

Enabling the Ecosystem for True Heterogeneous 3D IC Designs
by Kalar Rajendiran on 07-28-2025 at 10:00 am

The Shift to System Technology Co Optimization

The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More