imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Podcast EP346: How EMD Electronics Bridges the “Lab to Fab” Gap With Ganesh Panaman
Daniel is joined by Ganesh Panaman, the President of Intermolecular Services at EMD Electronics. In his current role, Ganesh is dedicated to accelerating product time-to-market, securing first-mover advantages on disruptive technologies, and actively engaging with the dynamic startup ecosystem in the Silicon Valley. … Read More
Sensing. A Quantum Tech Ready for Market?
While the quantum world revolves around quantum computing, (QC) there are a couple of other quantum technologies of note. I covered one of these, quantum communication, in a recent blog. Here I’ll introduce the other, quantum sensing. The goal is to use the high sensitivity of an individual quantum state to external factors such… Read More
#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry
The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of design automation. Held July 26–29, 2026, at the Long Beach Convention… Read More
Synopsys and TSMC Deepen AI Design Alliance: What It Means
A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More
Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration
The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More
The Shift to System-Level AI Drives Next-Generation Silicon
At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More
Closing the Reality Gap: A New Architecture for 1.8-Tb/s Chiplet Governance
Dr. Moh Kolbehdari is a Senior Lead Architect at Socionext, where he specializes in the industrialization of high-performance AI chiplets and 1.8-Tb/s interconnects. With over two decades of experience in SI/PI, electromagnetic field theory, and system-level architecture, he has been a pivotal force in bridging the gap between… Read More
proteanTecs at Chiplet Summit – Changing the Game for Health & Performance Monitoring of Chiplets
The recent Chiplet Summit 2026 was a great place to learn about new chiplet designs, emerging standards, and a growing array of support technologies to help design and manufacture chiplet-based systems. In my travels at the show, I found a lot of technology that fit these descriptions. But there were also companies at the show that… Read More
CEO Interview with Dr. Hardik Kabaria of Vinci
Hardik Kabaria is the founder and CEO of Vinci, a frontier lab building systems that make physical reality continuously computable.
While software has become programmable, physics has remained episodic—accessed through discrete simulations and approximations. Vinci is changing that. Under Kabaria’s leadership, the company


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools