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Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.
Not long ago,… Read More
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
AI is exploding everywhere. We’ve all seen the evidence. The same thing is happening with AI conferences. The conference I will discuss here began in 2018 as the AI Hardware Summit. The initial venue was the Computer History Museum in Mountain View, CA. Like most things AI, this conference has grown substantially in a relatively… Read More
My recent post on a high-profile chip performance issue got me thinking. The root cause of the problem discussed there had to do with a clock tree circuit that was particularly vulnerable to reliability aging under elevated voltage and temperature. Chip aging effects have always got my attention. I’ve lived through a few of them… Read More
Post-Quantum Cryptography, or PQC provides a technical approach to protect encrypted data and connections when quantum computers can cost-effectively defeat current approaches. Exactly when this will occur is open to much discussion, but the fact is this day is coming, some say in ten years. One of the imperatives is to deploy… Read More
It’s a fact of life that technology marches on. Older process nodes get replaced by newer ones. As a result, ASSPs and FPGAs are obsoleted, leaving behind large system design investments that need to re-done. Since many of these obsolete designs are performing well in the target application, this re-do task can be particularly … Read More
2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More
The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
We‘re all aware of the challenges aging brings. I find the older I get, the more in touch I feel with those challenges. I still find it to be true that aging beats the alternative. I think most would agree. Human factors aside, I’d like to discuss the aging process as applied to the realm of semiconductor device physics. Here, as with… Read More
Designing custom silicon for AI applications is a particularly vexing problem. These chips process enormous amounts of data with a complex architecture that typically contains a diverse complement of heterogeneous processors, memory systems and various IO strategies. Each of the many subsystems in this class of chip will … Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys