Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More
Author: Kalar Rajendiran
Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability
Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
The surge in Edge AI applications has propelled the need for architectures that balance performance, power efficiency, and flexibility. Architectural choices play a pivotal role in determining the success of AI processing at the edge, with trade-offs often necessary to meet the unique demands of diverse workloads. There are… Read More
Successful 3DIC design requires an integrated approach
While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems
The automotive industry is undergoing a major transformation; it is not about just connectivity and convenience anymore. Data is emerging as the driving force behind innovation and safety with vehicles becoming sophisticated data-driven machines. By unlocking the power of data, we can create safer vehicles and roads and usher… Read More
Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers
Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More
Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design
The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More
proteanTecs On-Chip Monitoring and Deep Data Analytics System
State-of-the-art electronics demand high performance, low power consumption, small footprint and high reliability from their semiconductor products. While this imperative is true across many different market segments, it is critical for applications such as the automotive/autonomous driving and data centers. As electronic… Read More
Transformers Transforming the Field of Computer Vision
Over the last few years, transformers have been fundamentally changing the nature of deep learning models, revolutionizing the field of artificial intelligence. Transformers introduce an attention mechanism that allows models to weigh the importance of different elements in an input sequence. Unlike traditional deep learning… Read More
CHIPS Act dies because employees are fired – NIST CHIPS people are probationary