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The current Coronavirus crisis is inflicting a lot of pain on people, companies, and governments. I hope I am not getting in trouble with my reasoning, but if you look closely, there are also some “positives” to the Covid-19 crisis.
– It is stress-testing our infrastructure and telling us where we need to improve – as country,… Read More
TSMC as Pure Play Wafer Foundry
TSMC started its wafer foundry business more than 30 years ago. Visionary management and creative engineering teams developed leading-edge process technologies and their reputation as trusted source for high-volume production. TSMC also recognized very early the importance of building an … Read More
I had the opportunity to preview the upcoming SemiWiki webinar titled: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs. John Park’s message, describing this powerful Cadence solution, really impressed me. That’s why I want to encourage you to register for it and join this SemiWiki … Read More
Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More
Following Moore’s Law down to 10 or even 7 nm labeled feature size demands US $ hundreds of millions of up-front investment, a very large design team and two or more years of development time. These parameters suggest that it only makes sense for very high volume applications to continue on the shrink path to increase SoCs’ functionalities.… Read More
At TSMC’s latest earnings call held mid January 2014, an analyst asked TSMC for a revenue forecast for their emerging 2.5/3D product line. C.C. Wei, President and Co-CEO answered: “800 Million Dollars in 2016 ”. TSMC has demonstrated great vision many times before. For me, an enthusiastic supporter of this technology, this statement… Read More
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