Keynotes commonly provide a one-sided perspective of a domain, either customer-centric or supplier-centric. Kudos therefore to Cadence’s Paul Cunningham for breaking the mold in offering the first half of his keynote to Anthony Hill, a TI fellow, to talk about outstanding challenges he sees in verification for automotive … Read More
Author: Bernard Murphy
Challenge and Response Automotive Keynote at DVCon
Automotive Electronics Trends are Shaping System Design Constraints
Something is brewing in automotive electronics. Within a one-month window most of the product announcements and pitches to which I am being invited are on automotive topics. Automotive markets have long been one of the primary targets for suppliers to system designers, but this level of alignment in announcements seems more … Read More
Siemens Promotes Digital Threads for Electronic Systems Design
Many years ago, I remember discussions around islands of automation/silos. Within the scope of any given silo there is plenty of automation to handle tasks relevant to that phase. But managing the full lifecycle from concept through manufacturing to field support must cross between silos, and those transitions are not as clean… Read More
BDD-Based Formal for Floating Point. Innovation in Verification
A different approach to formally verifying very challenging datapath functions. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome. We’re planning to add a wrinkle… Read More
Arm Neoverse Continues to Claim Territory in Infrastructure
After owning general purpose compute in cell phones and IoT devices, it wasn’t clear what Arm’s next act might be. Seemingly the x86 giants dominated in datacenters and auguries suggested a bloody war in smaller platforms between Arm and RISC-V. But Arm knew what they were doing all along, growing upwards into infrastructure:… Read More
Cadence Debuts Celsius Studio for In-Design Thermal Optimization
Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You should know first that Melika has a PhD in mechanical engineering and an extensive background in thermal engineering at Broadcom and Qualcomm, all very… Read More
Moderating Our Open Chiplet Enthusiasm. A NoC Perspective
I recently talked with Frank Schirrmeister (Solutions & Business Development, Arteris) on the state of progress to the open chiplet ideal. You know – where a multi-die system in package can be assembled with UCIe (or other) connections seamlessly connecting data flows between dies. If artificial general intelligence and… Read More
SOITEC Pushes Substrate Advantages for Edge Inference
You might not immediately see a connection between semiconductor substrate choices and inference at the edge. These technology layers seem worlds apart and yet SOITEC have a point. Edge AI has rapidly evolved from simple CNNs to now complex reinforcement learning systems and transformer based LLMs. Even when shrunk to edge footprints,… Read More
Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI
A recent TechSpot article suggests that Apple is moving cautiously towards release of some kind of generative AI, possibly with iOS 18 and A17 Pro. This is interesting not just for Apple users like me but also for broader validation of a real mobile opportunity for generative AI. Which honestly had not seemed like a given, for multiple… Read More
Cadence Claims the CFD High Ground with a New GPU-Based Accelerator
For observers of EDA markets there is an easily overlooked opportunity for new growth. Today around 50% of EDA revenues come from systems rather than semiconductor companies, from datacenters to automotive, aerospace, energy, and others. In most of these industries total system design depends as much on mechanical and other… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay