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The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of design automation. Held July 26–29, 2026, at the Long Beach Convention Center in California, DAC continues its evolution from a traditional Electronic Design Automation (EDA) conference into a broader “Chips to Systems” platform that connects silicon, software, packaging, AI infrastructure, and system architecture.
For more than six decades, DAC has been the premier venue for presenting advances in semiconductor design methodologies, verification technologies, physical implementation, IP integration, and system design. In 2026, however, the conference reflects a profound transformation occurring across the semiconductor ecosystem. AI is no longer simply an application workload driving demand for compute; it is now fundamentally reshaping the design process itself. DAC 2026 highlights this transition with more than half of the conference program focused on AI-related design topics and a significant increase in engineering and research submissions.
One of the central themes at DAC 2026 is AI-driven EDA. Machine learning and generative AI technologies are rapidly being incorporated into synthesis, floor-planning, verification, timing closure, and design-space exploration. Researchers and commercial EDA vendors are increasingly using large language models (LLMs), graph neural networks (GNNs), and reinforcement learning algorithms to optimize chip development flows and reduce time-to-market. Recent academic research discussed alongside DAC emphasizes autonomous or “agentic” chip design, where AI systems can iteratively refine architectures and physical implementations with minimal human intervention.
Another major focus area is chiplet-based design and heterogeneous integration. As Moore’s Law scaling becomes more economically challenging, semiconductor companies are moving toward modular architectures that combine multiple dies in advanced packages. DAC 2026 features extensive discussion around multi-die systems, 2.5D and 3D integration, die-to-die interconnect standards, thermal management, and co-optimization across packaging and silicon. The conference reflects the growing importance of system technology co-optimization (STCO), where performance, power, cost, and manufacturability are optimized simultaneously at the package and system level rather than purely at the transistor level.
Verification and security also remain critical topics at DAC 2026. Modern AI accelerators, automotive processors, and cloud-scale SoCs have become so complex that verification consumes the majority of design cycle resources. AI-assisted verification techniques are gaining traction, particularly in automated test generation, bug localization, assertion creation, and hardware/software co-validation. At the same time, hardware security concerns—including supply chain trust, side-channel attacks, and secure chiplet integration—are driving new research into resilient architectures and trusted design methodologies.
DAC 2026 also demonstrates the expanding intersection between semiconductor design and system-level applications. Sessions increasingly cover automotive electronics, data center infrastructure, robotics, aerospace, edge AI, and cloud-native design methodologies. This broadening scope reflects the reality that semiconductor innovation is now tightly coupled with software stacks, AI frameworks, networking architectures, and energy-efficient computing platforms. The conference’s “Chips to Systems” branding underscores this industry shift toward holistic platform engineering.
The exhibition floor at DAC 2026 showcases the commercial dimension of these technology trends. More than 120 companies are participating, including established EDA leaders, semiconductor manufacturers, cloud infrastructure providers, AI startups, and emerging design automation firms. The strong participation of AI-focused companies highlights how the EDA landscape is evolving beyond traditional CAD tools into intelligent design ecosystems powered by data analytics and automation.
Keynotes at DAC 2026 further reinforce the industry’s strategic direction. Speakers from quantum computing, advanced wireless systems, and AI infrastructure sectors emphasize the convergence of compute architectures, software intelligence, and semiconductor innovation. Topics such as AI-native infrastructure, quantum system design, and energy-efficient acceleration illustrate how future semiconductor competitiveness will depend on interdisciplinary optimization across the entire technology stack.
Bottom line: DAC 2026 reflects a semiconductor industry at a major inflection point. Traditional EDA methodologies are evolving into AI-augmented and increasingly autonomous design environments, while system complexity is driving unprecedented collaboration between chip designers, software developers, packaging engineers, and cloud architects. As the semiconductor ecosystem moves toward intelligent, heterogeneous, and system-centric computing platforms, DAC remains the industry’s most influential forum for defining the next generation of electronic design innovation.
Step into the future of semiconductor design management with IPLM: Future Forward, a product-led webinar showcasing the latest developments in Perforce IPLM. This focused session is designed to show how modern teams can tackle growing design complexity while still accelerating innovation.
Hosted by IPLM Senior Product Manager, Hassan Shah and Senior Product Owner, Rien Gahlsdorf, this webinar delivers a firsthand look at the latest enhancements, workflow improvements, and what’s coming next for IP lifecycle management.
Whether you’re managing IP, leading engineering teams, or driving product development strategy, you’ll gain practical insights into how to improve efficiency, performance, security, and traceability across your design environments.
What You’ll Learn
In this session, the Perforce product team will explore:
How new IPLM capabilities improve workflow efficiency
Including enhancements like server-side conflict resolution and UI updates designed to reduce friction in daily design tasks.
Performance gains from a modernized tech stack
Learn how updates like the move to Neo4j 5 help reduce latency and improve responsiveness at scale—especially for large, complex datasets.
Stronger end-to-end traceability across the design lifecycle
See how new features give teams clearer visibility into IP status, usage, and history for reduced risk and greater design integrity.
A preview of what’s next for Perforce IPLM
Get an early look at upcoming innovations shaping the future of IP lifecycle management, including MCP server integration.
Who Should Attend
Perforce IPLM users
Those curious about the Perforce IP management platform
Semiconductor design and engineering teams
IP management and CAD leaders
Product development and operations leaders
Anyone responsible for scaling design workflows and reducing complexity
A Practical Look at the Future
The Future Forward webinar on May 19th is ultimately about execution over theory. You’ll see how real product improvements come together via clear discussion and step-by-step demonstration. Attendees looking to modernize their IP lifecycle strategy will come away with fresh perspective and a clear path forward using the Perforce suite of tools.
Agentic AI is often presented as a revolutionary shift in semiconductor manufacturing, driven by large language models and generative AI. However, this framing overlooks an important reality: today’s advances are built on decades of prior work. As Jonathan Holt of PDF Solutions emphasizes in his recent keynote at the APCM 2026 conference, the capabilities associated with agentic AI are the result of 30 to 40 years of development in process control, data infrastructure, and system integration. Rather than a clean break, agentic AI represents the next stage in a long technological evolution.
A 40-Year Evolution: From Tool Control to Intelligent Systems
The journey began with early computer-integrated manufacturing (CIM) efforts in the 1980s, where tools were first digitized for monitoring and control. Over time, this evolved into widespread adoption of statistical process control, advanced process control, and run-to-run systems. By the 2010s, machine learning models were being used to predict yield, detect anomalies, and optimize performance.
Despite these advances, most systems remained isolated, designed to solve specific problems without broader coordination. This fragmentation limited the full potential of the data and intelligence being generated.
The Limitation of “Point Solutions”
Traditional semiconductor systems have been highly specialized, addressing tasks such as fault detection, virtual metrology, and scheduling. While effective, these solutions were often siloed and connected through rigid, hard-coded integrations. This made systems difficult to adapt as processes evolved.
Agentic AI changes this paradigm by enabling systems to interact dynamically rather than through fixed pipelines, allowing for greater flexibility and scalability.
What Actually Makes Agentic AI Different
The key innovation of agentic AI is coordination. Instead of isolated tools, systems are structured as agents that can communicate, share context, and collaborate toward shared goals. These agents can break down complex problems, execute tasks, and adapt based on feedback.
This transforms AI from a passive analytical tool into an active participant in manufacturing workflows, capable of making real-time, goal-driven decisions.
The Role of LLMs and MCP: Accelerating the Transition
Recent advances in large language models (LLMs) and communication protocols such as Model Context Protocol (MCP) have accelerated this shift. They enable natural language interaction and standardized communication between systems, significantly reducing the effort required to build and connect workflows.
However, these technologies are accelerators, not foundations. Their effectiveness depends on the underlying infrastructure developed over decades.
The Hidden Backbone: Infrastructure Built Over Decades
Agentic AI relies on a mature foundation that includes extensive sensor networks, standardized communication protocols, and robust data platforms. Digital twins, knowledge systems, and enterprise integration layers provide the context and structure needed for meaningful coordination.
This infrastructure is what makes agentic AI practical today, allowing systems to operate across tools, processes, and even geographically distributed factories.
Agentic AI in Practice: What’s Real Today
While the vision of fully autonomous manufacturing is compelling, current implementations are still semi-autonomous. The industry is roughly 70 to 80 percent of the way toward full autonomy, with human oversight still playing a critical role.
Today’s applications include automated model development, adaptive testing, and cross-stage decision-making. Systems can analyze data, recommend actions, and refine their behavior over time, but humans remain essential for validation and governance.
The Trade-Off: Intelligence vs. Trust
A key limitation of agentic AI is data sharing. While broader access to data would improve model performance, concerns around intellectual property restrict how information is exchanged. As a result, systems typically share only the necessary outputs rather than raw data.
This approach preserves security but limits the full potential of collaborative intelligence, highlighting a fundamental trade-off between capability and trust.
From Programming to Autonomy: A Useful Analogy
The evolution toward agentic AI mirrors the progression of software development: from low-level programming to object-oriented systems and now to autonomous, self-organizing workflows. In this new paradigm, AI not only uses predefined components but also manages and optimizes them dynamically.
The 8-Layer Stack of Agentic Manufacturing
Agentic manufacturing can be understood as a layered architecture, starting with physical equipment and sensors, followed by control systems, integration layers, data platforms, and multi-agent coordination. At the highest level lies the goal of fully autonomous orchestration.
Today, most organizations operate in the middle to upper layers of this stack, with full autonomy still a future objective.
The Real Bottleneck: Not Technology, But Integration
The primary challenges in adopting agentic AI are not related to algorithms but to integration, standardization, and organizational readiness. Aligning systems, managing data, and ensuring reliability across complex environments remain significant hurdles.
Strategic Implication: The Platform Is the Advantage
The effectiveness of agentic AI depends heavily on the strength of the underlying platform. Organizations with well-developed data infrastructure and integration capabilities are better positioned to scale and realize value. Without this foundation, even advanced AI systems risk remaining isolated.
Summary
Agentic AI is best understood as the culmination of decades of progress rather than a sudden breakthrough. Its value lies in connecting and enhancing existing systems, enabling a more adaptive and collaborative manufacturing environment.
The key question going forward is not what AI can do, but how effectively it can be integrated into the complex ecosystems that define modern semiconductor manufacturing.
The semiconductor industry is entering a post-Moore’s Law era in which scaling transistor density alone is no longer sufficient to sustain historical performance growth. As discussed in the panel Beyond Moore’s Law: The Future of Semiconductor Manufacturing, the industry is increasingly dependent on advanced manufacturing intelligence, heterogeneous integration, AI-driven optimization, and data-centric infrastructure to continue innovation. Rather than relying solely on lithographic shrink, semiconductor progress is now driven by system-level efficiency, packaging technologies, and intelligent manufacturing ecosystems.
Panelists:
Dr. Jim Shiely, Director, R&D Calibre Semi Manufacturing, Siemens EDA
Dr. Larry Melvin, Sr. Director, Technical Product Management, Synopsys
Dr. Christophe Begue, VP, Corporate Strategic Marketing, PDF Solutions
Dr. Janhavi Giri, EDA & Semiconductor Industry Vertical Lead, NetApp
Daniel Nenni, Founder of SemiWiki.com (Moderator)
One of the primary technical challenges highlighted is the physical limitation of traditional CMOS scaling. As transistor geometries approach atomic dimensions, issues such as leakage current, thermal dissipation, quantum tunneling, and variability become increasingly difficult to control. Advanced nodes below 3 nm require extreme ultraviolet (EUV) lithography, multi-patterning, and highly precise process controls, significantly increasing manufacturing complexity and cost. Consequently, fabs generate enormous volumes of operational data from process equipment, metrology systems, defect inspection tools, and yield management platforms.
This data explosion has created an opportunity for artificial intelligence and machine learning to become foundational technologies within semiconductor manufacturing. Modern fabs operate thousands of process steps with highly interdependent variables, making traditional rule-based optimization insufficient. Machine learning models can analyze terabytes of sensor data in real time to identify hidden process correlations, predict equipment failures, and optimize wafer yields. Predictive maintenance algorithms, for example, use telemetry data from deposition, etching, and lithography equipment to forecast tool degradation before catastrophic failures occur. This minimizes downtime and improves overall equipment effectiveness (OEE).
Another critical area discussed is design-technology co-optimization (DTCO). Historically, chip design and manufacturing were treated as relatively independent domains. However, advanced nodes now require deep integration between EDA workflows, process technologies, and packaging architectures. AI-assisted EDA tools are increasingly used to accelerate place-and-route optimization, power integrity analysis, and timing closure. Generative AI models are also being explored for automated verification, layout synthesis, and defect prediction. These approaches significantly reduce engineering iteration cycles while improving design quality and manufacturability.
The panel also emphasized the growing importance of advanced packaging technologies as a continuation of Moore’s Law. Chiplet-based architectures, 2.5D integration, and 3D stacking allow manufacturers to improve system performance without relying entirely on transistor shrink. High-bandwidth interconnects, through-silicon vias (TSVs), and heterogeneous integration enable CPUs, GPUs, memory, and accelerators to be combined into tightly integrated systems. This architecture is especially important for AI workloads, where memory bandwidth and interconnect efficiency are often more critical than raw transistor density.
Data infrastructure was identified as another strategic requirement for future semiconductor manufacturing. AI-driven fabs depend on scalable, low-latency storage systems capable of supporting high-throughput analytics pipelines. Semiconductor workflows involve distributed simulation environments, petabyte-scale datasets, and collaborative global engineering teams. Cloud-integrated storage architectures and high-performance parallel file systems are increasingly necessary to support EDA simulations, digital twins, and manufacturing analytics. Digital twins, in particular, allow fabs to model process behavior virtually, enabling rapid experimentation and optimization before physical implementation.
Cybersecurity and supply chain resilience were also addressed as emerging priorities. Semiconductor manufacturing is highly globalized, with dependencies across materials suppliers, foundries, packaging vendors, and equipment manufacturers. AI-enabled visibility into supply chain operations can help predict disruptions, optimize inventory, and improve production planning. At the same time, protecting intellectual property and manufacturing data has become critical as fabs adopt cloud-connected infrastructures.
Bottom line: The future of semiconductor manufacturing intelligence lies in the convergence of AI, data engineering, advanced process technologies, and heterogeneous system integration. The industry is transitioning from pure transistor scaling toward intelligent optimization across the entire semiconductor lifecycle. Success in this next era will depend not only on physics and materials science but also on the ability to extract actionable insights from massive manufacturing datasets. Semiconductor leaders that effectively combine AI-driven analytics with scalable infrastructure and advanced packaging technologies will define the next generation of computing innovation.
Matt Crowley is Chief Executive Officer of Scintil Photonics. A physicist by training, Matt built his career transitioning advanced semiconductor technologies from development to volume manufacturing. Before Scintil, he led MEMS technology company Vesper Technologies to high-volume production and through its acquisition by Qualcomm. He holds a degree from Princeton University.
Tell us about your company?
Scintil is a photonic integration company. We build dense wavelength division multiplexing (DWDM) light engines using a heterogeneous integration process we call SHIP™, for Scintil Heterogeneous Integrated Photonics. SHIP runs in production on Tower Semiconductor’s silicon photonics line. Sylvie Menezo, our founder and CTO, originated the technology out of CEA-Leti in Grenoble, where we are headquartered, with operations now expanding into the US.
The shorter version: photonics is going through the transition that semiconductors made 40 years ago, from discrete components on boards to integrated circuits on wafers. SHIP is how we participate in that transition. By bonding III-V gain material directly onto a silicon photonic wafer in a foundry process, we put lasers, modulators, detectors, and passive photonics on the same die, in the same flow, on the same lines that already produce tens of millions of optical transceivers a year.
LEAF Light™ is our first commercial product on SHIP, a single-chip DWDM laser source for AI scale-up networks. Our $58M Series B last year included NVIDIA as a participant.
What problems are you solving?
The hardest problem in AI infrastructure right now is not compute. It is the network between compute elements. As accelerator clusters scale into thousands of processors, the network determines how much of the compute is actually usable, and the metrics that decide it are energy per bit, latency, and bandwidth at the edge of the package.
Copper is at the wall on all three. Single-wavelength co-packaged optics (CPO) is in production now and works well for scale-out. The next step, where the system gains compound, is DWDM CPO for scale-up. That step needs a multi-wavelength light source that can be manufactured on existing silicon photonics flows, at hyperscale volumes, with the wavelength precision and reliability the architecture demands. That has been the missing piece. Building it is what we do.
What application areas are your strongest?
AI scale-up networks. The economics and the technical requirements both point to DWDM CPO as the destination architecture, and that is where our platform fits most directly. LEAF Light targets the DWDM laser source, which is the highest-value, hardest-to-manufacture element of that architecture.
The same process supports a broader set of integrated photonic devices, including transceivers with integrated lasers, optical circuit switches with semiconductor optical amplifiers, and high-speed modulator arrays. These are not separate process developments. They are products that share a single foundry-resident process flow. We are starting with the application that has the most immediate market pull.
What keeps your customers up at night?
Two things, in this order. First, manufacturing capacity at the volumes hyperscale build-outs already require. AI infrastructure committed capex at a scale that assumes the optical layer will be there, in the bandwidth, density, power, and reliability budgets the architecture needs, when the buildings switch on. The architectural debate is largely settled. The execution debate is wide open, and it lives at the foundry.
Second, headroom. A first-generation specification is a starting line, not a destination. Customers planning multi-rack scale-up clusters need to see a path where bandwidth per fiber scales without re-doing the fiber plant, the package, or the per-channel electronics every two years. They want to know that the supplier they choose for the first step has a process flow that supports the second and third steps on the same lines. That second question is the harder one for most of the industry to answer.
What does the competitive landscape look like and how do you differentiate?
Most of the energy in the sector right now is around three architectural choices for the DWDM light source. Discrete distributed feedback laser arrays externally combined into a fiber. Mode-locked lasers producing a wavelength comb in a single cavity. And heterogeneous integration of III-V gain material onto a silicon photonic wafer.
Each works in the lab. They separate on the manufacturing curve. With discrete arrays or external combiners, every additional wavelength is another assembly step, another alignment, another bill-of-materials line. With heterogeneous integration at the wafer level, the next wavelength is another circuit element. The cost curve follows a semiconductor learning curve, not a linear assembly curve.
SHIP is a backside-on-box flow built on Tower’s PH18M silicon photonics process. We start with standard PH18M, perform a handle exchange to expose the buried oxide as a bonding surface, bond III-V die, and process them into integrated photonic devices in alignment with the silicon waveguides beneath. The flow is foundry-resident, with a process design kit, design rules, and the manufacturability discipline a real product line requires. Our differentiation lives there.
What new features/technology are you working on?
Last month at OFC we launched the LEAF Light Evaluation Kit. It is the first DWDM laser source EVK to move from internal validation into a customer-facing program. Each unit hosts laser optical sub-assemblies in 8-wavelength or 16-wavelength configurations and provides a defined integration path into the ELSFP module form factor the industry is converging on.
A piece of the platform we are pushing hard on is what we call WaveGuard™, on-chip frequency monitoring and trimming that holds DWDM channel spacing within tight tolerances across temperature, ageing, and package stress. Wavelength precision is one of the things that has historically held DWDM back in production, and intelligent on-die control is how we solve it.
Beyond LEAF Light, the same SHIP flow supports integrated transceivers, optical circuit switches with semiconductor optical amplifiers, and other building blocks that hyperscalers will want next. We are walking that roadmap in step with customer evaluations rather than ahead of them.
How do customers normally engage with your company?
Through our website at www.scintil-photonics.com, the contact form, or directly at contact@scintil-photonics.com. Our LEAF Light EVK is available now to qualified customers through an early access program. Teams that want to bring real constraints to a technical discussion are exactly the conversations we are looking for.
Daniel is joined by Nir Sever, Senior Director of Business Development at proteanTecs. Nir has over 30 years of experience in advanced VLSI engineering. Before joining proteanTecs, he served for 10 years as the COO of Tehuti Networks, a pioneer in high-speed networking semiconductors. Prior to that, he served for 9 years as Senior Director of VLSI Design and Technologies for Zoran Corporation.
Dan discusses proteanTecs’ unique business model and technology portfolio with Nir. They also explore in some detail the new PVT Plus sensors from protenTecs. Nir describes the enhancements delivered with PVT Plus, which include more sensor measurement capabilities, easier integration with the protenTecs portfolio to create a complete hardware/software solution for in-chip monitoring, and newly designed hardware for advanced processes. Nir then explains how a complete hardware/software in-chip monitoring capability can be built and describes some significant customer benefits that have been achieved.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
In the functional verification space, Breker Verification Systems stands out for its vast and long-standing understanding and ability to solve many of the seemingly intractable complexity challenges, especially in the system space.
I recently talked with Dave Kelf, Breker’s CEO, who has plenty of good news to share about Breker’s growth and new product development.
What’s new with Breker?
In 2025, we saw 35% growth over 2024. That matched the 35% growth from 2023 to 2024. Our growth in 2026 should be even greater as demand for our functional verification solutions has accelerated.
Also in 2025, we added resources when we engaged an engineering and support facility in Bangladesh.
And much like previous years, we are deep into new product development with work in the AI space that includes verifying AI/GPU processors and leveraging AI in our flows. We inked some interesting partnerships that will result in some exciting new advances.
What’s was the most exciting high point for Breker recently?
I can point to three areas that were and continue to be high points for us. The first is our efforts within the RISC-V space. We signed several strategic partnerships, took a larger leadership role in the RISC-V International Certification program, a need that’s gaining increasing importance and urgency, and of course, enhancements to our RISC-V SystemVIP products.
Breker has made considerable advancements in both Arm platform verification and AI hardware GPUs. We are offering an Arm Neoverse CSS SoCReady SystemVIP as part of our product portfolio and signed a fascinating new partnership in the AI hardware GPU area.
Finally, our customer base is growing. From all accounts, Breker is now being used on more than half of all the RISC-V processor core developments globally. We added several top 10 semiconductor companies to our portfolio, plus two more from the Magnificent 7. Overall, our customer base has doubled in size. Revenue crossed a major goal for Breker.
What do you think the biggest growth area for 2026 will be, and why?How is Breker’s work addressing this growth?
Without question, it is test content for system verification because there is an unserved market in test content generation for these large devices, especially consumers of simulation and hardware-assisted verification platforms. Currently, verification engineers spend way too much time and resources creating homebrew solutions for system-level scenarios. By leveraging synthesis, we are able to find troublesome corner cases not obvious when composing manual test cases or running real workloads.
Are you incorporating AI into your products?
Yes. Breker has used AI Planning Algorithms for years in our synthesis technology.
Breker’s Synthesis technology, provides a backend for AI verification tools that completes their basic flows while adding tribal knowledge that is not readily apparent.
At this year’s DVCon US, we launched a partnership with Moores Lab AI to create the first AI-driven SoC verification flow integrating our Trek Test Suite Synthesis with Moores Lab agentic AI technology. It leverages our experience in test generation for complex system design scenarios with Moore’s Lab’s agentic AI VerifAgent product to seamlessly enable automated multicore, multitool, C or TLM test generation for complex SoC scenarios from manually composed specifications. The flow uses agentic AI to read a specification and generate appropriate scenario models for test synthesis that produce combined C and SystemVerilog tests that can be run on simulation and emulation platforms targeting high-coverage SoC scenarios.
Is AI affecting the way you develop your products?
Yes. We use AI to assist backend test synthesis for AI SoC verification. AI spec interpreters enable a greater understanding of complex specifications such as RISC-V’s ISA. Our tools leverage AI to generate various code segments and provide verification “tribal knowledge” to AI-focused verification groups.
How do customers normally engage with your company?
At the recent RISC-V Now by Andes conference, Aion Silicon’s presentation made one thing clear: RISC-V is no longer an emerging alternative but rather rapidly becoming foundational to modern silicon design. This conviction is not theoretical says Oliver Jones, CEO of Aion Silicon, who gave the talk. It is grounded in Aion Silicon’s direct experience delivering advanced-node-silicon spanning dozens of designs at 7nm and below and deep engagements across AI, networking, and automotive sectors. Across these engagements, a consistent pattern has emerged: RISC-V is increasingly selected where flexibility, control, and differentiation matter most.
The semiconductor industry is undergoing a structural shift, where the ability to tailor compute to specific workloads is becoming as critical as raw performance. RISC-V sits squarely at the center of this transformation.
The Real Driver: AI’s Insatiable Demand for Custom Compute
A central theme of the presentation is that artificial intelligence (AI) is not just another workload but a forcing function reshaping silicon design. AI workloads demand specialization, efficiency, and adaptability, all of which align naturally with RISC-V’s extensible instruction set architecture.
In practice, this is already visible in production silicon. RISC-V cores are increasingly embedded inside AI accelerators, including hyperscale deployments, where they handle control, orchestration and specialized processing tasks. Rather than displacing incumbent CPU architectures, RISC-V is occupying critical roles that benefit from tight optimization and domain-specific behavior. The alignment is powerful: AI creates demand for customization, and RISC-V provides the architectural mechanism to deliver it.
Customization as a First-Class Design Principle
One of the most compelling arguments presented is that customization is the defining advantage of RISC-V, not cost or openness alone. The ability to extend the ISA with domain-specific instructions allows silicon designers to tailor compute precisely to workloads, whether in AI, networking, or embedded systems.
This represents a meaningful shift in design philosophy. Instead of forcing software to adapt to fixed hardware constraints, organizations can now shape hardware around their most important workloads. The resulting gains in performance-per-watt and system efficiency are increasingly difficult to achieve with general-purpose architectures alone.
That said, this flexibility introduces complexity. Custom instructions ripple through compilers, verification flows, and system integration. The presentation emphasizes that successful adoption requires discipline with customization targeted, measured, and supported across the full stack.
The Rise of Heterogeneous SoCs
Another key insight is that RISC-V’s momentum is closely tied to the rise of heterogeneous system-on-chip architectures. Rather than replacing Arm or x86 CPUs, RISC-V is being deployed alongside them as a function-specific compute element.
This coexistence model reflects a broader industry evolution. Modern SoCs are no longer built around a single dominant processor; instead, they integrate multiple compute elements, each optimized for a specific role. Within this architecture, RISC-V frequently serves as the control and orchestration layer or as a targeted offload engine.
The implication is clear: RISC-V’s strength lies not in displacing existing architectures, but in complementing them—filling the growing need for specialized, adaptable compute within increasingly complex systems.
From Edge Volume to Datacenter Value
RISC-V’s adoption story began in microcontrollers and embedded systems, where its open and customizable nature provided immediate advantages. What is changing now is the direction and scale of growth. The architecture is expanding upward into edge AI, networking, and datacenter silicon.
This progression mirrors historical industry patterns. Volume at the edge drives ecosystem maturity, which in turn enables deployment in higher-value, performance-sensitive domains. As AI inference shifts from centralized cloud environments to distributed edge devices, the number of deployment opportunities grows exponentially.
The result is a virtuous cycle: broader adoption strengthens the ecosystem, which lowers barriers to entry and accelerates further adoption.
From Architecture to Silicon: The Importance of System-Level Thinking
Beyond market trends, the presentation highlights how successful RISC-V designs are executed. Aion Silicon emphasizes system-level modeling, where compute, memory, and I/O interactions are analyzed early using cycle-accurate frameworks before committing to RTL.
This approach reflects a critical reality: in modern SoCs, performance bottlenecks are rarely confined to the CPU core. They emerge in memory hierarchies, interconnect fabrics, and data movement patterns. Early modeling enables teams to identify these constraints and optimize accordingly, while changes are still cost-effective.
The broader lesson is that architectural success depends on holistic system design, not just individual component optimization.
Where RISC-V Works and Where It Needs to Mature More
The presentation offers a pragmatic view of where RISC-V delivers immediate value and where challenges remain. It is particularly effective in control and orchestration roles within heterogeneous SoCs, and in scenarios where targeted vector or custom instructions can accelerate well-understood workloads.
At the same time, areas such as toolchain maturity, verification complexity, and system integration require careful management. These challenges are not unique to RISC-V, but they are amplified by its flexibility.
What emerges is a clear pattern: success with RISC-V is less about adopting the architecture itself and more about how thoughtfully it is integrated into the broader system.
Ecosystem and Collaboration: The Multiplier Effect
The role of ecosystem is another critical theme. The collaboration between Aion Silicon and Andes underscores how partnerships across IP providers, design services, and tooling vendors are essential to delivering production-ready solutions.
As the ecosystem expands, it reduces friction for adoption and increases confidence among customers. This network effect is a key driver of momentum, enabling RISC-V to scale beyond early adopters into mainstream deployment.
Summary
The overarching message is that RISC-V is evolving into the default architecture for control, customization, and specialization within heterogeneous systems. Its rise is driven by the convergence of AI workloads, the shift toward multi-architecture SoCs, and the growing importance of architectural flexibility.
For decision-makers, the implication is clear: RISC-V is becoming a strategic component of future silicon roadmaps. In that sense, RISC-V is doing more than spanning datacenter to edge. It is redefining how compute is designed, deployed, and optimized.
This interview presents the first steps of Robert Simpson (R.S.), a Maths graduate who found an unexpected, but natural home in Formal Verification (FV) at Axiomise. Drawn by a desire to apply rigorous logic to real-world problems, he shares how abstract mathematical thinking translates into ensuring hardware correctness at the silicon level. From the excitement of spotting elusive bugs missed by traditional methods to collaborating with experts on complex designs, Robert reflects on the mindset, surprises, and rewards of working in a field that blends philosophy, engineering, and detective work—revealing how precise reasoning can have a tangible impact on the technology that shapes our world.
What initially drew you from the world of Maths into the field of FV?
R.S.: – In the final few years of my degree, I thought a lot about what I wanted to do going forward with my career. The focus of my final year was understanding how proof and logic could be used and applied to solve a huge range of problems, and I knew that I wanted to continue to problem solve in a mathematically rigorous way. When I found Axiomise at a careers fair, I was immediately interested by the need for formal proof in silicon verification and wanted to learn more.
How did you fare stepping into the job market with that fresh degree in hand?
R.S.: Starting work in the industry after finishing my degree was very exciting. After lots of studying, it was refreshing to try something new and see how the skills which I had learnt could be applied to real-world problems.
What’s one habit from your Maths degree that turned out to be unexpectedly valuable on the job?
R.S.: I think that the habit which I learnt from my degree, which has been the most useful, is my reaction to always carefully think through the consequences of any assumption or requirement. In both mathematics and FV, this is important because the precise definition of the problem space is critical to the answer to the problem, or whether a bug can be found. In technical research, the importance of methodical accuracy is clearer because of the need for critical thinking when reading papers and reaching sound conclusions; however, I was quite surprised by how useful this turned out to be for reading design specifications and constructing formal checks. The experience with this that I gained during my degree certainly helped me to pick up formal quicker and make more useful contributions.
What surprised you most about applying abstract mathematical thinking to something as tangible—and consequential—as hardware correctness?
R.S.: Whilst working at Axiomise, I have been impressed by how rigorous the field of hardware correctness can get at times. Before starting, I would have guessed that in the important physical industry of hardware, formal mathematical analysis would be limited or bound by approximations, but in fact formal verification has a long history of solid logical foundations. I have really enjoyed this aspect of the hardware industry, as it combines the logical reasoning which really interests me, and knowledge of different designs to produce effective and logically sound results.
What is the most fulfilling part of working at Axiomise?
R.S.: For me, the most fulfilling part of working at Axiomise has been the ability to work alongside experts in formal verification using cutting edge techniques in order to find intricate bugs, get correctness proofs for massively complex designs or research new techniques to further develop the field of FV. Being able to bounce ideas back and forth and have innovative discussions with people with so much knowledge and experience is really rewarding, and this collaborative environment makes solving problems that would otherwise not be resolved particularly enjoyable. It’s great to be able to learn so much and build upon existing methods within an amazing team.
What’s a moment at the company where you realized: “This isn’t just theory anymore—this actually changes how the world works”?
R.S.: I think the first moment I realized the importance of formal hardware verification was when I first saw a bug that had been missed by all non-formal verification. This made it clear to me that the theoretical advantages of formal actually translate into practical results when applied to real designs.
How does a day in the life of an Axiomiser look? How do you find the collaboration with engineers and researchers?
R.S.: What happens during a day at Axiomise varies a lot depending on the state of the current project. The first thing I do will typically be checking if there was any new progress in my checks overnight, raising some new potential failures which need to be debugged. I will look carefully into the flagged situation and use my knowledge of the design or work with a colleague to determine if there is an actual error in the design. Once we work out the cause, the next step could be a meeting with the customer to raise the issue and try to find a fix, or returning to tweak the tests to find a different case. Alongside this, I might also be running some experiments with the researchers in the R&D team, testing out different methods in order to find new ways to find bugs and correctness proofs for more complex designs. Working with different teams is always exciting as it often means we are thinking about a tricky problem and there are always many different clever ideas and potential solutions to get stuck into.
What mindset is required to do FV?
R.S.: I think a key aspect of doing formal verification is the ability to carefully think through a problem. This comes up over and over: when ensuring that all cases of a requirement are going to be considered, understanding what possible edge cases could occur, or when thinking through safe constraints to be put on a system. This ability to be methodical and understand all possibilities is important in many areas of research and industry, but is an invaluable part of doing FV.
After eight months at Axiomise, is FV closer to philosophy, engineering, or detective work in disguise?
R.S.: I think after working at Axiomise for several months, I would say that FV is really a mix of all three. There is an aspect of detective work when trying to carefully figure out why certain behaviours are occurring and looking for the root cause, but also one of engineering the best and most accurate checks to ensure that the specification is met. I would say there is even a bit of philosophy involved when trying to understand the proof construction methods and develop the best ways to utilise their advantages to be able to create new techniques.
What makes a new joiner succeed at Axiomise? What piece of advice would you give young people interested in this field?
R.S.: I think what makes people successful at Axiomise or working on formal verification in general is always having an interest to learn more about the really interesting elements of hardware design. Computers are so complex now, and there are so many cool ideas that go into making them as efficient as possible, that – if you are interested – there are always more interesting parts to learn about. Knowing everything is impossible, but learning as much as possible helps so much when finding out about something new and enables a deeper understanding sooner.
If you’re keen to delve further into formal verification, Axiomise’s website is an excellent place to start—offering both resources and career opportunities. The company’s semi-annual Graduate Program provides a welcoming pathway for aspiring candidates, with applications open directly via the website or Handshake.
Robert Simpson is a Formal Verification Engineer at Axiomise, bringing his problem-solving and logical reasoning to both customer projects and innovation research work aimed at improving the ability of formal methods to reach conclusive proofs. He works on verification of digital hardware designs through the use of formal methods to find design bugs and produce proofs of correctness. Before Axiomise, Robert studied Mathematics at Churchill college, with focusses on Foundations, Quantum computation and topology. Whilst at Cambridge, Robert enjoyed time with societies such as board games, Ultimate Frisbee and bridge. He also took part in a summer research project through the mathematics department, investigating whether a particular technique could be applied to a similar but subtly different problem. Robert learnt about Axiomise at a University Careers fair, and their work using mathematical approaches to the verification of cutting-edge hardware encouraged him to learn more and eventually apply for a position where he uses the skills and knowledge he built during his degree to effective use in an important field in our digital world.
Hardware emulation arose as a necessity out of the needs of the eighties. By the mid-1980s, semiconductor designs had outgrown the practical limits of gate-level simulation. Gate-level simulation delivered accuracy, but at glacial pace; silicon prototypes performed at real-speed but arrived far too late. The industry needed a new instrument, a verification engine capable of executing real hardware models at meaningful speed while preserving the visibility and control required for thorough verification. Hardware emulation was born to fill that gap.
Who would have thought at that time that Moore’s law of complexity growth would be so dramatically outgrown by AI model complexity around the 2020s. Well, hindsight is 20/20 as we know. Let’s take a look at what actually happened with semiconductors demand:
Through 4 generations of major electronic systems eras: PC, Internet, Mobile, IoT & Cloud, one can argue that the evolution of emulation was driven by different paradigms fighting for market share through a different balance of technology advantages serving very broad market requirements. Today the market is primarily investing in AI chips which must execute AI models with explosive complexity growth. It is not a surprise that emulation architectures with a performance advantage for executing these long AI workloads are today’s winners in the market.
Let’s visit the journey of how all the emulation technologies evolved and how commercial FPGA-based architecture came out on top for today’s needs of AI system verification.
The first generation of emulators relied on vast arrays of commercial FPGAs, a radical leap forward at the time. These systems enabled pre-silicon validation of complex chips that would otherwise have required years of simulation alone. For nearly a decade, progress followed a predictable trajectory: each new generation of FPGA devices delivered greater capacity, higher performance, and the ability to map increasingly ambitious designs. Scale improved dramatically, but the underlying philosophy remained largely unchanged.
As these platforms grew, however, their limitations became impossible to ignore. Increasing logic capacity did not resolve the architectural constraints embedded in their foundations. Early FPGA-based systems carried what many engineers would later describe as their original “sins.”
The sheer number of FPGAs required to keep pace with exploding design sizes drove setup times into weeks or even months. Compilation cycles stretched into days, often delaying DUT readiness beyond project schedules and making iterative development painfully slow. Design visibility was equally constrained: internal observability depended on compiling probes into the fabric, consuming valuable resources, increasing routing congestion, and turning debug into a laborious exercise. Execution models were rigid, centered entirely on in-circuit emulation (ICE), limiting flexibility for interactive debugging. And the total cost of ownership—purchase, operation, and maintenance—placed these systems far beyond the reach of most engineering teams.
As a result, hardware emulation remained confined to the most critical verification challenges, typically late in the design cycle and within only the most advanced organizations. For many teams, it was not a day-to-day engineering platform but a scarce, high-value resource—powerful, indispensable, and perpetually in short supply.
The Seeds of a Great Divide Were Beginning to Grow
By the mid-1990s, the commercial landscape appeared stable on the surface, dominated by two primary players: Quickturn Design Systems and IKOS Systems. Yet beneath that stability, the field was undergoing a profound transformation. Designs were scaling rapidly, software stacks were growing alongside hardware complexity, and verification demands were shifting from block-level correctness to full-system behavior. The question was no longer whether emulation could scale accordingly, but how.
Out of these pressures emerged a fundamental divergence in architectural thinking. Vendors and engineering teams began reimagining what an emulator should be: not just a larger FPGA array, but a purpose-built verification instrument optimized for visibility, controllability, and system-level performance. This rethinking gave rise to three distinct hardware emulation architectures—each grounded in a different philosophy, each making different trade-offs in speed, scalability, and usability, and each shaping the trajectory of pre-silicon verification for decades to come.
The three architectural approaches that emerged came to be known as processor-based emulation, custom-FPGA-based emulation, and commercial-FPGA-based emulation. Each represented a distinct attempt to overcome the growing limitations of simulation while enabling hardware designs to be validated at meaningful speed and scale. The essential characteristics of these technologies can be understood by examining their origins, evolution, and practical trade-offs.
Processor-Based Emulation
IBM and the Emergence of Processor-Style Approach
In the early 1980s, IBM began exploring hardware acceleration techniques to improve design verification efficiency through projects such as the Yorktown Simulation Engine (YSE) and the Engineering Verification Engine (EVE). These systems functioned as simulation accelerators—special-purpose computing platforms designed to execute hardware descriptions expressed in software languages more quickly than conventional simulators. While they delivered measurable speed improvements, they still fell short of the performance required to apply real-world stimulus to the design under test (DUT).
By the mid-1990s, IBM had refined a new architectural direction centered on arrays of simple Boolean processors. These processors operated on design data structures stored in large, shared memories and were coordinated by sophisticated scheduling mechanisms. The approach proved adaptable to full emulation workloads, offering a scalable alternative to traditional simulation. Still, IBM did not capitalized on the technology.
Quickturn and the Commercialization of Processor-Based Emulation
After nearly a decade of experience with commercial FPGA-based emulation systems, Quickturn reckoned that despite important advances, these emulators revealed structural limitations that proved difficult to overcome. Achieving sufficient design capacity required interconnecting hundreds of FPGAs across multiple boards, creating significant logistical and engineering challenges. Partitioning and routing designs across this distributed fabric often needed months of preparation to avoid congestion and ensure deterministic behavior. Debug visibility had to be explicitly compiled into the design, competing with routing resources and slowing development cycles. Performance also failed to scale linearly with design size, with execution speed declining as workloads grew more complex.
In search for a solution, Quickturn evaluated a custom-FPGA architecture developed by a French startup by the name of Meta System. At the same time, Mentor Graphics, after abandoning earlier experimentation with emulation and selling all assets to Quickturn, pursued the same path. The resulting competition escalated into legal disputes over intellectual property, ultimately culminating in Mentor’s acquisition of Meta System.
Quickturn, already familiar with IBM’s processor-based work, moved decisively in that direction. Rather than commercializing the technology directly, IBM entered into an exclusive OEM agreement with Quickturn, enabling the latter to incorporate the architecture into a new generation of emulation systems.
IBM’s processor-centric architecture offered a compelling alternative. It addressed three of the most persistent constraints associated with FPGA-based systems: lengthy setup and compilation cycles, restricted debugging visibility, and performance degradation at large scale. One drawback—less visible at the time—was higher power consumption compared with FPGA-based solutions of equivalent capacity.
In 1997 Quickturn acquired the IBM technology and soon after introduced the Concurrent Broadcast Array Logic Technology (CoBALT) emulator, the first major commercial platform built on a processor-style architecture. The product achieved rapid market acceptance.
The competitive landscape continued to shift. Ongoing litigation between Mentor and Quickturn persisted until around 2002, when Cadence acquired Quickturn, resolving the disputes and consolidating key emulation technologies within its portfolio.
Cadence and the Scaling of Processor-Based Emulation
Following the acquisition, Cadence phased out Quickturn’s FPGA-based product lines and committed fully to the processor-based paradigm. This decision laid the foundation for the long evolution of the Palladium family of emulators, which became the company’s flagship platform.
Across successive generations introduced from the early 2000s onward, Palladium preserved its fundamental architectural principle: large arrays of simple processors working in concert to emulate hardware behavior at scale. With each iteration, design capacity expanded, execution performance improved, debug capabilities became more comprehensive, and compilation workflows grew faster and increasingly automated.
Two characteristics consistently defined the appeal of the platform. First, compilation times were significantly shorter than those associated with FPGA-based approaches, enabling faster turnaround during development. Second, engineers benefited from full design visibility at runtime without requiring special compilation steps, a powerful advantage for debugging and iterative verification.
Palladium also proved particularly strong in in-circuit emulation. A broad ecosystem of speed bridges enabled direct interaction with real hardware interfaces, allowing software and hardware to be validated together in realistic operating conditions.
These strengths were accompanied by structural trade-offs. Processor-based systems required substantial physical infrastructure and typically consumed more power than FPGA-based emulators of comparable capacity. Customer had to invest into costly watercooling infrastructure. Scaling to multi-billion-gate designs often demanded large installations composed of numerous cabinets. In transaction-based acceleration scenarios, processor-based platforms also tended to operate at lower execution speeds than competing architectures optimized specifically for that use case.
Despite these constraints, processor-based emulation established itself as a foundational technology in hardware verification, offering a unique balance of scalability, visibility, and productivity that continues to shape modern emulation platforms.
Custom-FPGA-Based Emulator
Custom FPGAs: A Parallel Innovation Path
While IBM was advancing processor-based emulation in the United States, a parallel and equally important line of innovation was taking shape in Europe.
In France, Meta System began developing a class of programmable silicon inspired by field-programmable gate arrays but engineered specifically for emulation workloads. These devices—often referred to as custom FPGAs—were not intended for general logic prototyping or ASIC design. They were purpose-built as the computational fabric of an emulator.
Unlike commercial FPGAs, whose architectures must accommodate a broad range of applications, Meta System’s programmable devices were optimized for the specific requirements of hardware verification. Their architecture combined configurable logic elements with a dense, deterministic interconnect matrix tailored for predictable timing. Embedded multi-port memories enabled efficient storage of design state and stimulus data, while high-bandwidth I/O channels supported connection to external systems and software environments. The devices also incorporated built-in debug engines, including memory-based probing capabilities, and dedicated clock-generation circuitry to maintain synchronization across large, mapped designs.
This specialization yielded several tangible benefits. Compilation and setup times were dramatically reduced because the routing and configuration problem was constrained and optimized for emulation rather than general synthesis. Designers gained full visibility into the design during execution, often without the need for lengthy recompilation cycles to insert probes. And as designs grew in complexity, performance scaled more predictably because the architecture had been engineered around the structural characteristics of emulated hardware rather than generic programmability. Compared with processor-based emulators, the custom-FPGA approach delivered similar functional capabilities with lower power consumption and a more hardware-centric execution model.
Mentor Graphics and the Commercialization of the “Emulator-on-Chip”
The promise of custom-FPGA-based emulation attracted industry attention. In 1996, after outmaneuvering Quickturn, Mentor Graphics acquired Meta Systems and introduced SimExpress, the first commercial emulator built around custom programmable silicon.
SimExpress was, in many respects, a proof of concept rather than a fully competitive platform. Housed in a compact chassis roughly the size of a small wine cellar, it could map designs of fewer than 100,000 gates at a time when leading ASICs were already exceeding the million-gate threshold. Yet its architectural direction was significant. Setup was simpler, compilation times were reduced from hours to minutes, and runtime visibility into the design was far superior to what many FPGA-based systems offered. The platform demonstrated how emulation-optimized silicon, paired with advanced verification software, could form a balanced environment for pre-silicon validation.
Mentor expanded on this concept with the introduction of Celaro in 1999, a substantially larger emulator with a nominal capacity of approximately five million gates. By clustering multiple systems, engineers could scale total capacity beyond twenty million gates—an important milestone as system-on-chip (SoC) designs grew rapidly in size and complexity.
The custom-FPGA approach, however, came with trade-offs. Because these devices did not match the raw logic density of the largest commercial FPGAs, more chips were required to implement large designs. Larger arrays meant longer interconnect paths and increased signal propagation delays. As a result, execution speeds often fell below one megahertz for large configurations—adequate for verification workflows, but slower than some competing FPGA-based emulators at equivalent capacity.
IKOS, Virtual Wires, and Transaction-Based Verification
A pivotal shift occurred in 2002 when Mentor Graphics acquired IKOS Systems. This acquisition brought two complementary technologies that would shape the next generation of emulation.
The first was the Virtual Wire interconnect methodology, originally developed by Virtual Computer Corporation (VCC) and later incorporated into IKOS platforms. Virtual Wire simplified the daunting task of routing large designs across many programmable devices by abstracting physical connectivity into a software-controlled interconnect layer. Engineers could reassign signal paths without physically rewiring boards, dramatically accelerating bring-up and iteration.
The second was IKOS’s work in transaction-based verification. Rather than exchanging low-level signal toggles between the testbench and the hardware model, the methodology elevated communication to higher-level transactions—data packets, protocol events, and software interactions. This approach significantly improved verification efficiency and enabled tighter coupling between hardware and software validation.
Mentor integrated these innovations into the Veloce emulation family, first introduced in 2007 and positioned as a new generation of emulator-on-chip systems. The architecture combined custom programmable silicon, scalable interconnect, and advanced verification software into a unified hardware-assisted verification platform.
Differentiation Through Verification Methodology
Where Mentor ultimately distinguished itself was not only in hardware but in methodology. Building on IKOS’s foundations, the company introduced TestBench Xpress (TBX), widely regarded as one of the most effective implementations of transaction-level acceleration. TBX enabled software testbenches—typically written in SystemVerilog, C, or SystemC—to execute efficiently alongside emulated hardware by offloading transaction handling to the host environment.
Mentor extended this approach further with VirtuaLAB, a suite of application-specific verification environments tailored to industry protocols such as USB, Ethernet, and storage interfaces. These environments allowed teams to validate real-world workloads and software stacks earlier in the design cycle, bridging the gap between pre-silicon hardware verification and system-level validation.
Evolution of the Veloce Family
Over the following years, the Veloce platform progressed through multiple generations. Each iteration increased design capacity, improved execution performance, and enhanced analysis capabilities. New features supported low-power verification, power estimation, hybrid emulation with virtual platforms, and functional coverage analysis. The systems evolved from niche verification engines into central pillars of hardware-assisted verification strategies for large SoCs.
In 2018, Siemens Digital Industries Software acquired Mentor Graphics and incorporated the Veloce product line into its broader electronic design automation portfolio. Development continued, with the platform adapting to the demands of billion-gate designs, complex software stacks, and heterogeneous compute architectures.
Today, the latest generation of this lineage is the Veloce Strato CS, part of the Veloce CS hardware-assisted verification platform. It represents the culmination of decades of architectural evolution—from custom programmable silicon and Virtual Wire interconnects to transaction-based acceleration and enterprise-scale emulation infrastructure—designed to support the verification of modern AI-driven, software-defined systems on chip.
The FPGA Renaissance
While processor-based and custom-FPGA-based emulators were establishing themselves in the market, a parallel transformation was unfolding in programmable logic.
By the late 1990s, new FPGA generations from Xilinx and Altera began to close long-standing gaps in density, speed, and routing flexibility. Devices could now host significantly larger portions of now popular system-on-chip (SoC) designs, while improved place-and-route tools shortened iteration cycles—an essential requirement for verification teams working under relentless tape-out pressure.
Around the turn of the millennium, Xilinx introduced the Virtex family, marking a pivotal inflection point. These devices combined higher logic capacity with faster interconnects and, crucially, read-back capabilities. Engineers could inspect internal registers and memory contents at runtime without recompiling the design. The trade-off was performance: read-back operations slowed execution, but the visibility they enabled proved invaluable for debugging complex systems. For verification engineers, this represented a new balance between observability and speed, one that would shape FPGA-based emulation strategies for years to come.
The rapid progress of commercial FPGAs reignited interest in building emulators directly from off-the-shelf programmable devices. Compared with custom silicon approaches, FPGA-based systems promised faster innovation cycles and lower development costs, while benefiting from the continuous performance gains delivered by FPGA vendors. This environment set the stage for a new wave of entrepreneurial activity.
Two startups, operating on opposite sides of the Atlantic, capitalized on this opportunity, each pursuing a distinct architectural philosophy.
In Silicon Valley, in 1999 Axis introduced a simulation accelerator based on a patented, Reconfigurable Computing (RCC) architecture. Implemented as arrays of FPGAs, the system—marketed under the name Excite—initially targeted acceleration of simulation workloads rather than full emulation. Within a couple of years, Excite evolved into Extreme, a more traditional emulation platform. One of Extreme’s defining innovations was its “Hot-Swap” capability, which allowed engineers to move designs seamlessly between the emulator and a proprietary simulator. This approach leveraged the interactive debugging strengths of software simulation while retaining the speed advantages of hardware execution, bridging two previously distinct verification domains.
At roughly the same time in Europe, a more disruptive initiative was taking shape. Emulation Verification Engineering (EVE), founded in 2000 by four former Mentor Graphics engineers, set out to rethink FPGA-based emulation from the ground up. In 2003, the company introduced ZeBu (Zero-Bugs), an emulator implemented on a compact PC card. The first version, ZeBu-ZV, incorporated two Xilinx Virtex-II devices: one dedicated to mapping the design-under-test (DUT), and the other tasked with accelerating transaction-level execution through a newly conceived Reconfigurable Testbench (RTB) technology.
This architectural decision proved pivotal. By elevating the testbench into hardware and enabling transaction-based verification, ZeBu significantly increased throughput and reduced communication bottlenecks between the DUT and verification environment. At the same time, the system leveraged Virtex read-back features to deliver runtime visibility into internal state without recompilation—again trading execution speed for powerful debugging capabilities.
The concept demonstrated both technical viability and commercial promise. Within a year, EVE expanded the architecture into a larger chassis configurable with arrays of Virtex FPGAs. The resulting system, ZeBu-XL, marked the transition from a compact/personal emulator to a scalable/enterprise emulation platform. Over time, the product line evolved through successive generations, each benefiting from advances in FPGA density, clocking, and tool automation.
A major milestone arrived in 2009 at DAC with the introduction of ZeBu Server, the progenitor of a long-lived product family. Designed for scalability from a single chassis to multi-rack configurations, ZeBu Server could reach nominal capacities of one billion gates. It introduced a higher level of automation, including incremental compilation, faster place-and-route cycles, and multi-user capabilities—features that reflected the growing industrialization of verification workflows.
Equally important were its economic and operational characteristics. ZeBu Server delivered greater execution speed than all competing emulators while consuming a fraction of their power of computing. Its pricing—reportedly dropping below a penny per gate in large configurations—reset expectations for cost efficiency in hardware emulation. The platform quickly gained recognition for offering one of the lowest total costs of ownership in the industry, positioning EVE as a formidable player in the verification market.
Architecturally, ZeBu also departed from the prevailing ICE-first (In-Circuit Emulation) mindset. Early systems emphasized transaction-based verification through RTB—later renamed Flexible Testbench (FTB)—operating at higher clock speeds than the DUT to maximize bandwidth and responsiveness. ICE capabilities were introduced in later generations, but transaction-level acceleration remained a defining strength, aligning with the increasing role of embedded software and system-level validation.
Synopsys Moves into Emulation
The growing relevance of hardware emulation did not go unnoticed by major EDA vendors. Synopsys, recognizing the strategic importance of the technology as early as the mid-1990s, attempted to enter the market through the acquisition of a startup named Arkos, which had developed a processor-style emulation approach. The effort proved unsuccessful, and, within months, Synopsys divested the company and its assets, which were subsequently acquired by Quickturn.
That early setback delayed Synopsys’ direct involvement in emulation for more than a decade. During this period, the market matured, FPGA-based solutions gained credibility, and system-level verification requirements intensified, driven by the rise of complex SoCs and embedded software stacks.
The turning point came in 2012, when Synopsys acquired EVE. By then, EVE was already delivering the third generation of ZeBu Server platforms and had established a reputation for performance, scalability, and cost efficiency.
Following the acquisition, Synopsys invested heavily in advancing the ZeBu roadmap. Capacity continued to scale, performance improved, and compilation times shortened through enhanced automation and tool integration. New analysis and use modes were introduced, supporting everything from software bring-up to system validation and hybrid prototyping.
These developments cemented commercial FPGA-based emulation as a long-term pillar of the verification landscape.
Summary
What began in the mid-1980s as a pragmatic use of rapidly advancing programmable logic has evolved into a cornerstone of modern semiconductor development—scaling to multi-billion-gate designs, enabling software-defined systems, and supporting the increasingly system-centric nature of verification.
At its core, the evolution of hardware emulation is a story of architectural divergence. Three distinct approaches emerged, each shaped by the technological constraints and verification demands of its time, and each redefining what emulation platforms could deliver.
The early dependence on commercial FPGAs exposed a fundamental mismatch between available technology and the requirements of deep system verification. That realization marked a turning point, giving rise to processor-based and custom FPGA-based architectures—two powerful but fundamentally different paths that sustained emulation through a decade of explosive semiconductor growth. Their later disruption by a new generation of FPGA-driven systems did not render earlier approaches obsolete; instead, it broadened the architectural landscape, underscoring a critical truth: no single emulation architecture can optimally address every verification challenge.
Over time, the role of emulation has expanded dramatically, driven by the convergence of evolving user demands and advancing technology. In the AI era, verification has become fully system-centric, requiring the execution of massive software workloads—such as large language models—on next-generation architectures. This shift places three factors at the center of emulation effectiveness: system capacity, execution performance, and interface connectivity. Only the right balance of all three enables meaningful pre-silicon validation at scale.
Among today’s competing approaches, commercial FPGA-based platforms are best positioned to deliver across all three dimensions—offering a compelling balance of scalability, speed, and real-world interfacing that aligns with the needs of modern AI system development.