Wiki Tag: TSMC
CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More
UCIe (Universal Chiplet Interconnect Express) Wiki
UCIe (Universal Chiplet Interconnect Express) is an open industry standard for die-to-die interconnects that enables high-bandwidth, low-latency, power-efficient communication between chiplets in advanced package architectures. The UCIe specification was launched in March 2022 by the UCIe Consortium, with founding… Read More
TSMC 3D Fabric™ Wiki
TSMC 3D Fabric™ is a comprehensive suite of 3D silicon stacking and advanced packaging technologies developed by Taiwan Semiconductor Manufacturing Company (TSMC) to enable high-performance, power-efficient, and space-optimized system integration. It represents TSMC’s response to growing industry demand for heterogeneous… Read More
FinFET Wiki
Full Name: Fin Field-Effect Transistor
Also Known As: 3D Tri-Gate Transistor, Multi-Gate FET
Category: Advanced CMOS Transistor Technology
Introduced by Industry: ~2011 (Intel 22nm)
Invented by: Chenming Hu and colleagues at UC Berkeley (1999)
Replaced: Planar CMOS Transistors
Successor Technology: Gate-All-Around … Read More
High-NA EUV Lithography Wiki
Full Name: High Numerical Aperture Extreme Ultraviolet Lithography
Abbreviation: High-NA EUV
Technology Type: Advanced semiconductor photolithography
Developed By: ASML, Zeiss, in collaboration with Intel, TSMC, imec, and others
First Deployment Target: Intel (expected ~2025–2026)
Main Use: Sub-2nm logic node patterning… Read More
Dr. Morris Chang Wiki
Full Name:
Morris Chang (Chinese: 張忠謀, Pinyin: Zhāng Zhōngmóu)
Date of Birth:
July 10, 1931
Place of Birth:
Ningbo, Zhejiang Province, Republic of China (relocated to Hong Kong, then the United States)
Education:
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B.S. in Mechanical Engineering – Massachusetts Institute of Technology (MIT), 1952
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M.S. in Mechanical Engineering
TSMC Open Innovation Platform Wiki
The TSMC Open Innovation Platform® (OIP) is TSMC’s design-enablement ecosystem and infrastructure. It brings together process technology, PDKs, reference flows, certified EDA tools, silicon-proven IP, design services, cloud enablement, and advanced packaging under a coordinated program to reduce design barriers, speed… Read More
TSMC Wiki
Overview
Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest and most advanced pure-play semiconductor foundry. It manufactures integrated circuits (ICs) for a wide range of customers, offering high-performance, energy-efficient, and scalable process technologies. TSMC plays a central role in
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