Wiki Tag: 3D IC
CoWoPCB (Chip-on-Wafer-on-PCB) Wiki
Chip-on-Wafer-on-PCB (CoWoPCB) is a heterogeneous integration flow in which bare dies (“chips”) are first assembled and interconnected at wafer scale (on an interposer or fan-out carrier). The completed wafer-level module is then finished with board-pitch I/O and mounted directly to a printed circuit board (PCB)—eliminating… Read More
CoPos (Chip-on-Panel-on-Substrate) Wiki
Chip-on-Panel-on-Substrate (CoPoS) is an advanced packaging architecture that “panelizes” the classic chip-on-carrier flow. Instead of building redistribution and interposer structures on round wafers, CoPoS forms them on large rectangular panels, then mounts the finished module onto an organic or glass package substrate.… Read More
CMOS 2.0 Wiki
CMOS 2.0 refers to the next era of transistor and process technology innovation that succeeds traditional FinFET-based CMOS scaling. It encompasses a suite of architectural, materials, and integration innovations aimed at extending Moore’s Law into the angstrom era. CMOS 2.0 is characterized by Gate-All-Around (GAA) transistors… Read More
Intel EMIB (Embedded Multi-die Interconnect Bridge)
EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More
Can RISC-V Help Recast the DPU Race?