Intel EMIB (Embedded Multi-die Interconnect Bridge)

Intel EMIB (Embedded Multi-die Interconnect Bridge)
by Daniel Nenni on 07-16-2025 at 9:39 pm

EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More