Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep
This webinar provides an in-depth discussion about the challenges posed by AI’s increasing power requirements to voltage regulation, more specifically physical limitations such as power distribution losses, thermal and cooling limitations, and power density issues.
It then explores innovative technologies designed
The importance of second-stage optimization in power delivery for data centers and high-performance computing cannot be overstated. With the potential to increase energy efficiency from an average of 85% to approximately 90%,
Infineon is at the forefront of developing innovative solutions to meet the rapidly growing demands
Discover how companies are leveraging ICME to enhance outcomes in consumer goods, fluids manufacturing, optics, and polymer development.
Learn how your R&D team can accelerate the process from materials design to product design and manufacturing.
DATE/TIME:
November 13, 2025
11 AM EST / 5 PM CET / 9:30 PM IST
Venue:
Virtual
Join our webinar to explore how Ansys LS-DYNA enhances manufacturing simulations in sheet metal forming, welding, forging, and more, improving accuracy and workflow efficiency.
Date/Time:
November 5, 2025
11 AM IST
Venue:
Virtual
The demand for manufacturing simulations has been steadily increasing across industries,
Join our webinar to learn how Ansys optiSLang and Thermal Desktop tackle thermal and fluid challenges, optimize design, and enhance product performance with a vapor chamber use case.
Date & Time:
November 5, 2025
11AM EDT
Venue:
Virtual
In this webinar, discover how Ansys optiSLang and Ansys Thermal Desktop empower
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models … Read More
Imaging radar has rapidly evolved into a critical technology for autonomous systems, with patent activity accelerating significantly over the past decade. From 2015 to 2024, global imaging radar patent publications increased more than tenfold, fueled by the rise of autonomous driving, 4D radar integration, AI-based… Read More
November 4, 2025 | 10:00 AM PST
This webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have
Date: Oct 15, 2025 | 5:00 PM PST
Featured Speakers:
Calibration is an essential part of enabling TCAD products usages inside Semiconductor fab. Synopsys has been leading the development
