Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something… Read More
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal… Read More
Is formal verification ready for general use or do you need a PhD to use it? Larger companies continue to recruit formal PhDs into their verification teams while other less-well-qualified engineers seem reluctant to go beyond simplified formal “apps”.
So, what is the truth of the matter? Can non-specialist… Read More
Featured Speaker:
AI performance is no longer limited by compute—it’s limited by how efficiently data moves. As systems scale to compute-dense clusters, memory, die-to-die, and high-speed interfaces are emerging as critical bottlenecks.
This webinar explores… Read More
Heterogeneous compute platforms are driving new requirements for connectivity across increasingly complex system architectures. This webinar explores how PCIe and CXL can be used to provide… Read More
Google Cloud offers powerful compute, networking and GPU/TPUs to run your workloads. But how to feed the beast? EDA workloads require a lot of data and scalable storage plays is that data hub which keeps your workloads going. Google worked with NetApp – a premier on-premises choice for EDA shared storage – to build … Read More
**Please register with professional email address**
As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst!
This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We’ll… Read More
**Please register with professional email address**
As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst!
This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We’ll… Read More
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
Date: Jun 25, 2026 | 9:00 AM PST
In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys
