Date: March, 13 – 9 a.m. PST
Using virtual prototypes alongside early accessible performance models of new SoC or Chiplet architectures has become the de facto standard for early architecture performance modeling, exploration, and analysis. However, as designs and tools become increasingly complex, these virtual
Debugging testbenches can be a time-intensive challenge, but modern tools provide advanced features to simplify and accelerate the process.
This webinar will explore essential capabilities such as basic line stepping, dynamic variable monitoring, constraint debugging, and UVM
Microsoft Focus on IP QA with Solido IP Validation Suite
As System-on-Chip (SoC) designs grow increasingly complex, design IPs have become essential building blocks, promoting modularization and reusability. However, ensuring quality across vast IP libraries with diverse formats and views presents a significant challenge.
A “PCB thermal analysis” design activity has traditionally involved the PCB designer transferring a finished design to a dedicated thermal analysis tool. While this has indeed successfully contributed to numerous PCB thermal signoffs in the past, there are inefficiencies that can be mitigated with the use of Cadence’s Allegro… Read More
Properly constraining your design is a must whether designing for high-speed, high-voltage, or high-density. Electrical Constraints in OrCAD X give designers the tools to control routing based on impedance and timing requirements, allowing users to analyze and tune those signals and reuse information between designs.
Join… Read More
Thank you to our sponsors, Synopsys and Cadence
The Trends in System Design event, hosted by DESN in Reading on February 6th, will be open to both members and non-members. We will examine emerging trends in semiconductor system design, with a particular focus on how AI/ML is being used in product design and the design… Read More
Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device”. These can lead to more capacitors than necessary, taking up additional space in the layout and driving up cost of the final assembly. In addition, they can lead… Read More
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren’t just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components… Read More
The automotive sector is transitioning to software-defined vehicles, focusing on unified compute solutions for central processing, zonal architectures, in-cabin sensing, and digital cockpits. With AI/ML enhancing vehicle functionalities, cars are becoming akin to mobile devices, especially as we advance towards autonomous… Read More
