For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic… Read More
Are you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant… Read More
Create and leverage (model-based) System Engineering models to understand and influence decision impacts on sustainability for the whole system lifecycle.
Leverage Model-Based Systems Engineering (MBSE) for informed sustainability decisions
In today’s dynamic business landscape, sustainability is not just a trend … Read More
We’ll introduce the benefits of a model-based approach in automotive safety critical software development for ISO 26262. Learn about how the qualification of SCADE benefits your software certification. Sign up for this presentation and hands-on workshop.
TIME:
December 3, 2024
9:30 AM – 4:30 PM CET
Venue:
Virtual
We are holding a free virtual training course specifically tailored for automotive OEMs, suppliers, and semiconductor industry professionals. This course will equip you with a better understanding of the software solutions available to help you comply with ISO26262.
TIME:
November 28, 2024
9:30 AM – 4:30 PM CET
Venue:
Virtual
As AI adoption grows, distribution system complexity increases, making reliability efforts crucial.
Failures can be categorized and the current health monitoring schemes are closely tier to qualification methods. However, their high complexity causes lack of widespread solutions and market adoption.
Infineon’s… Read More
In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed:
With the EE Cockpit in Allegro X System Capture, electrical engineers can run analyses during the schematic design phase without needing complicated analysis setups or specialized models to get meaningful results. With in-design analysis, they can provide accurate constraints to the PCB designer and verify that these constraints… Read More
Join experts from Rambus and PUF-based security solutions provider ICTK to learn how Rambus Root of Trust and Secure Authentication solutions combined with ICTK’s PUF technology can provide a highly robust hardware foundation to protect data, devices, and cloud. Our session will provide an overview of ICTK and its PUF … Read More
This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab.
TIME:
November 19, 2024
10AM IST to 5PM IST
Venue:
Virtual
Ansys medini analyze is a model-based, integrated tool supporting safety analysis for safety-critical
