Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
For the first time ever, IEDM held a sustainability session at the 2023 conference. I was one of the authors who presented an invited paper, the following is a summary of my presentation.
From the United Nations [1]:
“Climate Change is the defining issue of our time, and we are at a defining moment.”
“Without drastic … Read More
Dan is joined by podcast producer and collaborator Mike Gianfagna for Semiconductor Insiders episode 200. Dan and Mike look over the past two years (and 200 podcasts) to develop a top ten list of changes and innovation in the semiconductor industry. There is a lot of back-story detail on each topic in this far-reaching discussion.… Read More
News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024
An industry news source, Trendforce, reports… Read More
In August 2022, U.S. President Biden signed into law the CHIPS and Science Act of 2022 to provide incentives for semiconductor manufacturing in the United States. In a case of creating the acronym first and then finding a name to fit, CHIPS stands for Creating Helpful Incentives to Produce Semiconductors. The act provides a total… Read More
I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More
My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
Dan is joined by Chris Morrison. Chris has 15 years’ experience of delivering innovative analog, digital, power management and audio solutions for international electronics. Currently he is the director of product marketing at Agile Analog, the analog IP innovators. Previously he has held engineering positions, including… Read More
As expected KLAC reported earnings at the … Read More
