ASML – Strong order start on long road to 2025 recovery – 24 flat vs 23 – EUV shines

ASML – Strong order start on long road to 2025 recovery – 24 flat vs 23 – EUV shines
by Robert Maire on 01-26-2024 at 6:00 am

ASML Cleanroom EUV Wafer Stage Training

– ASML orders more than triple sequentially- Utilization increases
– Management remains conservative with flat revenues 2024 vs 2023
– Recovery will be slow, targeting 2025- Long & weak cyclical bottom
– Litho orders are leading indicator of future wider recovery

Strong orders pave the way for
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2024 Semiconductor Cycle Outlook – The Shape of Things to Come – Where we Stand

2024 Semiconductor Cycle Outlook – The Shape of Things to Come – Where we Stand
by Robert Maire on 01-24-2024 at 6:00 am

Semiconductor Industry Outlook 2024
  • What kind of recovery do we expect, if any, after 2 down years?
  • What impact will China have on the recovery of mature market chips?
  • What will memory recovery look like? Will we return to stupid spend?
  • Stock selection ever more critical in tepid recovery
Chip stocks have rocketed but the industry itself, not so much, “Anticipation….is
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IEDM 2023 – Imec CFET

IEDM 2023 – Imec CFET
by Scotten Jones on 01-17-2024 at 6:00 am

29 1 Wed Horiguchi 3 final Page 04

At IEDM 2023, Naoto Horiguchi presented on CFETs and Middle of Line integration. I had a chance to speak with Naoto about this work and this write up is based on his presentation at IEDM and our follow up discussion. I always enjoy talking to Naoto, he is one of the leaders in logic technology development, explains the technology in … Read More


How Disruptive will Chiplets be for Intel and TSMC?

How Disruptive will Chiplets be for Intel and TSMC?
by Daniel Nenni on 01-15-2024 at 10:00 am

UCIe Consortium

Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More


IEDM 2023 – Modeling 300mm Wafer Fab Carbon Emissions

IEDM 2023 – Modeling 300mm Wafer Fab Carbon Emissions
by Scotten Jones on 01-09-2024 at 6:00 am

Figure 1

For the first time ever, IEDM held a sustainability session at the 2023 conference. I was one of the authors who presented an invited paper, the following is a summary of my presentation.

Call to Action

From the United Nations [1]:

“Climate Change is the defining issue of our time, and we are at a defining moment.”

“Without drastic … Read More


Podcast EP200: Dan and Mike’s Top Ten List For the Semiconductor Industry

Podcast EP200: Dan and Mike’s Top Ten List For the Semiconductor Industry
by Daniel Nenni on 12-29-2023 at 10:00 am

Dan is joined by podcast producer and collaborator Mike Gianfagna for Semiconductor Insiders episode 200. Dan and Mike look over the past two years (and 200 podcasts) to develop a top ten list of changes and innovation in the semiconductor industry. There is a lot of back-story detail on each topic in this far-reaching discussion.… Read More


Is Intel cornering the market in ASML High NA tools? Not repeating EUV mistake

Is Intel cornering the market in ASML High NA tools? Not repeating EUV mistake
by Robert Maire on 12-24-2023 at 9:00 am

High NA EUV
  • Reports suggest Intel will get 6 of 10 ASML High NA tools in 2024
  • Would give Intel a huge head start over TSMC & Samsung
  • A big gamble but a potentially huge pay off
  • Does this mean $4B in High NA tool sales for ASML in 2024?

News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024

An industry news source, Trendforce, reports… Read More


CHIPS Act and U.S. Fabs

CHIPS Act and U.S. Fabs
by Bill Jewell on 12-19-2023 at 10:00 am

Major Future US Fabs

In August 2022, U.S. President Biden signed into law the CHIPS and Science Act of 2022 to provide incentives for semiconductor manufacturing in the United States. In a case of creating the acronym first and then finding a name to fit, CHIPS stands for Creating Helpful Incentives to Produce Semiconductors. The act provides a total… Read More


IEDM: TSMC Ongoing Research on a CFET Process

IEDM: TSMC Ongoing Research on a CFET Process
by Paul McLellan on 12-18-2023 at 6:00 am

Screen Shot 2023 12 16 at 12.16.14 PM

I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More


An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards

An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
by Daniel Nenni on 12-14-2023 at 10:00 am

IMG DEF60C112922 1

My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More