– Business is about as good as it gets- $75B WFE in 2021?
– China remains strong at 32% despite SMIC lack of license
– NAND remains 48% of revs versus 31% foundry
– DRAM steady @ 14% – Service was record $1.3B
Strong results in a strong market
Lam reported revenues of $3.85B and EPS of $7.49 for the March… Read More
-The semiconductor industry is not to blame its the customers
-How do you fix something that’s not really broken?
-Long taken for granted, semi’s are sexy again
-Pawns in a Political Power Play?
Its not the chip makers that screwed up. It’s the customers that stressed the system beyond breaking
The semiconductor… Read More
TSMC recently announced plans to spend $100 billion dollars over three years on capital. For 2021 they announced $30B in total capital with 80% on advanced nodes (7nm and smaller), 10% on packaging and masks and 10% on “specialty”.
If we take a guess at the capital for each year, we can project something like $30B for 2021 (announced),… Read More
The main threat for the wide adoption of MRAM memories continues to be their lack of immunity to magnetic fields. MRAM magnetic immunity (MI) levels has seen significant research over the years and new data is continuously published from the main MRAM vendors.
This data, however, is rarely compared to magnetic field exposure scenarios… Read More
– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0
Intel not only wants to catch TSMC but beat them at their own … Read More
Intel made a big splash on March 23, 2021 by doubling down on manufacturing with the creation of Intel Foundry Services (IFS). The big announcement was supported by potential customers such as Qualcomm, Cisco, Ericsson, Google, Amazon, Microsoft, and IBM. With an accompanying $20B investment, the EDA and equipment industries,… Read More
In January I presented at the ISS conference a comparison of Intel’s, Samsung’s and TSMC’s leading edge offerings. You can read a write-up of my presentation here.
With the problems going on at Intel, that article generated a lot of interest in the investment community, and I have been holding a lot of calls with analysts who are trying… Read More
New Intel CEO Pat Gelsinger is not wasting any time in changing the course of the largest semiconductor company the world has ever seen. Today he announced the IDM 2.0 strategy which will better leverage Intel’s manufacturing abilities. There is a lot to talk about here but let’s focus on the new Intel Foundry Services because the… Read More
The term von Neumann bottleneck is used to denote the issue with the efficiency of the architecture that separates computational resources from data memory. The transfer of data from memory to the CPU contributes substantially to the latency, and dissipates a significant percentage of the overall energy associated with … Read More
At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.
DUV
Despite all the attention EUV is getting, most layers are still… Read More
