Open Silicon hosted a webinar today focusing on their High Bandwidth Memory (HBM) IP-subsystem product offering. Their IP-subsystem is based on the HBM2 standard and includes blocks for the memory controller, PHY and high-speed I/Os, all targeted to TSMC 16nm FF+ process. The IP-subsystem supports the full HBM2 standard with… Read More
Tag: tsmc cowos
High Bandwidth Memory ASIC SiPs for Advanced Products!
When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More
Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications
Calling all ASIC designers working on High-Bandwidth Memory (HBM) access architectures in high-performance computing (HPC), networking, deep learning, virtual reality, gaming, cloud computing and data center applications. You won’t want to miss this upcoming webinar focused on system integration aspects of a HBM2 ASIC… Read More
TSMC Leads Again with 3-D Packaging!
Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.
CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More
Bridging Design Environments for Advanced Multi-Die Package Verification
This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More
TSMC 2016 Technology Symposium and Apple SoCs!
It is that time again, time for the originators of the pure-play foundry business to update their top customers and partners on the latest process technology developments and schedules. More specifically, all of the TSMC FinFET processes (16nm, 10nm, 7nm, and beyond), TSMC IP portfolio (CMOS image sensor, Embedded Flash, Power… Read More