Coupled Electro-thermal Analysis Essential for PowerMOS Design

Coupled Electro-thermal Analysis Essential for PowerMOS Design
by Tom Simon on 11-08-2018 at 12:00 pm

Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More


A Key Partner in the Semiconductor Ecosystem

A Key Partner in the Semiconductor Ecosystem
by Pawan Fangaria on 05-19-2015 at 5:00 pm

Often we hear about isolated instances of excellence from various companies in the semiconductor industry which contribute significantly in building the overall ecosystem. While the individual excellence is essential, it’s rather more important how that excellence is utilized in a larger way by the industry to create a ‘value… Read More


SoCs in New Context Look beyond PPA

SoCs in New Context Look beyond PPA
by Pawan Fangaria on 03-21-2015 at 7:00 am

If we look back in the last century, performance and area were two main criteria for semiconductor chip design. All design tools and flows were concentrated towards optimizing those two aspects. As a result, density of chips started increasing and power became a critical factor. Now, Power, Performance and Area (PPA) are looked… Read More


Temperature Monitoring IP to Revamp SoCs

Temperature Monitoring IP to Revamp SoCs
by Pawan Fangaria on 02-04-2015 at 3:00 pm

With increasing density and functionality of chips at extremely thin silicon and metal layers, temperature has become critical. The temperature situation can become worse with wireless enabled 24/7 power-on devices. In such a scenario, a device must manage its thermal profile dynamically to keep the temperature within tolerable… Read More