I was invited to give a plenary address at the SISPAD conference in September 2021. For anyone not familiar with SISPAD it is a premiere TCAD conference. This year for the first time SISPAD wanted to address cost and my talk was “Cost Simulations to Enable PPAC Aware Technology Development”.
For many years the standard in technology… Read More
On Sep 20th, Synopsys announced an expansion of its DesignWare® ARC® Processor IP portfolio with new 128-bit ARC VPX2 and 256-bit ARC VPX3 DSP Processors targeting low-power embedded SoCs. In 2019, the company had launched a 512-bit ARC VPX5 DSP processor for high-performance signal processing SoCs. Due to the length, format… Read More
The adoption of 3DIC architectures, while not new, is enjoying a surge in popularity as product developers look to their inherent advantages in performance, cost, and the ability to combine heterogeneous technologies and nodes into a single package. As designers struggle to find ways to scale with complexity and density limitations… Read More
Designing an ASIC is little bit like trying to hit the bullseye, in the dark. I’ve spent several decades in the ASIC business I can tell you this is what it’s like from first-hand experience. When the design team sets out to build a custom chip to make their product better, faster, more robust, etc. (pick the words you like), there is … Read More
If I ask the question, “What has grown 4,000x over the last twenty-five years?”, most people will start throwing names of some stocks. Although various stock markets have had crazy run ups and yes, there is a stock that has grown 2,500x over that period of time, the answer to the 4,000x question is not a stock. What if I modify the question… Read More
Over the last decade or so, the automotive industry has been rapidly adopting and deploying innovative and revolutionary technologies in automobiles. One such revolution is the autonomous vehicle technology. While this technology is not fully mature yet, some components of this technology are. Many late model automobiles… Read More
In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More
The move to true 3D IC, monolithic 3D SOC and 3D heterogeneous integration may require one of the most major design tool architecture overhauls since IC design tools were first developed. While we have been taking steps toward 3DIC with 2.5D designs with interposers, HBM, etc., the fundamental tools and flows remain intact in many… Read More
Automotive segment is a market that has historically been supported by a few select suppliers within the semiconductor ecosystem. Over the last decade, this market has transitioned from just being about reliability, performance, fuel efficiency, etc., to placing equal importance to user experience. This user experience … Read More
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
