RISC-V Summit China 2026by Admin on 09-02-2026 at 11:10 pm
RISC-V Summit China 2026 will take place from October 18 to 20, 2026 at the Shenzhen Convention & Exhibition Center (Futian). As an important annual gathering for global open hardware and the RISC-V ecosystem, this Summit will bring together leading scientists, core architects, industry executives, technology developers,… Read More
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts… Read More
I was at the Cadence front-end summit this week; good conference with lots of interesting information. I’ll start with a panel on optimizing power for wearables. Panelists were Anthony Hill from TI, Fred Jen from Qualcomm, Leah Clark from Broadcom and Jay Roy from Cadence. Panels are generally most entertaining when the panelists… Read More
On October 10, I attended another Cadence Summit, this one titled the Cadence Mixed-Signal Technology Summit. Recently, I had written about the Cadence Silicon Verification Summit. The verification event was the first of its kind, and I thought it had terrific content. Being more of a digital guy myself, I was unaware that Cadence… Read More
