Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
by Admin on 06-01-2021 at 12:00 am

Overview

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Takeaways:

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