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From DIP to Advanced, semiconductor packaging has become strategic
For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek
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Getting a printed circuit board from design and into production presents one of the biggest challenges in successfully launching a product. The designer’s job is to anticipate issues that can adversely affect PCB fabrication and assembly. Design rules and component libraries go part of the way, but there is a thicket of things… Read More
As SoCs have got more complex, and with a larger and larger software content, it is no longer good enough to just monitor how the design behaves using simulation and then completely forget about it once the design is complete. What is required is the capability to monitor the design in real time (in silicon or FPGA) to see how it is behaving.… Read More