As 2D device scaling becomes impractical, 3D-IC integration is emerging as the natural evolution of semiconductor technology; it is the convergence of performance, power and functionality. Some of the benefits of 3D-IC, such as increasing complexity, improved performance, reducing power consumption and decreasing footprints,… Read More
If you are in Asia then the Synopsys user group SNUG is coming up, soon in Japan and next month in China. Actually if you are in India I’m afraid you already missed it last month, just after DAC.
SNUG Japan is on 12th July in a couple of days time from 10am until 8pm in Tokyo.
In China there are 3 between August 14th and 21st
In Mike Muller’s keynote at DAC he wanted to make formal approaches an integral part of writing RTL. After all, formal captures design intent and then, at least much of the time, can verify whether the RTL written actually matches that intent. Today, formal is not used that way and is typically something served “on the side” by specialist… Read More
One of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is difficult, if… Read More
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
When I first came to the US, one project that we had going on at VLSI Technology was an ASIC design being done by a French company called Telic. The chip would go into something called “Minitel” which the France Telecom (actually still the PTT since post and telecomunications had not yet been separated) planned to supply… Read More
In my circuit design past I did DRAM work at Intel, so I was interested in learning more about Novocell Semiconductor and their design of One Time Programmable (OTP) IP. Walter Novosell is the President/CTO of Novocell and talked with me by phone on Thursday.… Read More
For those of you who didn’t get to DAC you can catch up on low power issues with Apache’s series of low-power webinars taking place late in July. All webinars are at 11am Pacific Time. Full details and registration on the Apache website here.… Read More
I wasn’t going to write about the cell phone business again for some time. After all, this is a site about semiconductor and EDA primarily. But the cell-phone business in all its facets is a huge semiconductor consumer and continues to grow fast (despite my morbid focus on those companies that do anything but).
But Research… Read More
Everyone knows Moore’s Law: the number of transistors on a chip doubles every couple of years. We can take the process roadmap for Intel, TSMC or GF and pretty much see what the densities we will get will be when 20/22nm, 14nm and 10nm arrive. Yes the numbers are on track.
But I have always pointed out that this is not what drives… Read More
