One of the truisms of today’s disaggregated semiconductor design and manufacturing model is counter-intuitive to the do-it-yourself focus that is at the heart of every engineer. And yet, time and time again, success rewards those who understand that with today’s ever increasing complexity, it is difficult, if… Read More
Tag: semiconductor
Cadence at Semicon West Next Week: 2.5D and 3D
Next week it is Semicon West in the Moscone Center from Tuesday to Thursday, July 10-12th. Cadence will be on a panel session during a session entitled The 2.5D and 3D packaging landscape for 2015 and beyond. This starts with 3 short keynotes:
- 1.10pm to 1.25pm: Dr John Xie of Altera on Interposer integration through chip on wafer on
Minitel Shuts Down
When I first came to the US, one project that we had going on at VLSI Technology was an ASIC design being done by a French company called Telic. The chip would go into something called “Minitel” which the France Telecom (actually still the PTT since post and telecomunications had not yet been separated) planned to supply… Read More
IC Design at Novocell Semiconductor
In my circuit design past I did DRAM work at Intel, so I was interested in learning more about Novocell Semiconductor and their design of One Time Programmable (OTP) IP. Walter Novosell is the President/CTO of Novocell and talked with me by phone on Thursday.… Read More
Apache Low Power Webinars
For those of you who didn’t get to DAC you can catch up on low power issues with Apache’s series of low-power webinars taking place late in July. All webinars are at 11am Pacific Time. Full details and registration on the Apache website here.… Read More
Crushed Blackberry
I wasn’t going to write about the cell phone business again for some time. After all, this is a site about semiconductor and EDA primarily. But the cell-phone business in all its facets is a huge semiconductor consumer and continues to grow fast (despite my morbid focus on those companies that do anything but).
But Research… Read More
The Scariest Graph I’ve Seen Recently
Everyone knows Moore’s Law: the number of transistors on a chip doubles every couple of years. We can take the process roadmap for Intel, TSMC or GF and pretty much see what the densities we will get will be when 20/22nm, 14nm and 10nm arrive. Yes the numbers are on track.
But I have always pointed out that this is not what drives… Read More
Chip Synthesis at DAC
I visited Oasys Design Systems and talked to Craig Robbins, their VP sales. For the first time this year, Oasys has a theater presentations and demos of RealTime Designer which are open to anyone attending the show. In previous years, they have had suite demos for appropriately qualified potential customers but outside they have… Read More
TSMC Threater Presentation: Lorentz Solution!
Lorentz Solution presented at TSMC’s DAC 2012 Open Innovation Platform Theater. The presenter was Lorentz Sales Director, Tom Simon. He presented what Lorentz calls its Electromagnetic Design and Analysis Platform. One of the main points of the talk was the cooperative work that Lorentz does with TSMC.
Microsoft Messes Up Mobile Even More…and Already Went Thermonuclear
Ed wrote recently about Microsoft going thermonuclear. I think that they already did. Ed wrote about Microsoft’s tablet announcement. The second announcement is a sort of follow up to my blog on what will happen to Nokia.
Two big announcements, the first one is that Microsoft is going to produce its own tablet computers (MiPads … Read More