efabless: Think GitHub for ICs and IP

efabless: Think GitHub for ICs and IP
by Daniel Nenni on 08-02-2016 at 4:00 pm

Image RemovedFor those of you who don’t know, GitHub is the crowdsourcing version of the defacto industry standard GIT source code management software. Currently, more than 14 million people have deposited more than 35 million software projects (mostly open-source) on GitHub making it the largest host of source code in the world.… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More


Process Development, CAD and Circuit Design

Process Development, CAD and Circuit Design
by Daniel Payne on 04-29-2016 at 7:00 am

Working at Intel as a circuit designer I clearly remember how there were three distinct groups: Process Development, CAD and Circuit Design. Each of the groups sat in a different part of the building in Aloha Oregon, we had different job titles, different degrees, spoke with different acronyms and yet we all had to work together … Read More


FinFET For Next-Gen Mobile and High-Performance Computing!

FinFET For Next-Gen Mobile and High-Performance Computing!
by Daniel Nenni on 02-22-2016 at 7:00 am

Evolving opportunities call for new and improved solutions to handle data, bandwidth and power. Moving forward, what will be the high-growth applications that drive product and technology innovation? The CAGRs for smartphone and data center continue to be very strong and healthy. … Read More


Pathfinding to an Optimal Chip/Package/Board Implementation

Pathfinding to an Optimal Chip/Package/Board Implementation
by Tom Dillinger on 02-04-2016 at 4:00 pm

A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More


The Death of Moore’s Law

The Death of Moore’s Law
by Michael Barger on 01-22-2016 at 12:00 pm

Image RemovedFor the last several years, people have predicted the end of Moore’s Law. The reasoning is that there is a limit at which one can’t shrink transistors any further. A reoccurring comment has been “You can’t divide an atom.” I had assumed that its demise would be at the hands of a new paradigm like quantum computing. Now,… Read More


IEDM 2015 Blogs – Part 1 – Overview

IEDM 2015 Blogs – Part 1 – Overview
by Scotten Jones on 12-11-2015 at 7:00 am

Image RemovedThe International Electron Devices Meeting (IEDM) is one of, if not the premier conference for semiconductor process technology. The 2015 meeting just finished up on Wednesday, December 9th.

This year’s meeting was held from Saturday, December 5[SUP]th[/SUP] through Wednesday, December 9[SUP]th[/SUP] in … Read More


Moore’s law limitations and gravitational collapse at lower process nodes

Moore’s law limitations and gravitational collapse at lower process nodes
by Vaibbhav Taraate on 10-05-2015 at 4:00 pm

Image RemovedAs stated in my previous article, about the complexity of the SOC with billions of transistors. It is essential to consider the real practical scenario for the two dimensional verses three dimensional structure of the chip. Although the new technological changes and evolution for the shrinking process node can … Read More


M&A Frenzy in the Chip Industry, the Growth of GaN, and Why It Matters

M&A Frenzy in the Chip Industry, the Growth of GaN, and Why It Matters
by Alex Lidow on 09-07-2015 at 12:00 pm

If expanding industries typically indicate vibrancy, a race to acquire and consolidate is generally reflective of the opposite – a period of slowed growth in mature, once high-flying categories. And while many industries experience a period of stardom, followed by a sharp and steady decline, we should be extremely worried whenRead More


Extending EUV Lithography

Extending EUV Lithography
by Scotten Jones on 06-12-2015 at 1:00 pm

Image RemovedI have previously written about SPIE day 1 and 2 so I want to wrap up my coverage with some impressions from days 3 and 4. My single biggest take away from the conference is that EUV has made tremendous progress in the last 12 months. Last year the mood of the conference was in my opinion pessimistic with respect to EUV, this… Read More