Is there anything in VLSI layout other than “pushing polygons”? (6)

Is there anything in VLSI layout other than “pushing polygons”? (6)
by Dan Clein on 02-05-2018 at 12:00 pm

I am very sorry but I have to break the flow of sharing initiatives, to reiterate the reason for these articles and maybe amplify the message these articles should promote.

I got a few inquiries from LinkedIn connections, who read the previous articles, with a very interesting point of view. This proves that after 5 articles some … Read More


Sagantec’s nmigrate adopted and deployed for 14nm technology

Sagantec’s nmigrate adopted and deployed for 14nm technology
by Daniel Nenni on 05-29-2013 at 3:00 pm

Major semiconductor company successfully migrated 28nm libraries to 14nm FinFET

Santa Clara, California – May 29, 2013 – Sagantec announced that its nmigrate tool was adopted by a major semiconductor company for the development of standard cell libraries at 14nm and 16nm FinFET technologies.
This customer already… Read More


A Brief History of Semiconductor IP

A Brief History of Semiconductor IP
by Daniel Nenni on 08-12-2012 at 7:00 pm

It is important to note that the System On Chip (SoC) revolution that is currently driving mobile electronics has one very important enabling technology and that is Semiconductor Intellectual Property. Where would we be without the $6B+ commercial semiconductor IP market segment? Computers and phones would still be on our desks… Read More


Layout Migration and DRC Correction at DAC 2012

Layout Migration and DRC Correction at DAC 2012
by Daniel Nenni on 05-20-2012 at 5:00 pm

In the world of sub-40nm IC design, as feature size decreases with each new process node, it becomes increasingly difficult to migrate a layout to a new process technology. Too many factors impact manufacturability and yield. At each new process node, to make sure that a given layout is manufacturable and yields well, it is subject… Read More


Sagantec Update: More EDA Consolidation!

Sagantec Update: More EDA Consolidation!
by Daniel Nenni on 05-08-2012 at 7:00 pm

Adding sophisticated 2D dynamic compaction technology to address 20nm and 14nm challenges. Santa Clara, California – May 3 ,2012 – Sagantec today announced that it has acquired Dutch startup NP-Komplete Technologies BV (Eindhoven, The Netherlands) for its physical design compaction and migration solutions based on a sophisticatedRead More


Sagantec 2 Migrate iPad2s @ #48DAC

Sagantec 2 Migrate iPad2s @ #48DAC
by admin on 05-30-2011 at 2:53 pm

Sagantec is the leading EDA provider of process migration solutions for custom IC design. Sagantec’s EDA solutions enable IC designers to leverage their investment in existing physical design IP and accomplish dramatic time and effort savings in the implementation of custom, analog, mixed-signal and memory circuits… Read More


65nm to 45nm SerDes IP Migration Success Story

65nm to 45nm SerDes IP Migration Success Story
by Daniel Nenni on 05-25-2011 at 3:43 pm

The problem:To move a single lane variable data rate SerDes (serializer-deserializer) from a 65nm process to a 45nm process, achieving a maximum performance of up to 10.3 Gbps. This is a large piece of complex mixed-signal IP with handcrafted analog circuits. Circuit performance and robustness are critical and must be maintainedRead More


Adjusting Custom IP to Process Changes

Adjusting Custom IP to Process Changes
by Daniel Nenni on 05-16-2011 at 1:57 pm

A High-Definition Multimedia Interface (HDMI) IP core was being implemented in an advanced process technology. This fairly large and complex analog mixed-signal (AMS) IP comprising over 130K devices was close to being finalized and shipped to the customer. But many design rules at the foundry were unexpectedly changed fromRead More


40nm to 28nm Migration Success Story

40nm to 28nm Migration Success Story
by Paul McLellan on 05-08-2011 at 4:00 pm

The problem:To move dual-port SRAM library and macros from a 40nm process to a 28nm process. In addition to all the changes between two different foundry processes, the 28nm rules are disruptive and incompatible with the previous rules. The memory corecells (foundry-specific) would also need to be completely replaced.

Current… Read More


Semiconductor Wafer Allocation and Design Migration

Semiconductor Wafer Allocation and Design Migration
by Daniel Nenni on 08-12-2009 at 8:00 pm

In the name of blogging and increased transparency lets talk about wafer allocation, because it’s coming, believe it. There is already a significant delta between wafer demand and manufacture due to record low inventory levels and the exploding semiconductor demand in China. Both TSMC and UMC posted good July sales numbers: … Read More