TSMC Theater Presentation: Apache

TSMC Theater Presentation: Apache
by Paul McLellan on 06-25-2012 at 12:13 am

At the TSMC Theater Apache (don’t forget, now a subsidary of Ansys) talked about Emerging Challenges for Power, Signal and Reliability Verification on 3D-IC and Silicon Interposer Designs. The more I see about the costs and challenges of 20/22nm and below, the more I think that these 3D and 2.5D approaches are going to be … Read More


RedHawk: On to the Future

RedHawk: On to the Future
by Paul McLellan on 05-01-2012 at 6:00 am

For many, maybe most, big designs, Apache’s RedHawk is the signoff tool for analyzing issues around power: electromigration, power supply droop, noise, transients and so on. But the latest designs have some issues: they are enormous (so you can’t just analyze them naively any more than you can run a Spice simulation… Read More


Webinar: IP integration methodology

Webinar: IP integration methodology
by Paul McLellan on 07-17-2011 at 12:24 pm

The next Apache webinar is coming up on 21st July at 11am Pacific time on “IP integration methodology”.

This webinar will be conducted by Arvind Shanmugavel, Director Applications Engineering at Apache Design Solutions. Mr. Shanmugavel has been with Apache since 2007, supporting the RedHawk and Totem product … Read More