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Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging. At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of future potential… Read More
On the off-chance you missed my previous pieces on this topic, at these dimensions conventional margin-based analysis becomes unreasonably pessimistic and it is necessary to analyze multiple dimensions together. People who build aircraft engines, turbines and other complex systems have known this for quite a long time. You… Read More
