Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


CEO Interview: Maxim Ershov of Diakopto

CEO Interview: Maxim Ershov of Diakopto
by Daniel Nenni on 09-24-2021 at 4:00 am

Maxim Ershov

Maxim is a scientist, engineer, and entrepreneur. His expertise is in physics, mathematics, semiconductor devices, and EDA. Prior to co-founding Diakopto, Maxim worked at Apple’s SEG (Silicon Engineering Group), where he was responsible for parasitic extraction. Before Apple, he was CTO of Silicon Frontline Technology,… Read More


Sometimes a Solver is a Suitable Solution

Sometimes a Solver is a Suitable Solution
by Tom Simon on 04-17-2018 at 7:00 am

Traditional, rule based, RC extractors rely on a substantial base of assumptions, which are increasingly proving unreliable. Having accurate RC extraction results for parasitic R’s and C’s is extremely important for ensuring proper circuit operation and for optimizing performance and power. Advanced process nodes are making… Read More


Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube

Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube
by Daniel Payne on 07-10-2013 at 1:21 pm

EDA companies produce a wealth of content to help IC engineers get the best out of their tools through several means:

  • Reference Manuals
  • User Guides
  • Tutorials
  • Workshops
  • Seminars
  • Training Classes
  • Phone Support
  • AE visits
Read More

Advanced Memory Cell Characterization with Calibre xACT 3D

Advanced Memory Cell Characterization with Calibre xACT 3D
by SStalnaker on 01-12-2012 at 7:18 pm

Advanced process technologies for manufacturing computer chips enable more functionality, higher performance, and low power through smaller sizes. Memory bits on a chip are predicted to double every two years to keep up with the demand for increased performance.

To meet these new requirements for performance and power, memory… Read More


Reducing the Need for Guardbanding Flash ADC Designs

Reducing the Need for Guardbanding Flash ADC Designs
by SStalnaker on 11-22-2011 at 7:59 pm

Flash analog-to-digital converters (ADCs) are commonly used in high-frequency applications such as satellite communications, sampling oscilloscopes, and radar detection. Flash ADC is preferred over other ADC architectures because it is extremely fast and quite simple. However, flash ADC typically requires twice as many… Read More


Parasitic Extraction—My Head Hurts!

Parasitic Extraction—My Head Hurts!
by glforte on 10-27-2011 at 10:08 am

By Carey Robertson, Director of Product Marketing, Mentor Graphics

IC physical verification requires a number of different types of checking, the most familiar being design rule checking (DRC), layout vs. schematic (LVS) checking, and parasitic extraction combined with circuit simulation. Fundamentally, it does not matter… Read More