Podcast EP19: The Emergence of 2.5D and Chiplets in AI-Based Applications

Podcast EP19: The Emergence of 2.5D and Chiplets in AI-Based Applications
by Daniel Nenni on 05-07-2021 at 10:00 am

Dan and Mike are joined by Sudhir Mallya, vice president of corporate and product marketing at OpenFive. We explore 2.5D design and the role chiplets play. Current technical and business challenges are discussed as well as an assessment of how the chiplet market will develop and what impact it will have.

The views, thoughts, and

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Enabling Edge AI Vision with RISC-V and a Silicon Platform

Enabling Edge AI Vision with RISC-V and a Silicon Platform
by Tom Simon on 03-15-2021 at 10:00 am

AI Chipset Market

AI vision processing moving to the edge is an undeniable industry trend. OpenFive, the custom silicon business unit of SiFive, discusses this trend with compelling facts in their recent paper titled “Enabling AI Vision at the Edge.” AI vision is being deployed in many applications, such as autonomous vehicles, smart cities, … Read More


CEO Interview: Dr. Shafy Eltoukhy of OpenFive 

CEO Interview: Dr. Shafy Eltoukhy of OpenFive 
by Daniel Nenni on 03-05-2021 at 6:00 am

Shafy Eltoukhy

Dr. Shafy Eltoukhy has over 35 years of experience in the semiconductor industry. He served as VP and BU manager of the Analog Mixed Signal Group at Microsemi. He was the VP of Operations and Technology Development at Open-Silicon. He was the VP of Technology at Lightspeed Semiconductor where he joined the founding team that invented… Read More


Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive

Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive
by Mike Gianfagna on 12-21-2020 at 10:00 am

Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive

Embedded FPGA use is on the rise. The programmability offered by this kind of IP finds many applications in complex SoCs. There was a recent announcement that OpenFive had licensed Flex Logix’s eFPGA to develop a low power communications SoC. The part required a large eFPGA. The news was reported on SemiWiki here. This announcement… Read More


WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC

WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC
by Daniel Nenni on 10-22-2020 at 9:00 am

Webinar Overview

With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D… Read More