Chiplets at the Design Automation Conference with OpenFive

Chiplets at the Design Automation Conference with OpenFive
by Daniel Nenni on 08-02-2022 at 10:00 am

OpenFive Chiplet 59DAC

SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets at DAC#59 was OpenFive, a 17+ year spec-to-silicon… Read More


Alphawave IP and the Evolution of the ASIC Business

Alphawave IP and the Evolution of the ASIC Business
by Daniel Nenni on 03-21-2022 at 6:00 am

Alphawave IP OpenFive

Alphawave IP has agreed to acquire OpenFive, a SiFive business unit (formerly Open-Silicon) for $210m in cash. Having spent many years in the ASIC business which included working with Open-Silicon, Alphawave, and OpenFive here is my perspective on the acquisition:

This acquisition accomplishes two things: First it trims down… Read More


A 2021 Summary of OpenFive

A 2021 Summary of OpenFive
by Kalar Rajendiran on 02-01-2022 at 10:00 am

Key Features of the Edge AI Vision Platform

Building a better mousetrap plays a key role in achieving market success in any industry. Of course, building one requires differentiating the product from the others already in the market. A differentiated product can even lead to creating demand for new products in adjacent markets. All of this is great but how do you implement… Read More


Podcast EP19: The Emergence of 2.5D and Chiplets in AI-Based Applications

Podcast EP19: The Emergence of 2.5D and Chiplets in AI-Based Applications
by Daniel Nenni on 05-07-2021 at 10:00 am

Dan and Mike are joined by Sudhir Mallya, vice president of corporate and product marketing at OpenFive. We explore 2.5D design and the role chiplets play. Current technical and business challenges are discussed as well as an assessment of how the chiplet market will develop and what impact it will have.

The views, thoughts, and

Read More

Enabling Edge AI Vision with RISC-V and a Silicon Platform

Enabling Edge AI Vision with RISC-V and a Silicon Platform
by Tom Simon on 03-15-2021 at 10:00 am

AI Chipset Market

AI vision processing moving to the edge is an undeniable industry trend. OpenFive, the custom silicon business unit of SiFive, discusses this trend with compelling facts in their recent paper titled “Enabling AI Vision at the Edge.” AI vision is being deployed in many applications, such as autonomous vehicles, smart cities, … Read More


CEO Interview: Dr. Shafy Eltoukhy of OpenFive 

CEO Interview: Dr. Shafy Eltoukhy of OpenFive 
by Daniel Nenni on 03-05-2021 at 6:00 am

Shafy Eltoukhy

Dr. Shafy Eltoukhy has over 35 years of experience in the semiconductor industry. He served as VP and BU manager of the Analog Mixed Signal Group at Microsemi. He was the VP of Operations and Technology Development at Open-Silicon. He was the VP of Technology at Lightspeed Semiconductor where he joined the founding team that invented… Read More


Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive

Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive
by Mike Gianfagna on 12-21-2020 at 10:00 am

Flex Logix Expands Its eFPGA Footprint with a Low Power Comms Design Win from OpenFive

Embedded FPGA use is on the rise. The programmability offered by this kind of IP finds many applications in complex SoCs. There was a recent announcement that OpenFive had licensed Flex Logix’s eFPGA to develop a low power communications SoC. The part required a large eFPGA. The news was reported on SemiWiki here. This announcement… Read More


WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC

WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC
by Daniel Nenni on 10-22-2020 at 9:00 am

Webinar Overview

With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D… Read More