Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between… Read More
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability… Read More
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF… Read More
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate… Read More
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand… Read More
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability… Read More
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand… Read More
User2User Europe 2025by Admin on 12-17-2024 at 11:48 am
Join us in Munich where peer-delivered technical sessions will be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals.
Munich, Germany | May 13, 2025
Registration opens Feb. 10, 2025.
About User2User
The User2User conference is your… Read More
In the late 1990s I was the VP Engineering at Ambit Design Systems. We had a synthesis product (called BuildGates, nobody ever forgot the name). Both our own engineers and our customers wanted to be able to take a look at the gate-level netlist that was generated from their RTL. We used a product from a company called Concept Engineering… Read More
