Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems
by Bernard Murphy on 02-08-2018 at 7:00 am

In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More


Thermal Modeling for ADAS goes MultiPhysics

Thermal Modeling for ADAS goes MultiPhysics
by Bernard Murphy on 01-18-2018 at 7:00 am

In electronic system design, we have grown comfortable with the idea that different regimes of analysis, such as the chip, the package and the system, or electrical, thermal and stress are more or less independent – what starts in one regime stays in that regime, give or take some margin information passed onto other regimes. And… Read More


Why Ansys bought CLKDA

Why Ansys bought CLKDA
by Bernard Murphy on 07-18-2017 at 7:00 am

Skipping over debates about what exactly changed hands in this transaction, what interests me is the technical motivation since I’m familiar with solutions at both companies. Of course, I can construct my own high-level rationalization, but I wanted to hear from the insiders, so I pestered Vic Kulkarni (VP and Chief Strategist)… Read More


LSI’s Way of Faster & Reliable Electronic System Design

LSI’s Way of Faster & Reliable Electronic System Design
by Pawan Fangaria on 05-05-2014 at 9:30 am

LSI Corporationstarted in 1980s and I had several encounters with it during my jobs in 1990s; not to forget the LSI chips I used to see in desktops and other electronic systems, and I’m happy to see LSI continuing today with more vigour having leadership position in storage and networking space. It provides highly reliable, high … Read More