Silicon Measurement Data Gives Insights to Using Metal Fill With Inductors

Silicon Measurement Data Gives Insights to Using Metal Fill With Inductors
by Tom Simon on 08-27-2014 at 4:00 pm

Metal fill requirements for inductors are now a fact of life. Fill has long been seen as detrimental to device performance due to parasitic capacitance. The necessity of fill arises from the need to ensure planarization of dielectric layers by using chemical mechanical polishing. Without adequate fill, areas of the chip can suffer… Read More


Distributed RLCK Models for Transmission Lines in High Speed Applications

Distributed RLCK Models for Transmission Lines in High Speed Applications
by Tom Simon on 08-23-2014 at 10:00 am

Design engineers frequently struggle with transmission line design and modeling. We can define a length of interconnect that contains more than 1/100th of a wavelength as a transmission line. This seems to be the breakpoint where distributed effects to start to become significant. To improve circuit performance these long … Read More


Effect of Inductance on Interconnect

Effect of Inductance on Interconnect
by Daniel Nenni on 03-02-2014 at 11:00 am

In previous design generations interconnect could safely be modeled by extraction using just R and C values. Parasitics in interconnect are important because they can affect the operating frequency or phase error in circuits like VCO’s. The need to model parasitics properly in wires is just as applicable in PA’s, LNA’s and for… Read More


EM Solver and Visualization Essential for Device Design

EM Solver and Visualization Essential for Device Design
by Daniel Nenni on 10-22-2013 at 5:00 pm

In many designs, an on chip inductor is created as though it were simply a device with an L and a Q value. Of course this view would seem to make life simpler for designers and the tools they use. But in reality even a simple inductor is really a complex compound structure with many electromagnetic elements interacting in complex ways.… Read More


Tackling Circuit Level EM Analysis for RF, MMW and High Speed Analog Designs

Tackling Circuit Level EM Analysis for RF, MMW and High Speed Analog Designs
by Daniel Nenni on 03-31-2013 at 8:07 pm

Accuracy, ease of use and performance have always been paramount for electromagnetic analysis software. Historically, it has been hard to find all three of these qualities in one tool. The result is that many high speed analog and RF designers resort to using multiple, often overlapping, tools to get the job done.

Lorentz Solution… Read More


TSMC Threater Presentation: Lorentz Solution!

TSMC Threater Presentation: Lorentz Solution!
by Daniel Nenni on 06-26-2012 at 8:30 pm

Image RemovedLorentz Solution presented at TSMC’s DAC 2012 Open Innovation Platform Theater. The presenter was Lorentz Sales Director, Tom Simon. He presented what Lorentz calls its Electromagnetic Design and Analysis Platform. One of the main points of the talk was the cooperative work that Lorentz does with TSMC.

TSMC and… Read More