Advanced IC technologies, 5nm and 7nm FinFET design and stacked packaging, are enabling massive levels of integration of super-fast circuits. These in turn enable much of the exciting new technology we hear so much about: mobile gaming and ultra-high definition mobile video through enhanced mobile broadband in 5G, which requires… Read More
Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More
The PathFinder webinar will be at 11am Pacific time on Thursday 4th August. It will be conducted by Karthik Srinivasan, Senior Applications Engineer at Apache Design Solutions. Mr. Srinivasan has over four years of experience in the EDA industry, focusing on die, system, and cross-domain analysis. His professional interests… Read More
